JPH02202702A - Microwave circuit - Google Patents

Microwave circuit

Info

Publication number
JPH02202702A
JPH02202702A JP1022919A JP2291989A JPH02202702A JP H02202702 A JPH02202702 A JP H02202702A JP 1022919 A JP1022919 A JP 1022919A JP 2291989 A JP2291989 A JP 2291989A JP H02202702 A JPH02202702 A JP H02202702A
Authority
JP
Japan
Prior art keywords
line
circuit
microwave
dielectric substrate
coplanar line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1022919A
Other languages
Japanese (ja)
Inventor
Keiichi Sakuno
圭一 作野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1022919A priority Critical patent/JPH02202702A/en
Publication of JPH02202702A publication Critical patent/JPH02202702A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To reduce the overall size of a microwave circuit by adding a circuit consisting of a coplanar line on one of both sides of a dielectric substrate with a circuit consisting of a microwave strip line and using its earth electrode surface of a coplanar line as a lower earth surface added to the other side of the dielectric substrate respectively. CONSTITUTION:A microwave circuit uses an earth electrode surface 20 of a coplanar line to form a microstrip line on its counter surface 23. Then the filters 13, 14 and 17 and an intermediate frequency short circuit line 16 are formed with the microstrip line on the surface 23. At the same time, an amplifying FET 12, an image signal eliminating filter 13, etc., are formed on a coplanar line surface 24 containing an earth electrode surface 20. In such a constitution, the circuits can be decentralized on both sides of a dielectric substrate 19. Thus the overall size can be reduced for a microwave circuit.

Description

【発明の詳細な説明】 皮呈上皮科朋分! 本発明は、誘電体基板面に回路を構成するマイクロ波回
路に関するものである。
[Detailed Description of the Invention] Dermatological Epitheliology Department! The present invention relates to a microwave circuit that configures a circuit on a dielectric substrate surface.

皿来夏致血 近年、衛星通信システムの急速な発展に伴ない、その送
受信部として重要な役割を果たすマイクロ波回路の高性
能化、集積化、小型化の要望が非常に高くなってきてい
る。
In recent years, with the rapid development of satellite communication systems, there has been an extremely high demand for higher performance, greater integration, and miniaturization of the microwave circuits that play an important role as the transmitter and receiver. .

マイクロ波帯の回路においては、ストリップ線路を用い
るのが一般的であるが、従来回路の一例として衛星通信
受信用ダウンコンバータの初段低雑音増幅器からミキサ
部にかけての回路を第3図に示す。同図において1は低
雑音増幅器最終段のマイクロストリップ線路を用いた入
力整合回路。
Strip lines are commonly used in microwave band circuits, and FIG. 3 shows an example of a conventional circuit from the first-stage low-noise amplifier to the mixer section of a down converter for satellite communication reception. In the figure, 1 is an input matching circuit using a microstrip line in the final stage of the low-noise amplifier.

2は増幅用FET(電界効果トランジスタ)、3はイメ
ージ信号除去フィルタ54は局部発振信号用バンドパス
フィルタ、5はミキシング用ダイオード、6は中間周波
数短絡回路、7は中間周波用0−ハスフィルタ、8は接
地用バイアホール、9は誘電体基板である。この従来例
は半導体基板上にモノリシック化したいわゆるMMIC
(モノリシック・マイクロウェーブIC)を示すもので
あるが、アルミナ基板等を用いたハイブリッドICであ
っても事情は同じである。
2 is an amplification FET (field effect transistor), 3 is an image signal removal filter 54, a band pass filter for local oscillation signals, 5 is a mixing diode, 6 is an intermediate frequency short circuit, 7 is a 0-lotus filter for intermediate frequencies, 8 is a grounding via hole, and 9 is a dielectric substrate. This conventional example is a so-called MMIC that is monolithic on a semiconductor substrate.
(monolithic microwave IC), but the same situation applies to hybrid ICs using an alumina substrate or the like.

關が ゛ しよ゛とする晋 上述のような従来例において回路上で主要な面積を占め
るのは各種のフィルタ3.4,6,7゜であるから、回
路全体の小型化を図るためには当然これらのフィルタを
小型化する必要がある。
In the conventional example mentioned above, various filters 3, 4, 6, and 7 degrees occupy the main area on the circuit, so in order to reduce the size of the entire circuit, Naturally, these filters need to be miniaturized.

ところで、ストリップ線路でフィルタを構成する場合、
その線路長としては所望周波数のストリップ線路上での
波長のA程度はどうしても必要であり、従ってフィルタ
の小面積化の方法としては基板を薄<シて、ストリップ
線路上幅を狭めるか、誘電率の大きな基板を用いて、ス
トリップ線路上での波長を短(するくらいしかない。し
かしながら、基板は取扱い上あまり薄くすることはでき
ず、また高誘電率で低損失の基板を得るのは非常に難し
いという問題点がある。特にMM I C化を図る場合
においては能動素子部より、受動素子部の方が遥かに大
きくなってしまい、MMIC化の利点が無くなってしま
うという不具合が生じる。
By the way, when configuring a filter with strip lines,
The length of the line must be about A, which is the wavelength of the desired frequency on the strip line.Therefore, the method of reducing the area of the filter is to make the substrate thinner and narrow the width on the strip line, or to reduce the dielectric constant. The only way is to shorten the wavelength on the strip line by using a large substrate. However, it is not possible to make the substrate very thin due to handling reasons, and it is extremely difficult to obtain a substrate with a high dielectric constant and low loss. Particularly when attempting to implement MMIC, the passive element section becomes much larger than the active element section, resulting in the disadvantage that the advantages of MMIC implementation are lost.

本発明はこれらの点に迄みなされたものであり、上記欠
点を除去した新規なマイクロ波回路を提供することを目
的とする。
The present invention has been made in view of these points, and it is an object of the present invention to provide a novel microwave circuit which eliminates the above-mentioned drawbacks.

牙 を”るための 上記の目的を達成するため、本発明のマイクロ波回路は
、誘電体基板の一方の面にコプレーナ線路で構成される
回路を有し、他方の面に前記コプレーナ線路の接地電極
面を下部接地面とするマイクロストリップ線路で構成さ
れる回路を有する。
In order to achieve the above-mentioned object, the microwave circuit of the present invention has a circuit composed of a coplanar line on one side of a dielectric substrate, and a grounding circuit of the coplanar line on the other side. It has a circuit consisting of a microstrip line with the electrode surface as the lower ground plane.

咋−■ このような構成によれば、基板の両面にマイクロ波回路
を構成でき、且つコプレーナ線路の接地電極面を利用し
て他方の面にマイクロストリップ線路回路を構成できる
ため基板面を有効活用することができ、その分マイクロ
波回路を小型化することができる。
With this configuration, microwave circuits can be configured on both sides of the board, and a microstrip line circuit can be configured on the other side using the ground electrode surface of the coplanar line, making effective use of the board surface. Therefore, the microwave circuit can be made smaller accordingly.

裏1班 以下図面を参照して本発明の実施例について説明する。Back 1st group Embodiments of the present invention will be described below with reference to the drawings.

第1図及び第2図に本発明の一実施例におけるマイクロ
波回路を示す。
FIGS. 1 and 2 show a microwave circuit according to an embodiment of the present invention.

第1図中、11は低雑音増幅器最終段のコプレーナ線路
(lla)を用いた入力整合回路である。ここで、斜線
部20がコプレーナ線路の接地電極面であり、対向面2
3上のマイクロストリップ線路は破線で示しである。1
2は増幅用FET、13はイメージ信号除去フィルタ、
14は局部発振信号用バンドパスフィルタ、15はミキ
シング用ダイオード116は中間周波短絡線路、17は
中間周波用ローパスフィルタ、 1Bは接地用バイアホ
ール、19は誘電体基板。
In FIG. 1, numeral 11 is an input matching circuit using a coplanar line (lla) in the final stage of the low-noise amplifier. Here, the shaded area 20 is the ground electrode surface of the coplanar line, and the opposing surface 2
The microstrip line on 3 is indicated by a broken line. 1
2 is an amplification FET, 13 is an image signal removal filter,
14 is a band pass filter for local oscillation signals, 15 is a mixing diode 116 is an intermediate frequency short circuit line, 17 is a low pass filter for intermediate frequencies, 1B is a via hole for grounding, and 19 is a dielectric substrate.

21はフリップチップ実装用バンプ、22は表裏面間配
線用スルーホールである。また第2図は、−点鎖線A−
B間の断面図を示すものであり、図中の符号は第1図中
の符号と同じものを表わす。
21 is a bump for flip-chip mounting, and 22 is a through hole for wiring between the front and back surfaces. In addition, in Figure 2, -dotted chain line A-
It shows a cross-sectional view between B and the reference numerals in the drawing represent the same reference numerals as those in FIG. 1.

第1図及び第2図から分かるように、本実施例ではコプ
レーナ線路の接地電極面20を利用して、対向面23に
マイクロストリップ線路を構成している。そして、対向
面23にマイクロストリップ線路で形成されているのは
フィルタ13.14.17及び短絡線路16であり、一
方接他電極面20を有するコプレーナ線路面24に形成
されているのはFET12゜ダイオード13等である。
As can be seen from FIGS. 1 and 2, in this embodiment, a microstrip line is formed on the opposing surface 23 by using the ground electrode surface 20 of the coplanar line. The filters 13, 14, 17 and the short circuit line 16 are formed as microstrip lines on the opposing surface 23, and the FET 12° is formed on the coplanar line surface 24 having the other electrode surface 20. The diode 13 and the like.

このように誘電体基板19の両面に回路を分散させるこ
とができるので、回路全体の小型化が実現できる。尚、
誘電体基板19の接地電極面20はバンブ21を介して
接地用の導体板25と電気的に接続されていると共に機
械的に結合されている。
Since the circuits can be distributed on both sides of the dielectric substrate 19 in this way, the overall size of the circuit can be reduced. still,
A ground electrode surface 20 of the dielectric substrate 19 is electrically connected and mechanically coupled to a grounding conductor plate 25 via a bump 21.

本実施例では衛星通信受信用ダウンコンバータの場合を
挙げて説明したが、他のマイクロ波回路においても本発
明を有効に適用できることはいうまでもない。
Although the present embodiment has been described using a down converter for satellite communication reception, it goes without saying that the present invention can be effectively applied to other microwave circuits.

光皿立妨果 以上のように本発明によれば、基板面を有効に活用でき
るのでマイクロ波回路を小型に構成することができる。
As described above, according to the present invention, the substrate surface can be effectively utilized, so that the microwave circuit can be constructed in a compact size.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明を実施したマイクロ波回路を示す構成図
であり、第2図は第1図のA−B線断面図である。第3
図は従来のマイクロ波回路の構成図である。 11・・・入力整合回路、12・・−増幅用FET。 13− イメージ信号除去フィルタ。 14−局部発振信号用バンドパスフィルタ。 15・−・ミキシング用ダイオード。 16−中間周波短絡線路。 17・−・中間周波用バンドパスフィルタ。 18・−接地用バイアホール、 19−誘電体基板。 20−コプレーナ線路用接地電極面。 21−・フリップチップ実装用バンプ。 表裏面配線用スルーホール 対向面、24−・・コプレーナ線路面。 願人 シャープ株式会社 埋入
FIG. 1 is a block diagram showing a microwave circuit embodying the present invention, and FIG. 2 is a sectional view taken along the line A--B in FIG. 1. Third
The figure is a configuration diagram of a conventional microwave circuit. 11... Input matching circuit, 12... - FET for amplification. 13- Image signal removal filter. 14-Bandpass filter for local oscillation signal. 15.--Mixing diode. 16-Intermediate frequency short circuit line. 17.--Intermediate frequency band pass filter. 18-- grounding via hole, 19- dielectric substrate. 20 - Ground electrode surface for coplanar line. 21-・Bump for flip chip mounting. Front and back surfaces facing through-holes for wiring, 24-... coplanar track surface. Embedded by Ganto Sharp Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] (1)誘電体基板の一方の面にコプレーナ線路で構成さ
れる回路を有し、他方の面に前記コプレーナ線路の接地
電極を下部接地面とするマイクロストリップ線路で構成
される回路を有することを特徴とするマイクロ波回路。
(1) A dielectric substrate has a circuit composed of a coplanar line on one side, and a circuit composed of a microstrip line whose lower ground plane is the ground electrode of the coplanar line on the other side. Features microwave circuit.
JP1022919A 1989-01-31 1989-01-31 Microwave circuit Pending JPH02202702A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1022919A JPH02202702A (en) 1989-01-31 1989-01-31 Microwave circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1022919A JPH02202702A (en) 1989-01-31 1989-01-31 Microwave circuit

Publications (1)

Publication Number Publication Date
JPH02202702A true JPH02202702A (en) 1990-08-10

Family

ID=12096050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1022919A Pending JPH02202702A (en) 1989-01-31 1989-01-31 Microwave circuit

Country Status (1)

Country Link
JP (1) JPH02202702A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005006031A (en) * 2003-06-11 2005-01-06 Sony Corp Amplifier and receiver circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005006031A (en) * 2003-06-11 2005-01-06 Sony Corp Amplifier and receiver circuit

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