JPH0220337A - Preparation of laminated sheet - Google Patents
Preparation of laminated sheetInfo
- Publication number
- JPH0220337A JPH0220337A JP17160188A JP17160188A JPH0220337A JP H0220337 A JPH0220337 A JP H0220337A JP 17160188 A JP17160188 A JP 17160188A JP 17160188 A JP17160188 A JP 17160188A JP H0220337 A JPH0220337 A JP H0220337A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- metal foil
- thickness
- base material
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000000465 moulding Methods 0.000 claims abstract description 8
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 239000000835 fiber Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 230000037303 wrinkles Effects 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000010425 asbestos Substances 0.000 abstract description 2
- 239000002131 composite material Substances 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229930003836 cresol Natural products 0.000 abstract description 2
- 239000004744 fabric Substances 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 239000004745 nonwoven fabric Substances 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229910052895 riebeckite Inorganic materials 0.000 abstract description 2
- 229920000178 Acrylic resin Polymers 0.000 abstract 1
- 239000004925 Acrylic resin Substances 0.000 abstract 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 abstract 1
- 229920001225 polyester resin Polymers 0.000 abstract 1
- 239000004645 polyester resin Substances 0.000 abstract 1
- 239000012209 synthetic fiber Substances 0.000 abstract 1
- 229920002994 synthetic fiber Polymers 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- -1 phorisulfon Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気機器、電子機器、通信機器、計算機器等に
用いられる積層板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a laminate used in electrical equipment, electronic equipment, communication equipment, computing equipment, etc.
積層板はその表面の金属箔に電気回路を形成し、プリン
ト配線板、多層プリント配線板に用いられるが、最近は
ファインパターンが増加し積層板表面の金属箔に3〜1
2ミクロン厚の極薄金属箔が用いられている。しかしこ
れら3〜12ミクロン厚の極薄金属箔は腰がなく、取扱
い時にシワ、折れが発生し不良率が増加する。この対策
として極薄金属箔にキャリア箔をつけ一体化し厚みをつ
けているが積層成形後のキャリア箔をピーリング作業、
エツチング作業等で除去する必要があり、コスト、作業
工程の増加が問題、であった。Laminated boards form electrical circuits on the metal foil on the surface and are used for printed wiring boards and multilayer printed wiring boards.Recently, fine patterns have increased, and the metal foil on the surface of the laminate has 3 to 1
Ultra-thin metal foil with a thickness of 2 microns is used. However, these ultra-thin metal foils with a thickness of 3 to 12 microns are not stiff, and wrinkles and folds occur during handling, increasing the defective rate. As a countermeasure to this, carrier foil is attached to ultra-thin metal foil and integrated to make it thicker.
It had to be removed by etching, etc., which resulted in an increase in cost and work steps.
従来の技術で述べたように極薄金属箔をそのまま用いる
とシワ、折れが発生し不良率が増加し、キャリア箔をつ
けて用いるとコスト、作業工程が増加する。本発明は従
来の技術における上述の問題点に鑑みてなされたもので
、その目的とするところは、不良率、コスト、作業工程
を低減することのできる積層板の製造方法を提供するこ
とにある。As described in the related art section, if ultra-thin metal foil is used as it is, wrinkles and folds will occur, increasing the defective rate, and if it is used with carrier foil attached, costs and work steps will increase. The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to provide a method for manufacturing a laminate that can reduce the defective rate, cost, and work process. .
本発明は所要枚数の樹脂含浸基材を重ねた上面及び又は
下面に、樹脂層を1〜loo f/v1 つけた厚み
3〜12ミクロンの金属箔を配設した積層体を積層成形
することを特徴とする積層板の製造方法のため、極薄金
属箔の腰が強くなりシワ、折れがなくなシネ良率が低下
し、又キャリア箔を用いることがないのでキャリア箔の
コストも不要で、且つキャリア箔を除去する工程も不要
となるもので、以下本発明の詳細な説明する。The present invention involves laminating and molding a laminate in which metal foil with a thickness of 3 to 12 microns and a resin layer of 1 to 10 f/v1 is disposed on the upper and/or lower surfaces of a required number of resin-impregnated substrates. Due to the unique manufacturing method of the laminate, the stiffness of the ultra-thin metal foil becomes strong, there are no wrinkles or bends, and the cine yield is reduced. Also, since no carrier foil is used, there is no need for carrier foil costs. Moreover, the step of removing the carrier foil is also unnecessary, and the present invention will be described in detail below.
本発明に用いる樹脂含浸基材の樹脂としては、フェノー
ル樹脂、クレゾール樹脂、エポキシ樹脂、不飽和ポリエ
ステル樹脂、メラミン樹脂、ポリイミド、ポリブタジェ
ン、ポリアミド、ポリアミドイミド、ホリスルフオン、
ホリフエニレンサルファイド、ポリフェニレンオキサイ
ド、ポリブチレンテレフタレート、ポリエーテルエーテ
ルケトン、弗化樹脂等の単独、変性物、混合物等が用い
られ必要に応じて粘度調整に水、メチルアルコール、ア
セトン、シクロヘキサノン、スチレン等の溶媒を添加し
たもので、基材としてはガラス、アスベスト等の無機繊
維やポリエステル、ポリアミド、ポリビニルアルコール
、アクリル等の有QJ 合成lj&維や木綿等の天然繊
維からなる織布、不織布、マット或は紙又はこれらの組
合せ基材等である。樹脂付金属箔の金属箔としては銅、
アルミニウム、鉄、ニッケル、亜鉛等の単独、合金、複
合品からなる金属箔で、その片面に樹脂含浸基材に用い
られる樹脂群から選ばれた樹脂を乾燥後の樹脂量が1〜
Zoo fy扉になるよう(でつけたものである。金属
箔の厚みは3〜12ミクロンである。′即ち樹脂量がl
fβ未満では極薄金属箔の腰を強くすることができず、
1001/Wをこえると積層成形時に流出し積層板を汚
染する。又金属箔の厚みが3ミクロン未満では樹脂層を
設けても腰を強くすることができず、ηミクロンをこえ
ると樹脂層なしでも腰が強く樹脂層を設ける意味がなく
なるからである。Examples of resins for the resin-impregnated base material used in the present invention include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, phorisulfon,
Polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. alone, modified products, mixtures, etc. are used. Water, methyl alcohol, acetone, cyclohexanone, styrene, etc. are used to adjust the viscosity as necessary. The base materials include inorganic fibers such as glass and asbestos, polyester, polyamide, polyvinyl alcohol, acrylic, etc. Woven fabrics, non-woven fabrics, mats, etc. made of synthetic lj & natural fibers such as fibers and cotton. is paper or a combination of these materials, etc. Copper is used as the metal foil for resin-coated metal foil.
A metal foil made of single, alloy, or composite materials such as aluminum, iron, nickel, and zinc, on one side of which is impregnated with a resin selected from the group of resins used for resin-impregnated base materials with a dry resin amount of 1 to 1.
The thickness of the metal foil is 3 to 12 microns. That is, the amount of resin is l
If it is less than fβ, it is not possible to strengthen the stiffness of the ultra-thin metal foil,
If it exceeds 1001/W, it will flow out during lamination molding and contaminate the laminated plate. Further, if the thickness of the metal foil is less than 3 microns, even if a resin layer is provided, it cannot be made stiffer, and if it exceeds η microns, the stiffness will be strong even without a resin layer, and there is no point in providing a resin layer.
積層成形については多段プレス法、マルチロール法、ダ
ブルベルト法、無圧積層成形法、真空成形法等が用いら
れ特に限定するものではない。As for lamination molding, a multi-stage press method, a multi-roll method, a double belt method, a pressureless lamination molding method, a vacuum molding method, etc. are used, and there are no particular limitations.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例1乃至3
エポキシ樹脂(シェル化学株式会社製、品番エピコー)
1001 ) 100重量部C以下単に部と記す)に
対してジンアンジアミド4部、ベンジルジメチルアミン
0.2部、メチルオキシド−A/ 100部を加えてな
るエポキシ樹脂フェスに、厚み0.2ffのガラス布を
乾燥後の樹脂量が(資)重量96(以下単に%と記す)
になるように含浸、乾燥して得た樹脂含浸基材7枚の上
下面に、上記エポキシ樹脂フェスを乾燥後の樹脂量が実
施例1については5か〆、実施例2については50 f
/d、実施例3については90 ff1lになるように
厚み3ミクロンの銅箔に夫々塗布、乾燥した樹脂層付銅
箔を夫々配設した積層体を成形圧力4Dkg7匈、16
5°Cで120分間積層成形して厚み1.6Hの両面鋼
張積層板を得た。Examples 1 to 3 Epoxy resin (manufactured by Shell Chemical Co., Ltd., product number Epicor)
1001) An epoxy resin face of 0.2 ff thickness was added to 4 parts of dianediamide, 0.2 parts of benzyldimethylamine, and 100 parts of methyl oxide-A to 100 parts by weight (hereinafter referred to simply as parts). The amount of resin after drying the glass cloth is (weight) 96 (hereinafter simply written as %)
The amount of resin after drying was applied to the upper and lower surfaces of 7 resin-impregnated base materials obtained by impregnating and drying so that the amount of resin after drying was 5 for Example 1 and 50 f for Example 2.
/d, for Example 3, a laminate in which copper foil with a resin layer was coated and dried to a thickness of 3 microns so as to have a thickness of 90 ff1l was molded at a pressure of 4 Dkg, 7 匈, 16
Lamination molding was performed at 5°C for 120 minutes to obtain a double-sided steel clad laminate with a thickness of 1.6H.
比較例1
厚み3ミクロンの銅箔をそのまま用いた以外は実施例と
同様に処理して積層板を得た。Comparative Example 1 A laminate was obtained in the same manner as in the example except that the copper foil with a thickness of 3 microns was used as it was.
比較例2
厚み3ミクロンの銅箔に、厚み迅ミクロンのアルミニウ
ム箔をキャリア箔として一体化した金属箔を用いた以外
は実施例と同様に処理して積層板を得た。Comparative Example 2 A laminate was obtained in the same manner as in Example except that a metal foil in which a 3 micron thick copper foil was integrated with a 3 micron thick aluminum foil as a carrier foil was used.
実施例1乃至3と比較例1及び2の積層板の性能は第1
表のようである。The performance of the laminates of Examples 1 to 3 and Comparative Examples 1 and 2 was the first.
It looks like a table.
第1表 注 組 比較例1を100とした場合の比である。Table 1 note This is the ratio when Comparative Example 1 is set as 100.
本発明は上述した如く構成されている。特許請求の範囲
第1項に記載した構成を有する積層板の製造方法におい
ては不良率、コスト、作業工数が低下する効果を有して
いる。The present invention is constructed as described above. The method for manufacturing a laminate having the structure described in claim 1 has the effect of reducing the defective rate, cost, and work man-hours.
Claims (1)
面に、樹脂層を1〜100g/m^3つけた厚み3〜1
2ミクロンの金属箔を配設した積層体を積層成形するこ
とを特徴とする積層板の製造方法。(1) A resin layer of 1 to 100 g/m^3 is applied to the upper and/or lower surfaces of the required number of resin-impregnated substrates, with a thickness of 3 to 1
A method for manufacturing a laminate, characterized by laminating and molding a laminate on which 2 micron metal foil is arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17160188A JPH0220337A (en) | 1988-07-08 | 1988-07-08 | Preparation of laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17160188A JPH0220337A (en) | 1988-07-08 | 1988-07-08 | Preparation of laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0220337A true JPH0220337A (en) | 1990-01-23 |
Family
ID=15926192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17160188A Pending JPH0220337A (en) | 1988-07-08 | 1988-07-08 | Preparation of laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0220337A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5283501A (en) * | 1991-07-18 | 1994-02-01 | Motorola, Inc. | Electron device employing a low/negative electron affinity electron source |
| WO2003020000A1 (en) * | 2001-08-22 | 2003-03-06 | World Properties Inc. | Method for improving bonding of circuit substrates to metal and articles formed thereby |
| CN110239163A (en) * | 2019-06-13 | 2019-09-17 | 陈建义 | A kind of flexible printed circuit board substrate improving adhesive property between PI film and Cu foil |
-
1988
- 1988-07-08 JP JP17160188A patent/JPH0220337A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5283501A (en) * | 1991-07-18 | 1994-02-01 | Motorola, Inc. | Electron device employing a low/negative electron affinity electron source |
| WO2003020000A1 (en) * | 2001-08-22 | 2003-03-06 | World Properties Inc. | Method for improving bonding of circuit substrates to metal and articles formed thereby |
| CN110239163A (en) * | 2019-06-13 | 2019-09-17 | 陈建义 | A kind of flexible printed circuit board substrate improving adhesive property between PI film and Cu foil |
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