JPH021792A - Manufacturing method of parquet pattern decorative board - Google Patents
Manufacturing method of parquet pattern decorative boardInfo
- Publication number
- JPH021792A JPH021792A JP14446988A JP14446988A JPH021792A JP H021792 A JPH021792 A JP H021792A JP 14446988 A JP14446988 A JP 14446988A JP 14446988 A JP14446988 A JP 14446988A JP H021792 A JPH021792 A JP H021792A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- wood
- water
- polymer compound
- parquet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000853 adhesive Substances 0.000 claims description 33
- 230000001070 adhesive effect Effects 0.000 claims description 33
- 239000002023 wood Substances 0.000 claims description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 239000000835 fiber Substances 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 238000013008 moisture curing Methods 0.000 claims description 3
- 229920000247 superabsorbent polymer Polymers 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000008187 granular material Substances 0.000 claims 2
- 230000013011 mating Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 4
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JZLWSRCQCPAUDP-UHFFFAOYSA-N 1,3,5-triazine-2,4,6-triamine;urea Chemical compound NC(N)=O.NC1=NC(N)=NC(N)=N1 JZLWSRCQCPAUDP-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Finished Plywoods (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は接着剤及びそれを使用した寄木模様化粧板の
製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) This invention relates to an adhesive and a method for manufacturing a parquet pattern decorative board using the same.
（発明のず！５Ｊ）
本願出願人は、既に以下の如き′θ木木様様化粧板製造
方法を開発している。即ち、繊維飽和点以上の含水率を
有する湿潤な、根状、角柱状等の木材を、９０℃程度の
湯に漬けた後、取り出して木口を除く表面をプレーナ−
や鋸等によって切削し、その後、木材を大気中に放置乾
燥してその表面の含水率を繊維飽和点よりやや低下させ
る第１］［程と、それら木材を所定長さに切断した後、
それら木材を、その相Ｔ間に湿気硬化型ウレタン系接着
剤を介して゛、ダ仕合せ・加圧して集合ブロックを形成
する第２工程と、この集合ブロックを木材の５りせ合せ
断面が得られる方向に薄くνＪ削して寄木模様化粧中級
を得る第３１程と、この寄木模様化粧中板を）＾板に接
着剤を介して貼着する’ｊＳ ４−、工程とをイｆする
寄木模様化粧板の製造方法がそれである。ところで、第
１工程において、木材の表面の含水−Ｖを繊維飽和点よ
りやや低下させ。(Invention Nozu! 5J) The applicant of the present application has already developed the following method for producing a ``θ wood-like decorative board. That is, after soaking wet root-shaped, prismatic, etc. wood with a moisture content above the fiber saturation point in hot water at about 90°C, the wood is taken out and the surface except the end is planed.
After cutting the wood with a saw or the like, the wood is left to dry in the air to reduce the moisture content of the surface slightly below the fiber saturation point. After cutting the wood to a predetermined length,
The second step is to join and press these pieces of wood together using a moisture-curing urethane adhesive between the phases T to form a set block, and to obtain a 5-piece cross-section of the wood by gluing this set block together. The 31st step to obtain an intermediate marquetry pattern by thinly νJ cutting in the direction, and the step of pasting this marquetry pattern decorative intermediate board to the )^ board via adhesive. This is the method for manufacturing decorative boards. By the way, in the first step, the water content -V on the surface of the wood is lowered slightly below the fiber saturation point.
その後、木材を湿気硬化型ウレタン系接着剤を使用して
接着すると、乾燥を施さない１表面が非常に高い含水率
の湿潤な木材部１：を接着する場合に比較して、接着強
度を極めて高くすることが出来る。ところが、木材の表
面の含水率がｍＭ１飽和点より余りに下がり過ぎると、
接着強度が前記の状態のときに比較して低下するという
問題があった。そして、前記寄木模様化粧板の製造方法
を現実に実施する場合、木材の表面の含水率を繊維飽和
点よりやや低く保つことが困難で、大気中に放置乾燥す
る時間が少しでも長くなると、木材の表面の含水率が繊
維飽和点より相ち低下してしまい、その結果、接着強度
が低下するという問題があった。そこで、この問題を解
消するため、７ｕ気硬化型ウつタン系接着剤に少量の水
を添加することも考えられるが、その場合ポットライフ
が極端に短くなるという問題があった。After that, when the wood is bonded using a moisture-curing urethane adhesive, the adhesive strength is extremely high compared to the case where the wood is not dried and the wet wood part 1 has a very high moisture content. It can be made higher. However, if the moisture content of the wood surface falls too much below the mm1 saturation point,
There was a problem in that the adhesive strength was lower than that in the above state. When actually carrying out the manufacturing method of the parquet pattern decorative board, it is difficult to keep the moisture content of the wood surface slightly lower than the fiber saturation point, and if the time left to dry in the air is even slightly longer, the wood There was a problem in that the water content on the surface of the fiber gradually decreased below the fiber saturation point, resulting in a decrease in adhesive strength. Therefore, in order to solve this problem, it may be possible to add a small amount of water to the 7U air-curing type adhesive, but in that case, there was a problem that the pot life would be extremely short.
（発明の目的）
この発明は、上記の如、き問題を解消することを目的と
するものであって、木材の表面の含水率が繊維飽和、６
．より相当低ｒしたものであっても１強国に接着するこ
とが出来る接着剤を提供するとノ（に、その接着剤を使
用した一シ木模様化粧板の製造方法を提供することを目
的とするものである。(Object of the invention) The purpose of the present invention is to solve the above-mentioned problems, and the water content of the surface of the wood is fiber saturation.
．． The purpose of the present invention is to provide an adhesive that can be bonded to one of the world's most powerful countries even if it has a considerably lower r. It is something.
（実施例）
以下にこの発明を２つの実施例にノλづいて説ＩＩする
。(Embodiments) The present invention will be explained below based on two embodiments.
実施例１
第１工程
繊維飽和点以上の含水率を有する湿潤な角柱状の木材を
、９０℃程度の湯に清けた後、取り出して、木口を除く
表面をプレーナ−やｆｊＡ’９によって切削し、その後
、木材を大気中に放置乾燥して、その表面の含水率を！
ａ維飽和点未満にする。Example 1 First step A moist prismatic piece of wood with a moisture content above the fiber saturation point was washed in hot water at about 90°C, taken out, and the surface excluding the end was cut with a planer or fjA'9. , then leave the wood in the air to dry and its surface moisture content!
a) below the fiber saturation point.
：ｊＳ２工程
それら木材を所定長さに！／Ｊ断してた後、それら木材
を、その相互間に以ドの如き接着剤を介して一タせ合せ
・加圧して集合ブロックを形成する。なお、この丁程に
おいて生じる不要な木材部分は捨てる。:jS2 process: Cut the wood to the specified length! /J After cutting, the pieces of wood are joined together and pressed together with an adhesive as shown below to form a collective block. Also, discard any unnecessary wood parts that occur during this step.
接着剤例１
湿気硬化型ウレタン樹脂接着剤１００重量部に、５０倍
屯♀の水を吸収させた高吸水性高分子化合物の粉粒体（
商品名「アクアリックＪ ［日本触媒化学丁業（株）製
、吸水前のモ均粒度が１００メツシュのもの］）を２７
＋（，９部（水を吸収させた状態における）を添加して
よく攪拌したもの
接着剤例２
湿気硬化型ウレタン樹脂接着剤１００ ｉ１１部に、ｉ
ｏｏ倍＋ ｒＬの水を吸収させた高吸水性高分子化合物
の粉粒体（商品名「サンウェット」［三洋化成工業（株
）製、吸水前の平均粒度が８０メツシュのもの］）を２
重着部（水を吸収させた状！島における）を添加してよ
く攪拌したもの
なお、高吸水性高分子化合物の粉粒体の粒度が余り細か
過ぎるとポットライフが短くなり、逆に粗くなり過ぎる
と湿気硬化型ウレタン樹脂接着剤中における、粉粒体の
分布密度が粗くなり均一な接着力が得られないので、粉
粒体の粒度は、吸水膨潤させられる前において５０〜３
００メー、シュが好適である。Adhesive Example 1 100 parts by weight of a moisture-curable urethane resin adhesive was mixed with powder of a highly water-absorbing polymer compound (
Product name "Aqualic J [manufactured by Nippon Shokubai Kagaku Chogyo Co., Ltd., the average particle size before water absorption is 100 mesh]) is 27
Adhesive Example 2 Moisture-curable urethane resin adhesive 100 i 11 parts, i
Powder of a highly water-absorbing polymer compound that has absorbed oo times + rL of water (trade name "Sunwet" [manufactured by Sanyo Chemical Industries, Ltd., with an average particle size of 80 mesh before water absorption])
If the particle size of the superabsorbent polymer compound powder is too fine, the pot life will be shortened, and conversely, it will become coarse. If the particle size is too large, the distribution density of the powder particles in the moisture-curable urethane resin adhesive becomes coarse and uniform adhesion cannot be obtained, so the particle size of the powder particles should be 50 to 3
00 meters and 10,000 meters are suitable.
第３工程
この集合ブロックを木材の寄せ合せ断面が得られる方向
に薄く切削して一タ木模様化粧単板を得る。Third step: This assembled block is cut into thin pieces in the direction in which a cross-section of the lumber is assembled to obtain a decorative veneer with a one-tatami wood pattern.
第４工程
この寄木模様化粧中板を基板に、尿素メラミン樹脂系接
着剤等の接着剤を介して貼着する。Fourth step: This parquet pattern decorative middle board is attached to a substrate via an adhesive such as a urea melamine resin adhesive.
実施例２
なお、実施例２は実施例１と第１工程が相違するのみで
、それ以降の工程は同じである。Example 2 Note that Example 2 differs from Example 1 only in the first step, and the subsequent steps are the same.
第１工程
夏場等の気温の高いとき、大気中に放置していた１表面
の含水率が繊維飽和点未満となった角柱状の木材を、木
目を除く表面をプレーナ−や鋸等によって切削する。1st Step: When the temperature is high, such as in the summer, the prismatic wood that has been left in the air and whose moisture content on one surface has fallen below the fiber saturation point is cut using a planer, saw, etc., excluding the wood grain. .
（比較実験）
２木のナラ材（９０Ｘ４２Ｘ３００ｍｍ 含水率２０
〜２５％）を３組用、へし、それら組ごとに、接着剤例
１．接着剤例２及び比較例接着剤（湿気硬化型ウレタン
樹脂接着ｌ１ＩＩＩ１００市量部に氷２を９部を添加し
たもの）を７ｇＱ布して５ ｋ ｇ ／ Ｃｍ２の圧力
で約３時間冷圧して、以下の結果を得た。(Comparative experiment) 2 oak wood (90 x 42 x 300 mm, moisture content 20
~25%) for three sets, and for each set, adhesive Example 1. Adhesive Example 2 and Comparative Example Adhesive (moisture-curable urethane resin adhesive 11III, 100 commercial weight parts with 9 parts of ice 2 added) was applied to 7 g of cloth and cold-pressed at a pressure of 5 kg/cm2 for about 3 hours. , I got the following results.
（９，明の効果）
この明細占に開示された発明は、前記した如さ構成によ
って、以下に記載の効果を奏するものである。(9. Bright Effects) The invention disclosed in this specification achieves the effects described below by virtue of the above-described configuration.
ｔｌ）接着剤の発明によれば、ポットライフを長くする
ことが出来、且つ木材の表面の含水率がＨ＆維飽和点よ
り相当低下した木材であっても、強固に接着することが
出来る。tl) According to the invention of the adhesive, the pot life can be extended, and even wood whose moisture content on the surface of the wood is considerably lower than the H&fiber saturation point can be firmly bonded.
（２）寄木模様化粧板の製造方法の発明によれば、接着
剤のポットライフが長いので、木材の接着工程が行ない
易く、また、寄木模様化粧中板の接着強度を高めること
が出来るので、高品質の寄木模様化粧板を効率よ〈得る
ことが出来る。(2) According to the invention of the manufacturing method of the parquet pattern decorative board, the pot life of the adhesive is long, so the wood bonding process is easy to perform, and the adhesive strength of the parquet pattern decorative board can be increased. High-quality parquet patterned decorative boards can be obtained efficiently.
Claims (1)
た高吸水性高分子化合物の粉粒体を０．２〜１５重量パ
ーセント添加してなる接着剤。 ２、前記高吸水性高分子化合物の粉粒体の粒度が、吸水
膨潤させられる前において５０〜３００メッシュである
請求項１記載の接着剤。 ３、前記高吸水性高分子化合物の粉粒体に １０〜５００倍量の水が吸収させられている請求項１記
載の接着剤。 ４、繊維飽和点以上の含水率を有する湿潤な木材を湯に
漬けた後、取り出して、木口を除く表面をプレーナ−や
鋸等によって切削し、その後、木材を大気中に放置乾燥
してその表面の含水率を繊維飽和点未満にする第１工程
と、それら木材を、その相互間に接着剤を介して寄せ合
せ・加圧して集合ブロックを形成する第２工程と、この
集合ブロックを木材の寄せ合せ断面が得られる方向に薄
く切削して寄木模様化粧単板を得る第３工程と、この寄
木模様化粧単板を基板に接着剤を介して貼着する第４工
程とを有しており、前記第２工程の接着剤として、湿気
硬化型ウレタン系接着剤に、吸水膨潤させた高吸水性高
分子化合物の粉粒体を０．２〜１５％添加してなる接着
剤を使用する寄木模様化粧板の製造方法。[Scope of Claims] 1. An adhesive obtained by adding 0.2 to 15 percent by weight of powder or granules of a highly water-absorbing polymer compound that has been swollen by water absorption to a moisture-curable urethane adhesive. 2. The adhesive according to claim 1, wherein the particle size of the superabsorbent polymer compound powder is 50 to 300 mesh before being swollen by water absorption. 3. The adhesive according to claim 1, wherein 10 to 500 times the amount of water is absorbed into the granular material of the super absorbent polymer compound. 4. After soaking wet wood with a moisture content above the fiber saturation point in hot water, take it out and cut the surface except the end with a planer or saw, then leave the wood in the air to dry. The first step is to reduce the moisture content of the surface to below the fiber saturation point, the second step is to form an aggregate block by bringing the pieces of wood together and pressurizing them with an adhesive, and to form the aggregate block into a wood block. A third step of obtaining a parquet-pattern decorative veneer by thinly cutting in a direction to obtain a cross-section of the mating cross-section, and a fourth step of attaching the parquet-pattern decorative veneer to a substrate using an adhesive. As the adhesive in the second step, an adhesive obtained by adding 0.2 to 15% of powder of a highly water-absorbing polymer compound swollen by water absorption to a moisture-curing urethane adhesive is used. A method of manufacturing a parquet pattern decorative board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63144469A JPH0717892B2 (en) | 1988-06-10 | 1988-06-10 | Method of manufacturing parquet board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63144469A JPH0717892B2 (en) | 1988-06-10 | 1988-06-10 | Method of manufacturing parquet board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH021792A true JPH021792A (en) | 1990-01-08 |
| JPH0717892B2 JPH0717892B2 (en) | 1995-03-01 |
Family
ID=15363008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63144469A Expired - Fee Related JPH0717892B2 (en) | 1988-06-10 | 1988-06-10 | Method of manufacturing parquet board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0717892B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0211688A (en) * | 1988-06-29 | 1990-01-16 | Eidai Co Ltd | Adhesive, production of assebled blockboard by using same and production of decorative laminate having marquetry pattern |
| JPH03219909A (en) * | 1990-01-25 | 1991-09-27 | Eidai Co Ltd | Manufacture of wooden mosaic decorative sheet |
| JPH04140101A (en) * | 1990-10-01 | 1992-05-14 | Eidai Co Ltd | Manufacturing method of parquet pattern decorative board |
| US5500889A (en) * | 1994-06-09 | 1996-03-19 | At&T Corp. | Method and apparatus for prioritizing a telephone call according to a level of service of an originator |
| US10441920B2 (en) | 2010-04-30 | 2019-10-15 | Evoqua Water Technologies Llc | Fluid flow distribution device |
| CN111944470A (en) * | 2020-08-20 | 2020-11-17 | 中电保力（北京）科技有限公司 | Bi-component water-absorbing expansion daub and application thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50157505A (en) * | 1975-03-04 | 1975-12-19 |
-
1988
- 1988-06-10 JP JP63144469A patent/JPH0717892B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50157505A (en) * | 1975-03-04 | 1975-12-19 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0211688A (en) * | 1988-06-29 | 1990-01-16 | Eidai Co Ltd | Adhesive, production of assebled blockboard by using same and production of decorative laminate having marquetry pattern |
| JPH03219909A (en) * | 1990-01-25 | 1991-09-27 | Eidai Co Ltd | Manufacture of wooden mosaic decorative sheet |
| JPH04140101A (en) * | 1990-10-01 | 1992-05-14 | Eidai Co Ltd | Manufacturing method of parquet pattern decorative board |
| US5500889A (en) * | 1994-06-09 | 1996-03-19 | At&T Corp. | Method and apparatus for prioritizing a telephone call according to a level of service of an originator |
| US10441920B2 (en) | 2010-04-30 | 2019-10-15 | Evoqua Water Technologies Llc | Fluid flow distribution device |
| CN111944470A (en) * | 2020-08-20 | 2020-11-17 | 中电保力（北京）科技有限公司 | Bi-component water-absorbing expansion daub and application thereof |
| CN111944470B (en) * | 2020-08-20 | 2021-03-19 | 中电保力（北京）科技有限公司 | Bi-component water-absorbing expansion daub and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0717892B2 (en) | 1995-03-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |