JPH0217464A - Testing apparatus of printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] A printed circuit board testing device configured to perform a test using a measuring instrument by bringing probes arranged on a grid-like board into contact with predetermined pads of a printed circuit board under test. The purpose of this method is to reduce costs by eliminating the need to prepare various individual boards depending on the type of printed circuit board under test. The push-up pin is provided with a support member made of a shape-memory alloy that restores its original shape, and also includes a heater that heats the support member to a predetermined temperature and a selection circuit that selectively heats the heater.

[Industrial application field]

The present invention relates to a printed circuit board testing device configured to perform a test using a measuring device by bringing probes arranged on a grid board into contact with predetermined pads of a printed circuit board to be tested.

In recent years, electronic components such as semiconductor elements mounted on printed circuit boards used in electronic devices have become smaller.

With the advent of high-density packaging, these electronic components have become SMDs (surface mounting devices).

Therefore, such printed circuit boards are tested by connecting a measuring device to a predetermined pad on which electronic components are mounted so that a sufficient check can be carried out after mounting electronic components during the manufacturing process. This is an attempt to improve the quality of printed circuit boards.

Further, since such printed circuit boards can be configured in a wide variety of ways by mounting electronic components, it is necessary to consider the connection of measuring instruments depending on the type of each printed circuit board.

Therefore, when testing such printed circuit boards, it is desired that measuring instruments be easily connected to a wide variety of printed circuit boards in order to improve the efficiency of the test.

(Prior art) Conventionally, the configuration was as shown in the conventional explanatory diagram in Fig. 4. In Fig. 4, (a) is a configuration diagram, (b) is a side view of the main part, (
C) is a sectional view of main parts.

As shown in FIG. 4(a), the printed circuit board 6 to be tested is placed on the top plate 13 that is raised and lowered by the guide wall 12 provided on the grid board 1 on which the probes 2 are arranged. The set individual boards 4 on which the push-up pins 22 are arranged are raised and lowered by the guide 19,
The push-up pin 22 is configured to cause a predetermined probe 2 to protrude.

A spring 14 is provided between the top plate 13 and the grid board 1, and the top plate 13 is raised and lowered by a vacuum (not shown) between the top plate 13 and the grid board 1. The air 20 is sucked and the spring 14 is compressed to lower the air 20, and then the suction is stopped and the uppermost plate 13 and the lattice board 1 are lowered.
By taking in air 20 between them, the spring force of the spring 14 raises it to its original position.

Therefore, the uppermost plate 13 is lowered and the individual board 4 is raised, so that the push-up pin 22 is lowered as shown in (b).
Accordingly, a predetermined probe 2 is protruded from the through hole 13A of the uppermost plate 13, and the tip portion 2A is brought into contact with the pad 6A of the printed circuit board 6 to be tested.

Further, as the individual board 4 descends and the top plate 13 rises, the protrusion of the probe 2 is retracted and returned to its original position.

Furthermore, depending on the arrangement 15, the push-up pin 22 may have a connector 23 (
01, 02), and the interface board 17
By inserting the connectors 16 (CI, C2) connected to the terminals 1B (El to E4) arranged by the wiring 15 into the connectors 23 (01, 02), each push-up pin 22 is (El to E4) are connected to the measuring device 10.

Therefore, a predetermined probe 2 is made to protrude using the push-up pin 22, an electrical signal is measured by the measuring device IO, and after the measurement, the protrusion of the probe 2 is retracted.

Further, as shown in (c), such a probe 2 is formed by providing a distal end portion 2A that is slidably supported on a boulder 2B in which a spring 2C is installed, and the probe 2 protrudes to a predetermined position. It is formed so that when it comes into contact with the pad 6A, a predetermined pressure is applied so that the tip end 2C is reliably connected to the band 6A.

Normally, in such a configuration in which a predetermined probe 2 is projected by the push-up pin 22, the grid board 1 is formed so that the probes 2 are fully provided at each intersection of the grid that matches the reference pitch of the printed circuit board. By providing push-up pins 22 on the individual boards 4 at locations where the probes 2 are to be protruded according to the printed circuit board 6 under test, a predetermined individual board 4 can be mounted depending on the type of the printed circuit board 6 under test. It was being used.

[Problem to be solved by the invention]

Therefore, it is necessary to prepare individual boards 4 suitable for each type of printed circuit board 6 to be tested.

Furthermore, since such individual boards 4 are expensive, it is uneconomical to prepare a wide variety of individual boards 4 for testing.

Therefore, it is an object of the present invention to reduce costs by eliminating the need to prepare various individual boards depending on the type of printed circuit board to be tested.

[Means to solve the problem]

FIG. 1 is a diagram explaining the principle of the present invention.

As shown in FIG. 1, the push-up pin is provided with a support member made of a shape memory alloy that restores the memorized predetermined shape when it reaches a predetermined temperature, and a heater is provided to heat the support member to a predetermined temperature. , and a selection circuit that selectively heats the heater.

With this configuration, the above-mentioned problem is solved.

[Effect]

That is, the push-up pin is supported by a support member made of a shape memory alloy, and the support member of a predetermined push-up pin is heated to a predetermined temperature by a heater as selected by a selection circuit.

Therefore, by fully arranging the push-up pins in the same way as the probes, selecting a predetermined push-up pin from which the probe will protrude by a selection circuit, and heating the support member of the predetermined push-up pin, the The probe can be protruded, and there is no need to prepare many types of individual boards as in the past, and it is possible to test various types of printed circuit boards under test using one individual board.

〔Example〕

The present invention will be explained in detail below with reference to FIGS. 2 and 3. Fig. 2 is a configuration diagram of an embodiment according to the present invention, Fig. 3 is an explanatory diagram of the present invention, <a) is a side view of the main part, (bl)
(b2) is an enlarged view of the main part. The same reference numerals indicate the same objects throughout the figures.

As shown in FIG. 2, the individual board 4 is provided with a support member 7 made of a shape memory alloy made of T1Ni alloy material, and the support of the support member 7 allows the push-up pins 3 to be aligned with the probes 2 on the lattice board 1. Similarly, the push-up pins 3 are arranged in a full array, and each push-up pin 3 is configured to have a heater provided therein to which power is supplied according to selection by the selection circuit 9.

Further, the pattern wiring IB is connected to the probes 2 arranged on the grid board 1, which are connected to the connectors IA (DI, D2) provided on the grid board 1, and are connected to the connectors IA (0, D2).
1, 02) to be connected to the measuring instrument 10 by inserting the connectors 16 (C1, C2) into the connectors 1, 02).

Therefore, the printed circuit board 6 to be tested set on the top plate 13 is sucked into the lattice board 1 by suctioning the air 20.
Then, the individual board 4 is raised by the guide 19.

In this case, predetermined push-up pins 3 arranged on the individual board 4
Power is applied to the heater 8 from the selection circuit 9, and the heater 8
The support member 7 is restored to the predetermined memorized shape by heating, and the push-up pin 3 is projected.

Therefore, the predetermined probe 2 is lifted by the protrusion of the push-up pin 3, and the through hole 13A of the top plate 13 is
The tip 2A of the probe 2 protrudes further, and the tip 2A is brought into contact with the pad 6A of the printed circuit board 6 to be tested.

As shown in FIGS. 3(bl) and 3(b2), this support member 7 is a shaft portion of the push-up pin 3, which consists of a shaft portion 3B that slides onto the individual board 4, and a head portion 3A formed of a heat insulating material. It is formed into a coil shape so that it can be wrapped around the board 3B, and is deformed freely at room temperature, so by pushing the head 3A in the direction of the arrow F1 as shown in (bl), the push-up pin 3 from the individual board 4 is projected. Although the amount of protrusion is small, when the temperature is increased by heating the heater 8 installed inside the push-up pin 3, the support member 7 is restored to the memorized shape as shown in (b2), and the shape shown by the arrow F2 is increased. Thus, the amount of protrusion of the push-up pin 3 can be increased.

Therefore, as shown in FIG. 3(a), the heater 8 of the predetermined push-up pin 3 is selectively heated, and the push-up pin
The probe 2 can be protruded by the head 3A, and the probe 2 can be protruded in a predetermined manner depending on the type of the printed circuit board 6 to be tested.

In addition, the recovery board 21 shown in FIG. 2 is constructed so that it can be inserted and removed between the grid board 1 and the individual board 4 as shown by the arrow, and is evacuated during testing, and after the test is completed, the selected circuit When the heating of the heater 8 by the heater 9 is stopped and a new printed circuit board 6 to be tested is set, the lattice board 1
and the individual board 4, the individual board 4 is raised, and the support member 7 is pressed.

At the time of this pressing, the push-up pin 3 has already returned to room temperature, so it can be easily deformed by being pressed, and the protruding push-up pin 3 is recessed to cope with the next test. .

Therefore, even if there are various types of printed circuit boards 6 to be tested, testing can be performed by selectively protruding predetermined push-up pins 3 using one individual board 4.

〔Effect of the invention〕

As described above, according to the present invention, the push-up pin is made to protrude by the support member made of a shape memory alloy, and the predetermined probe is made to protrude by the protrusion, thereby making it possible to conduct a test using a measuring instrument.

Therefore, there is no need to provide various types of individual boards depending on the printed circuit board 6 to be tested as in the conventional method, and economy can be achieved by reducing costs, which has a great practical effect.

[Brief explanation of the drawing]

FIG. 1 is a diagram explaining the principle of the present invention. FIG. 2 is a configuration diagram of an embodiment according to the present invention. FIG. 3 is an explanatory diagram of the present invention, and (a) is a side view of the main part. (bl) (b2) is an enlarged view of the main part. FIG. 4 is an explanatory diagram of a conventional device, in which (a) is a configuration diagram, (b) is a side view of the main part, and (C) is a sectional view of the main part. In the figure, 1 is a grid board and 2 is a probe. 3 is the push-up pin. 8 is a heater. 10 is a measuring device. 4 is an individual board. The board is shown. 7 is a support member. 9 is a selection circuit. 68 is a pad. 6 is the printed book for testing - Principle statement diagram 1st month (a,)

Claims (1)

[Claims] A grid-like board (1) on which probes (2) are arranged, an individual board (4) on which a plurality of push-up pins (3) are arranged,
A measuring device (10) that is connected to the probe (2) and measures a predetermined electrical signal is provided, and the tip (2A) of the probe (2) is protruded by pressing the push-up pin (3). (2) to a predetermined pad (6A) of the printed circuit board under test (6), the measuring device (10)
In a printed circuit board testing device that performs testing by (7) A printed circuit board testing device comprising: a heater (8) that heats the substrate (7) to a predetermined temperature; and a selection circuit (9) that selectively heats the heater (8).