JPH0218982A - Method for manufacturing hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To remove defects such as lead separation, cracks, etc., at a lead soldered part and miniaturize the device by splitting an insulating substrate by a split groove after providing the split groove at the center so as to constitute first and second integrated circuit parts and after connecting a lead frame to each of electrodes. CONSTITUTION:Electronic parts 12 are soldered onto a thick film insulating substrate 11, whose size corresponds two circuit being provided with a split groove 11a at the center, so as constitute first and integrated circuit parts 13 and14, and lead frames 16 to which bending process is applied are arranged at the lead electrodes 15a and 15b of these first and second integrated circuit parts 13 and 14. And they are soldered using a soldered device, and then the insulating substrate is split at a split groove 11a and bent so as to constitute a hybrid integrated circuit device of lead provided single end type. By adopting bending lead frames 16, this way, which are processed in advance, the process of lead processing becomes needless. Hereby, mechanical stress ceases to be applied to the terminal part, and lead bending space becomes needless, and further miniaturization can be realized, and also the strength at the soldering part of a lead terminal becomes great.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a hybrid integrated circuit device.

BACKGROUND OF THE INVENTION Conventionally, a folded single-ended hybrid integrated circuit device has been manufactured as shown in FIGS. 7 to 10. That is, FIG. 7 shows the configuration of a folded single-end type hybrid integrated circuit device that has already been soldered. Lead wires 4 are soldered to lead electrodes 2 on the thick film insulating substrate 1, and chip components 3 are soldered to predetermined locations on the thick film insulating substrate 1.

Next, as shown in FIG. 8, an exterior resin 5 is applied to the soldered board shown in FIG. 7 and hardened. Next, as shown in FIG. 9, the lead wire 4 is bent by 90 degrees using a lead bending jig 6, thereby completing the folded single-ended hybrid integrated circuit device shown in FIG.

Problems to be Solved by the Invention In such conventional methods, when bending the lead wire, mechanical stress is applied to the lead soldering part, resulting in defects such as lead detachment and lead soldering cracks. It's easy to do. In addition, the processing precision required bending, which had the disadvantage of increasing the size of the product.

The present invention eliminates these conventional drawbacks.

Means for Solving the Problem In order to solve this problem, the present invention provides a first circuit by soldering electronic components onto a thick film insulating substrate having a dividing groove in the center and having a size for two circuits. A second integrated circuit section is configured; A single-ended hybrid integrated circuit device with bent leads is obtained by placing a lead frame that has been bent 2 on the lead electrodes of the second integrated circuit section, soldering it using a soldering device, and then dividing it with a dividing groove. This is a method for manufacturing.

Function By using a pre-processed bending lead frame, the lead processing process is eliminated, which eliminates mechanical stress on the terminal area and eliminates the need to bend the leads, allowing for further miniaturization. I can do it. Furthermore, by connecting the folded lead frames, it becomes possible to mount a large number of chip components, which reduces the overall number of man-hours.

EXAMPLE Hereinafter, an example of the present invention will be described using the drawings of FIGS. 1 to 6.

FIG. 1 is a diagram showing state 2 of the integrated circuit section, in which a thick film insulating substrate 11 such as an alumina substrate with a dividing groove 111Li provided in the center and having a size for two circuits is used. The first and second integrated circuit sections 13 and 14 are constructed by connecting and mounting the electronic components 12 by soldering to the conductor patterns on the respective regions separated by the dividing groove 112L. This first. Lead electrodes 1B&, 15b are formed on the thick film insulating substrate 11 constituting the second integrated circuit section 13, 14'z.

Thereafter, as shown in FIG.
The lead electrodes 15&, 15b are inserted from both sides by the insertion machine 17 so that the leading ends of the lead electrodes 15&, 15b are sandwiched between them.

Thereafter, as shown in FIG. 3, the substrate in the state shown in FIG. 2 is held by the pallet 18, and the lead electrodes 15! L
, 15b and the lead frame 16 are immersed in solder 19 and soldered.

In this case, the immersion angle θ is set to 46° to 60'.

This improves the flow of the solder 19 and reduces solder bridges.

Further, the solder tank has a two-tiered structure so that only the necessary parts of the solder with leads can be immersed, and the solder tank is composed of an internal solder tank 20 and an external solder tank 21. By reducing the diameter W of the internal soldering tank 20, the solder 19
The solder surface swells due to the surface tension of the solder, and the immersion depth of the leaded part can be made shallower.

After that, as shown in FIG. 4, the entire board with lead soldering is placed on the one-dividing table 22, and the entire dividing bar 23 on the side opposite to the dividing groove 11λ is shown in FIG.
Lower and divide.

FIG. 6 shows the divided state. By covering the structure shown in FIG. 6 divided into FIG. 6 with mold resin 24, a high-precision and high-quality single-end type mixed integrated circuit device can be manufactured.

Effects of the Invention As described above, according to the present invention, in a single-ended hybrid integrated circuit device with bent leads, the lead dimensional accuracy is greatly improved, the strength of the soldered portion of the lead terminal is increased, and the device is small and compact. A high quality hybrid integrated circuit device can be provided.

[Brief explanation of the drawing]

1 to 6 are process diagrams showing the main parts of the manufacturing process of a hybrid integrated circuit device according to an embodiment of the present invention, and FIGS. 7 to 10 are process diagrams showing a conventional method for manufacturing a hybrid integrated circuit device. It is. 11... Thick film insulating substrate (1-A is dividing groove), 1
2...Electronic parts, 13.14...1st
．． Second integrated circuit section, 15&, 15b...Lead electrode, 16...Lead frame. Name of agent: Patent attorney Shigetaka Awano and one other person

Claims (1)

[Claims] The first electronic component is mounted on an insulating substrate with a dividing groove in the center and the size of two circuits is separated by the dividing groove.
, a hybrid integrated circuit device comprising a second integrated circuit section, and after connecting a lead frame to each of the lead electrodes of the first and second integrated circuit sections, the insulating substrate is divided by a dividing groove. manufacturing method.