JPH0220340A - Preparation of laminated sheet - Google Patents

Preparation of laminated sheet

Info

Publication number
JPH0220340A
JPH0220340A JP63171610A JP17161088A JPH0220340A JP H0220340 A JPH0220340 A JP H0220340A JP 63171610 A JP63171610 A JP 63171610A JP 17161088 A JP17161088 A JP 17161088A JP H0220340 A JPH0220340 A JP H0220340A
Authority
JP
Japan
Prior art keywords
resin
base material
impregnation
impregnated
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63171610A
Other languages
Japanese (ja)
Inventor
Kunio Sakamoto
邦夫 坂本
Sunao Ikoma
生駒 直
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP63171610A priority Critical patent/JPH0220340A/en
Publication of JPH0220340A publication Critical patent/JPH0220340A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)

Abstract

PURPOSE:To obtain a laminated sheet excellent in capacity by the uniform impregnation with a resin by superposing resin impregnated base material after the contact impregnation with a resin varnish each other and laminating a metal foil to the upper or lower surface of the superposed one to perform molding. CONSTITUTION:A long strip like base material is used and, pref., glass cloth or paper having high thickness control effect is desirable. As resin varnish, an unsaturated polyester resin, a vinyl ester resin, an epoxy resin, a phenol resin, a polyimide resin, a modified resin or a mixture thereof can be used. The resin amount of a resin impregnated base material is 5-20wt.%, pref., 40-60wt.% as a whole in contact impregnation. In single surface impregnation from an upper surface, an impregnation method by casting, spraying, transfer or coating is used and the casting method is desirably used because the air contained in the base material is easily reduced. As a metal foil, a single or composite foil composed of copper, aluminum or iron is used.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電子機器、電気機器、コンピューター通信機器
等に用いられる積層板の製造方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a laminate used in electronic equipment, electrical equipment, computer communication equipment, etc.

〔従来の技術〕[Conventional technology]

従来、積層板の連続製造方法は特開昭56−13136
に記載されているように樹脂ワニスを1回含浸させる丈
で樹脂含浸基材を得、該樹脂含浸基材を所要枚数重ねて
連続成形しているが、−同含浸丈では基材に均一に樹脂
含浸させ難い、問題があった。
Conventionally, the continuous manufacturing method for laminated plates was disclosed in Japanese Patent Application Laid-Open No. 56-13136.
As described in , a resin-impregnated base material is obtained with a length that allows one-time impregnation with resin varnish, and the required number of resin-impregnated base materials are stacked and continuously molded. There was a problem that it was difficult to impregnate with resin.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来の技術で述べたように、積層板の連続成形において
1回丈の樹脂含浸では均一な樹脂含浸基材が得られない
。本発明は従来の技術における上述の問題点に鑑みてな
されたもので、その目的とするところは、樹脂が均一含
浸された樹脂含浸基材を得、性能の優れた積層板の製造
方法を提供することにある。
As described in the related art section, a uniform resin-impregnated base material cannot be obtained by impregnating the resin once in continuous molding of a laminate. The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to obtain a resin-impregnated base material uniformly impregnated with resin and to provide a method for manufacturing a laminate with excellent performance. It's about doing.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は長尺帯状基材の下面から樹脂ワニスを接触含浸
後、次に上面から樹脂ワニスを片面含浸させた樹脂含浸
基材の所要枚数を重ねた後、更にその上面及び又は下面
に金属箔を配設した積層体を連続的に積層成形すること
を特徴とする積層板の製造方法のため、2回含浸であっ
ても1回目は接触含浸で基材に無理な歪を与えることが
なく且つ基材中の内蔵空気を下方から上方に抵抗なく排
出することができ、2回含浸とあいまって樹脂を均一に
基材に含浸させることができるもので、以下水発明の詳
細な説明する。
The present invention involves contact impregnation with a resin varnish from the bottom surface of a long strip-shaped base material, then stacking the required number of resin-impregnated base materials with resin varnish impregnated on one side from the top surface, and then further applying metal foil to the top and/or bottom surfaces. Because the manufacturing method of the laminate is characterized by continuous lamination molding of the laminate provided with the laminate, even if it is impregnated twice, the first time is contact impregnation and does not cause unreasonable distortion to the base material. In addition, the built-in air in the base material can be discharged from the bottom to the top without any resistance, and in combination with double impregnation, the base material can be uniformly impregnated with the resin.The water invention will be described in detail below.

本発明に用いる長尺帯状基材としては、ガラス布、ガフ
スベーバー、ガラス不織布等のがフス系基材に加え紙、
合成繊維布、合成繊維不織布、アスベストベーパー、木
綿布等が用いられるが、好ましくは厚み調整効果の大き
いガラス布、紙を用いることが望ましい。樹脂ワニス・
とじては不飽和ポリエステル系樹脂、ビニルエステル系
樹脂、エポキシ系樹脂、フェノール系樹脂、ポリイミド
系樹脂等の単独、変性物、混合物等を用いることができ
る。なお1次、2次の含浸樹脂は同様であってもよく、
又、異様であってもよく任意である。
The long strip-shaped substrate used in the present invention includes glass cloth, gaffs fabric, glass nonwoven fabric, etc., as well as paper,
Synthetic fiber cloth, synthetic fiber nonwoven fabric, asbestos vapor, cotton cloth, etc. are used, but it is preferable to use glass cloth or paper, which has a large thickness adjustment effect. Resin varnish/
For binding, unsaturated polyester resins, vinyl ester resins, epoxy resins, phenol resins, polyimide resins, etc. may be used alone, modified products, or mixtures thereof. Note that the primary and secondary impregnating resins may be the same,
Moreover, it may be unusual and arbitrary.

樹脂含浸基材の樹脂量としては、接触含浸においては5
〜20重量%(以下単に%と記す)、全体として菊〜ω
%が好ましい。上面からの片面含浸は流延、スプV−1
転写、塗布等の含浸方法が用いられ、特に限定しないが
流延法を用いることが基材中の内蔵空気を減少させ易く
望ましいことである。金属箔としては銅、アルミニウム
、鉄、ステンレス鋼、ニッケル、亜鉛、真鍮等の単独、
複合箔が用いられ必要に応じて金属箔の片面に接着剤層
を設けておき、よシ接着性を向上させることもできる。
The amount of resin in the resin-impregnated base material is 5 for contact impregnation.
~20% by weight (hereinafter simply referred to as %), overall chrysanthemum~ω
% is preferred. Single-sided impregnation from the top is by casting, sp V-1
Impregnation methods such as transfer and coating are used, and although not particularly limited, it is desirable to use a casting method because it facilitates reducing the amount of built-in air in the base material. Metal foils include copper, aluminum, iron, stainless steel, nickel, zinc, brass, etc.
If a composite foil is used, an adhesive layer can be provided on one side of the metal foil to improve adhesiveness, if necessary.

積層成形手段としては無圧積層成形、ダプルベ/l/ト
成形、マルチロール成形、引抜成形等のように連続的に
積層成形が行なえる方法であればよく、特に限定するも
のではない。
The lamination molding means is not particularly limited, and may be any method that allows continuous lamination molding, such as pressureless lamination molding, duplex molding, multi-roll molding, pultrusion molding, or the like.

以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.

実施例 厚さ0.2羽のクラフト紙に不飽和ポリエステル樹脂を
キツスロール方式で下面から接触含浸させて樹脂!10
%の樹脂含浸基材を得、次に該樹脂含浸基材の上面から
上記と同じ樹脂を流延方式で片面含浸させ全体樹脂量が
50%の樹脂含浸基材を得、該樹脂含浸基材7枚を重ね
た上下面に厚み0.035順の接着剤層付銅箔を、接着
剤層を内側にして配設した積層体を無圧下、160°C
で10分間連続的に加熱した後、所要寸法に切断して積
層板を得た。
Example: 0.2 sheets of kraft paper is impregnated with unsaturated polyester resin from the bottom using a kit roll method. 10
% of the resin-impregnated base material, and then one side of the resin-impregnated base material was impregnated with the same resin as above using a casting method to obtain a resin-impregnated base material with a total resin amount of 50%, and the resin-impregnated base material A laminate in which copper foil with an adhesive layer of 0.035 thickness was placed on the top and bottom surfaces of seven stacked sheets with the adhesive layer on the inside was heated at 160°C without pressure.
After heating continuously for 10 minutes, the laminate was cut into required dimensions to obtain a laminate.

比較例 実施例のキツスロール方式接触含浸をせず、直ちに上面
からの流延方式で片面含浸させ、樹脂量50%の樹脂含
浸基材を得、該樹脂含浸基材を用いた以外は実施例と同
様に処理して積層板を得た。
Comparative Example Same as the example except that the kitsu roll method contact impregnation of the example was not performed, and one side was immediately impregnated by the casting method from above to obtain a resin-impregnated base material with a resin amount of 50%. A laminate was obtained by the same treatment.

実施例及び比較例の積層板の性能は第1表のようである
The performance of the laminates of Examples and Comparative Examples is shown in Table 1.

第1表 注 *100”Cの熱水中で2時間処理後。Table 1 note *After treatment in hot water at 100”C for 2 hours.

〔発明の効果〕〔Effect of the invention〕

本発明は上述した如く構成されている。特許請求の範囲
第1項に記載した構成を有する積層板の製造方法におい
ては、性能がよく、且つ性能バフツキがない効果を有し
ている。
The present invention is constructed as described above. The method for manufacturing a laminate having the structure described in claim 1 has the advantage of good performance and no performance buffing.

Claims (1)

【特許請求の範囲】[Claims] (1)長尺帯状基材の下面から樹脂ワニスを接触含浸後
、次に上面から樹脂ワニスを片面含浸させた樹脂含浸基
材の所要枚数を重ねた後、更にその上面及び又は下面に
金属箔を配設した積層体を連続的に積層成形することを
特徴とする積層板の製造方法。
(1) After contact impregnation with resin varnish from the bottom surface of a long strip-shaped substrate, then stack the required number of resin-impregnated substrates with one side impregnated with resin varnish from the top surface, and then coat the top and/or bottom surfaces with metal foil. 1. A method for producing a laminate, comprising continuously laminating and molding a laminate in which the laminate is disposed.
JP63171610A 1988-07-08 1988-07-08 Preparation of laminated sheet Pending JPH0220340A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63171610A JPH0220340A (en) 1988-07-08 1988-07-08 Preparation of laminated sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63171610A JPH0220340A (en) 1988-07-08 1988-07-08 Preparation of laminated sheet

Publications (1)

Publication Number Publication Date
JPH0220340A true JPH0220340A (en) 1990-01-23

Family

ID=15926362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63171610A Pending JPH0220340A (en) 1988-07-08 1988-07-08 Preparation of laminated sheet

Country Status (1)

Country Link
JP (1) JPH0220340A (en)

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