JPH021861Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a so-called single-wafer processing type vertical semiconductor manufacturing equipment that processes wafers one by one, and in particular, to a device that can automatically attach and detach wafers to and from a susceptor. This invention relates to a wafer push-up mechanism.

[Conventional technology]

Conventional vertical semiconductor manufacturing equipment with single-wafer processing method is
To explain with reference to FIG. 1, a wafer 13 is placed on a susceptor 12 provided in a reactor, and the wafer 13 is rotated by the rotation of a rotating shaft 3 connected to the susceptor 12. It is configured to generate a film, and the susceptor 12
An operator was attaching and detaching the wafer 13 to and from the wafer.

[Problem that the invention attempts to solve]

Conventionally, the attachment and detachment of the wafer 13 has been carried out manually, which has resulted in problems such as not only poor processing capacity but also difficulty in obtaining a high quality film.

[Means for solving problems]

The present invention attempts to provide a wafer thrusting mechanism to solve the above problems.
Susceptor 12 provided in the reactor as shown in the figure
In a vertical semiconductor manufacturing apparatus in which a wafer 13 is placed on top of the wafer 13 and a film is generated on the wafer 13 while rotating the wafer 13 by rotation of a rotating shaft 3 connected to a susceptor 12, the center of the rotating shaft 3 of the susceptor 12 The shaft connecting portion 11 is vertically movable and rotatably supported by the shaft connecting portion 11 , and a push-up shaft 9 that protrudes and retracts from the center of the susceptor 12 is placed on the upper end of the shaft connecting portion 11 . At the same time, the bellows 10 is attached between the shaft connecting portion 11
The lower end is rotatably supported by the vertical movement mechanism 8.

[Effect]

To place the wafer 13 on the susceptor 12, the vertical movement mechanism 8 is driven to move the shaft connecting portion 11 upward, and the push-up shaft 9 is moved upward to the upper end of the push-up shaft 9 to the upper position. The two-pronged wafer transfer arm 18 is moved downward to transfer the wafer 13 supported thereon, and then the vertical movement mechanism 8
The shaft connecting portion 11 is moved downward, the push-up shaft 9 is moved downward, and the wafer 13 placed on the upper end of the push-up shaft 9 is transferred onto the susceptor 12.

In addition, in order to take out the wafer 13 on the susceptor 12, the vertical movement mechanism 8 moves the shaft connecting portion 11 upward, and the push-up shaft 9 is moved upward to push up the wafer 13.
The wafer 13 on the push-up shaft 9 is transferred onto the two-pronged arm 18 by moving the arm transfer two-pronged arm 18 upward in the opposite direction to the above.

〔Example〕

An embodiment of the mechanism of the present invention will be explained below with reference to FIG.

In FIG. 1, 1 is a base, 2 is a housing fixed to this base 1, 3 is a rotating shaft rotatably supported on this housing 2 by a magnetic seal 4, and 12
is a susceptor connected to the upper part of this rotating shaft 3 and provided in the reactor, and 13 is a wafer placed on this susceptor 12. Reference numeral 5 denotes a pulley fixed to the rotating shaft 3 of the susceptor 12, which constitutes a rotation transmission mechanism using the pulley and a belt, and is rotated by a motor.

A through hole 1 is provided in the center of the rotating shaft 3 of the susceptor 12.
4 is provided, and in the through hole 14 in the center, the shaft connecting portion 11 is vertically movable and rotatably mounted on a bearing 17.
It is supported by A bellows 10 is attached between the head of the shaft connecting portion 11 and the portion of the rotating shaft 3 facing thereto, and serves, together with the magnetic seal 4, to isolate the inside of the reactor from the outside world.

A push-up shaft 9 is placed on the upper end of the head of the shaft-connecting portion 11, and the push-up shaft 9 moves in and out of an insertion hole 15 provided in the center of the susceptor 12 as the shaft-connecting portion 11 moves up and down. The lower end of the shaft connecting portion 11 is supported by a vertical movement mechanism, for example, a rod 8a of an air cylinder 8 via a bearing 16. This air cylinder 8 is attached to the cylinder attachment part 7 and is attached to the housing 2 via the pillar 6.

In order to place the wafer 13 on the susceptor 12 in the above configuration, the air cylinder 8 is driven and the bearing 16 is attached to the rod 8a of the air cylinder 8.
The shaft connecting portion 11 supported through the shaft is moved upward. At this time, the bellows 10 is extended. This shaft connection part 11
The upward movement causes the push-up shaft 9 mounted thereon to move upward and protrude from the insertion hole 15 in the center of the susceptor 12. The two-pronged wafer transfer arm 18 (see FIG. 2), which has been moved to the upper end of the push-up shaft 9, is moved downward to transfer the wafer 13 on the two-pronged arm 18. Thereafter, the shaft connecting portion 11 is moved downward by the air cylinder 8, and the push-up shaft 9 is moved downward. At this time, the bellows 10 contracts. By this downward movement of the shaft connecting portion 11, the wafer 13 placed on the upper end is transferred onto the susceptor 12.

When forming a film on the wafer 13 on the susceptor 12, the pulley 5 is rotated to rotate the rotating shaft 3 and the shaft connecting portion 11 connected to the rotating shaft 3 by a bellows 10 and supported by a bearing 17, and connected to the rotating shaft 3. The susceptor 12 , the wafer 13 placed thereon, and the push-up shaft 9 placed on the shaft connecting portion 11 are rotated. At this time, since the lower end of the shaft connecting portion 11 is supported by the rod 8a of the air cylinder 8 by a bearing 16, the rotation of the shaft connecting portion 11 is not transmitted to the rod 8a. A film is generated on the wafer 13 while rotating the wafer 13 in this manner.

After film formation, in order to take out the wafer 13 on the susceptor 12, the air cylinder 8 is used to remove the shaft connecting portion 1.
1, move the push-up shaft 9 upward to push up the wafer 13, transfer the wafer 13 to the upper end of this push-up shaft 9, and move the arm transfer two-pronged arm 18 upward in the opposite direction to the above push-up shaft 9. The wafer 13 is transferred onto the two-pronged arm 18.

Conventionally, the wafer 13 was placed directly on the susceptor 12.
Since the wafer 13 cannot be placed on the susceptor 12 by mechanical means or taken out directly from the susceptor 12, the wafer 13 had to be attached and detached manually. The push-up shaft 9 is moved upward, and the two-pronged arm 18 that has been moved to the upper end of the push-up shaft 9 is moved downward to transfer the wafer 13 supported thereon, or vice versa. Since the wafer 13 supported by the upper end of the push-up shaft 9 can be moved onto the two-pronged arm 18 by upward movement, the wafer 13 relative to the susceptor 12 can be moved upward.
3 can be automatically attached and detached using the push-up shaft 9.

[Effect of idea]

As described above, according to the present invention, in a vertical semiconductor manufacturing apparatus, the shaft connecting part 11 is vertically movable and rotatably supported at the center of the rotating shaft 3 of the susceptor 12, and the upper end of the shaft connecting part 11 is supported. A push-up shaft 9 that protrudes and retracts from the center of the susceptor 12 is placed, a bellows 10 is attached between the shaft connecting portion 11 and the rotating shaft 3, and the lower end of the shaft connecting portion 11 is rotatably attached to the vertical movement mechanism 8. Since the wafer 13 can be automatically attached to and removed from the susceptor 12 by using the push-up shaft 9, it is possible to not only improve the processing capacity but also obtain a high quality film. be able to.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of the mechanism of the present invention;
FIG. 2 is a perspective view for explaining the operational relationship between the push-up shaft and the two-pronged wafer transfer arm in the present invention. 3... Rotation shaft, 8... Vertical movement mechanism (air cylinder), 9... Push-up shaft, 10... Bellows, 1
1... Cylinder shaft connection part, 12... Susceptor, 1
3...Wafer, 14...Through hole, 15...Through hole, 16, 17...Bearing, 18...Wafer transfer two-pronged arm.

Claims (1)

[Scope of utility model registration request] A wafer 13 is placed on a susceptor 12 provided in a reactor, and this wafer 13 is placed on a susceptor 12.
In a vertical semiconductor manufacturing apparatus that generates a film on a wafer 13 while being rotated by the rotation of a rotating shaft 3 connected to a susceptor 2, a shaft connecting portion 11 is provided at the center of the rotating shaft 3 of a susceptor 12 so as to be vertically movable and rotatable. A susceptor 12 is mounted on the upper end of this shaft connecting portion 11.
A push-up shaft 9 that protrudes and retracts from the center of the bellows 10 is placed between the shaft connecting portion 11 and the rotating shaft 3.
A wafer push-up mechanism for a vertical semiconductor manufacturing apparatus, in which the lower end of the shaft connecting portion 11 is rotatably supported by the vertical movement mechanism 8.