JPH02198014A - Manufacture for magnetic head device - Google Patents

Abstract

PURPOSE:To obtain a head with an excellent electric characteristic by providing plural kinds of molded openings different from the size and shape at every mask and forming plural kinds of magnetic head elements different from the size and shape onto a wafer. CONSTITUTION:Plural number of two kinds of molded opening parts 23a, 23b whose size and shape differs from each other are arranged alternately to a lower core forming mask 22. Two kinds of magnetic head elements 3a, 3b are formed, which respectively composed of an upper core 6a(6b), a gap 7a(&b) and a lower core 8a(8b) by applying each mask capable of manufacturing the two kinds of magnetic head elements sequentially to the surface of one wafer 9. The elements 3a, 3b with a different characteristic such as the thickness of cores d1, d2 and the depth of gap (g) are formed alternately. Then the elements 3a, 3b are cut out and floating faces 2a, 2b of a slider 1 are adhered to a relevant rear end face and then the magnetic head is manufactured. Thus, at least several hundreds of the elements 3a, 3b of two kinds of shape are manufactured simultaneously and the elements 3a, 3b with different parameters are adhered to the rear end face of the floating faces 2a, 2b of the slider 1.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a magnetic disk device, and particularly to a method for simultaneously forming a plurality of magnetic head elements on a wafer using thin film technology.

(Prior Art) Conventionally, a magnetic head device has a slider 1 as shown in FIG.
The slider 1 has floating surfaces 2a and 2b that are parallel to the left and right, and the floating surfaces 2a.

Magnetic head elements 3, 3 are attached to the rear end surface corresponding to 2b, respectively.

In addition, 4 is a coil provided in the magnetic head elements 3, 3 to perform electromagnetic conversion, and 5 is a bonding pad, and this bonding pad 5 is used to solder a lead wire connecting the coil 4 and the head IC. It is provided for connection by.

In the method for manufacturing the magnetic head device described above, first, the magnetic head elements 3, 3 are formed as shown in FIGS. 5 to 7. The procedure is to apply a lower core forming mask 10 having a plurality of molding openings 11 on the wafer 9 and form the lower core 8 by plating or sputtering. In this case, each molding opening 11 is formed in the same shape and arranged in a correctly aligned state.

Then, after forming the gap 7 by applying a gap forming mask (not shown) in which a plurality of forming openings 11 having the same size and the same outer shape are provided on the lower core 8, the first insulation@12 is formed.

Next, a coil-forming mask is applied to form an insulating layer 3 on which the coil 4 is formed, and after forming the coil 4 in the same manner as described above, the third insulating layer 14 is formed.

After applying an upper core forming mask (not shown) and forming the upper core 6 in the same manner as above, the protective film 15 is
The magnetic head elements 3, 3 are manufactured by forming.

This head element 3.3 is cut out and the floating surface 2 of the slider 1 is
Attach it to the rear end surface corresponding to a and 2b.

(Problems to be Solved by the Invention) However, in the above method for manufacturing a magnetic head device, a mask for forming a lower core and a mask for forming a gap are required.

Since the plurality of molding openings provided in the upper core forming mask are formed to the same size and are of one type, a 1 m lifting platform for magnetic head elements of different shapes and dimensions can be used to store different types of masks on different wafers. It had to be manufactured using

Therefore, in order to manufacture magnetic head elements of different types, there is a problem in that all manufacturing must start from the wafer stage. Therefore, problems such as a longer construction period arose.

The present invention was made in view of the above problems, and its purpose is to make it possible to manufacture magnetic head elements with a plurality of types of characteristics from one wafer.

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a plurality of types of molding openings with different sizes and shapes for each mask, and multiple types of molding openings with different sizes and shapes on one wafer. It is characterized by forming a magnetic head element of.

(Function) With the above configuration, in the Mm method of a magnetic head device, multiple types of magnetic head elements can be manufactured using one wafer, and the magnetic head element to be used can be selected from among them.

(Examples) Hereinafter, the present invention will be described in detail with reference to drawings showing examples.

1 to 3 show a first embodiment of the invention.

In this embodiment, members and parts that are the same or equivalent to those of the above-mentioned conventional example are given the same reference numerals and their explanations will be omitted.

In the method for manufacturing a magnetic head device according to the present invention, as shown in FIG. 3, the lower core forming mask 22 is provided with a plurality of forming openings 23a and 23b of two types alternately different in size and shape. be. Similar to the lower core forming mask 22, a gap forming mask and a ten core forming mask having two types of molding openings are also prepared.

In this way, each mask capable of manufacturing two types of magnetic head elements is sequentially applied to the surface of one wafer 9, and upper cores 5a and 5b having different specifications and gears are formed in the same manner as in the conventional example. ψ whelk 7a.

Two types of magnetic head elements 3a and 3b are formed, each consisting of a magnetic head 7b and a lower core Ba and Bb. In this example, the second
As shown in FIGS. (a) and (b), two types of magnetic head elements 3a, 3b having different characteristics such as core thicknesses d, d2 and gear tooth length q are formed every other time.

Next, each magnetic head element 3a, 3b is cut out and attached to the rear end surface to which the floating surfaces 2a, 2b of the slider 1 correspond, thereby manufacturing a magnetic head device. That is, magnetic head elements 3a and 3b having different characteristics are attached, and one of these magnetic head elements 3a and 3b is selectively used.

With the above configuration, hundreds of magnetic head elements 3a, 3b of at least two types of shapes are manufactured at the same time, and as a result, magnetic head elements 3a, 3b having different specifications are placed on the rear end surface of the floating surfaces 2a, 2b of the slider 1. It is pasted.

In the above example, two elements with different core thicknesses and gap lengths were manufactured, but the core width and 0. ,,l
! Elements with different values may be manufactured. Also, both may be different.

Further, it may be an element for data and an element for reading navigation information.

Further, the number of turns of the coil 4 may be changed.

Furthermore, two or more types of magnetic head elements may be provided on the same wafer.

〔Effect of the invention〕

As explained above, the present invention provides multiple types of molding openings with different sizes and shapes for each mask, and forms multiple types of magnetic head elements with different sizes, shapes, and other characteristics on a single wafer. It is characterized by

Therefore, since a plurality of types of magnetic head elements can be formed at the same time, the construction period can be shortened.

In addition, there is an effect that a head with good electrical characteristics can be raised in the area of use.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a magnetic head device manufactured according to the dimensions of the present invention, FIGS. 2(a) and (b) are end views of a magnetic head element, FIG. 3 is a perspective view of a mask, and FIG. FIG. 5 is a perspective view of a magnetic head device manufactured by a conventional method, FIG. 5 is a perspective view of a mask, FIG. 6 is a manufacturing process diagram of a magnetic head element, and FIG. 7 is an end view of the magnetic head element. 1...Slider, 3.3a, 3b...
Magnetic head element, 6a, 6b... Upper core, 7
a, 7b...Giretsubu, 8a, 3b...
- Lower core, 9...Nium, 22...Mask for forming the lower core, 23a, 23b... Molding opening.

Claims (1)

[Claims] A lower core forming mask, a gap forming mask, a coil forming mask, and an upper core forming mask each having a plurality of molding openings are sequentially applied to the wafer surface to form a lower core, a gap, a coil, and an upper core on the wafer. In a method for manufacturing a magnetic head device in which a plurality of magnetic head elements each consisting of a core are formed and then these magnetic head elements are cut out and attached to a slider, a molded opening having a different size and shape for each mask is used. 1. A method of manufacturing a magnetic head device, characterized in that a plurality of types of parts are provided, and a plurality of types of magnetic head elements having different characteristics such as size and shape are formed on a single wafer.