JPH0220328U - - Google Patents

Info

Publication number
JPH0220328U
JPH0220328U JP9815188U JP9815188U JPH0220328U JP H0220328 U JPH0220328 U JP H0220328U JP 9815188 U JP9815188 U JP 9815188U JP 9815188 U JP9815188 U JP 9815188U JP H0220328 U JPH0220328 U JP H0220328U
Authority
JP
Japan
Prior art keywords
inert gas
semiconductor wafers
heat
evacuation chamber
preliminary evacuation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9815188U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9815188U priority Critical patent/JPH0220328U/ja
Publication of JPH0220328U publication Critical patent/JPH0220328U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す縦断面図、第
2図は従来例の熱処理装置を示す縦断面図である
。 1……炉芯管、2……ヒータ、3……ガス、4
……不活性ガス源、5……半導体ウエーハ、6…
…ウエーハボート、7……真空ポンプ、8……排
気バルブ、9……不活性ガス導入バルブ、10a
,10b……扉、12……ロードロツク、13…
…排気ダクト配管バルブ、14……排気ダクト、
15……圧力ゲージ。
FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view showing a conventional heat treatment apparatus. 1... Furnace core tube, 2... Heater, 3... Gas, 4
...Inert gas source, 5...Semiconductor wafer, 6...
...Wafer boat, 7...Vacuum pump, 8...Exhaust valve, 9...Inert gas introduction valve, 10a
, 10b...Door, 12...Loadlock, 13...
...Exhaust duct piping valve, 14...Exhaust duct,
15...Pressure gauge.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ウエーハを大気圧にて熱処理する装置に
おいて、半導体ウエハの熱処理用炉芯管の開口部
に連結され、真空排気される予備真空排気室と、
該予備真空排気室内に不活性ガスを導入しその内
部を不活性ガス雰囲気に置換する不活性ガス源と
を有することを特徴とする半導体ウエーハの熱処
理装置。
In an apparatus for heat-treating semiconductor wafers at atmospheric pressure, a preliminary evacuation chamber is connected to an opening of a furnace core tube for heat-treating semiconductor wafers and is evacuated;
A heat processing apparatus for semiconductor wafers, comprising: an inert gas source for introducing an inert gas into the preliminary evacuation chamber and replacing the inside with an inert gas atmosphere.
JP9815188U 1988-07-25 1988-07-25 Pending JPH0220328U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9815188U JPH0220328U (en) 1988-07-25 1988-07-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9815188U JPH0220328U (en) 1988-07-25 1988-07-25

Publications (1)

Publication Number Publication Date
JPH0220328U true JPH0220328U (en) 1990-02-09

Family

ID=31324158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9815188U Pending JPH0220328U (en) 1988-07-25 1988-07-25

Country Status (1)

Country Link
JP (1) JPH0220328U (en)

Similar Documents

Publication Publication Date Title
JPH05335264A (en) Sealing device
JPH0220328U (en)
JPS63127125U (en)
JPS6280199U (en)
JPH063350Y2 (en) Vacuum heat treatment furnace
JPH08288262A (en) Semiconductor substrate processing unit
JPS61183962U (en)
JPH0257895A (en) Vacuum heat treatment method and device
JPS62194760U (en)
JPH0331U (en)
JPS62160536U (en)
JPS6336032U (en)
JPS62100493U (en)
JPH01123336U (en)
JPS6242237U (en)
JPS6449675U (en)
JPS61285713A (en) Heat treatment apparatus
JPH02131245U (en)
JPS6382929U (en)
JPH02106823U (en)
JPH0244324U (en)
JPH0193723U (en)
JPH0170327U (en)
JPH03111571U (en)
JPS61168630U (en)