JPH01123740A - Laminated plate for electric use - Google Patents
Laminated plate for electric useInfo
- Publication number
- JPH01123740A JPH01123740A JP28276087A JP28276087A JPH01123740A JP H01123740 A JPH01123740 A JP H01123740A JP 28276087 A JP28276087 A JP 28276087A JP 28276087 A JP28276087 A JP 28276087A JP H01123740 A JPH01123740 A JP H01123740A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- impregnated
- lower surfaces
- hollow filler
- laminated plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims abstract description 19
- 239000000945 filler Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000011888 foil Substances 0.000 claims abstract description 8
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 5
- 229920005989 resin Polymers 0.000 abstract description 24
- 239000011347 resin Substances 0.000 abstract description 24
- 239000004744 fabric Substances 0.000 abstract description 12
- 239000002966 varnish Substances 0.000 abstract description 6
- 238000001035 drying Methods 0.000 abstract description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 238000003475 lamination Methods 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 abstract description 2
- 238000005470 impregnation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- -1 shirasu balloons Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229910001562 pearlite Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は″W、気t気路1語子機器、計算機器、通信機
器6に用いられる?!電気用積層板関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an electrical laminate used for "W", airway single-word child equipment, computing equipment, and communication equipment 6.
従来、電気用積層板は樹脂含浸紙や樹脂含浸ガラス基材
を夫々所要枚数重ね、更にその上面及び又は下面に金属
箔を配設した積層体を積層成形して得られるもので、プ
リント配線板への加工に際して行なう穴あけ加工は、前
者については紙基材のため強度は低いがパンチング加工
できる利点がHあり、後者についてはガラス布基材のた
め強度は1大きいがドリル加工しかできない制約があっ
た。Conventionally, electrical laminates are obtained by stacking a required number of resin-impregnated paper or resin-impregnated glass substrates, and then forming a laminate with metal foil on the top and/or bottom surfaces. The former has the advantage of being able to be punched, although its strength is low because it is made of paper, while the latter has the advantage of being able to be punched because it is made of glass cloth, while the latter has the advantage of being able to punch holes because it is made of glass cloth. Ta.
:〔発明の目的〕
、 本発明の目的とするところは強度が大きく且つパン
チング加工できろ?!気用@M板を提供することにある
。: [Object of the invention] The object of the invention is to have high strength and be able to be punched. ! Our goal is to provide the Kiyo@M board.
本発明は所要枚数の中空充填剤含有樹脂含浸基材の上下
面【、所要枚数の樹脂含浸ガラス布を重ね、更にその上
面及び又は下面に金属箔を配設した′WIWII体を積
層成形してなることを特徴とする電気用WIH板のため
強度は上下面のm脂含浸ガブス布周で、パンチング加工
性は上下面の樹脂含浸ガラス布の中間に介在する中空充
填剤含有樹脂含浸基材でパンチング性を大巾に向上させ
ることができたもので、以下本発明の詳細な説明する。The present invention involves laminating and molding a 'WIWII' body in which a required number of resin-impregnated glass cloths are layered on the upper and lower surfaces of a resin-impregnated base material containing a hollow filler, and metal foil is further arranged on the upper and/or lower surfaces. Because it is a WIH board for electrical use, its strength comes from the circumference of the m-lipid-impregnated gubbed cloth on the top and bottom surfaces, and the punching workability comes from the hollow filler-containing resin-impregnated base material interposed between the resin-impregnated glass cloth on the top and bottom surfaces. This invention was able to greatly improve punching properties, and the present invention will be described in detail below.
本発明に用いる中空充填剤含有樹脂基材としてはシラス
バルーン、ガラスバルーン、パーライト、蛭石等の中空
充填剤をフェノ−/I/樹脂、クレゾー/L’樹脂、エ
ポキシ樹脂、不飽和ゼリエステ/L’樹脂、メラミン樹
脂、ポリイミド樹脂、ポリゲタジエン樹脂、ポリアミド
樹脂、弗化樹脂、ポリフェニレンオキサイドw脂、ポリ
フェニレンサルファイド樹脂、ポリブチレンテレフタレ
ート樹脂、ポリエチレンテレフタレート樹脂等の単独、
混合物、変性物等に含有させた樹脂液をがフス織布、が
フス不織布、ガラスペーパー、合成繊維の織布や不織布
、紙等の基材に含浸させたものである。中空充填剤の量
は好ましくは樹脂に対し1−4:)rLf!に%(以下
単に%と記す)が望ましい。即ち1%未満ではパンチン
グ性が向上しs<、50%をこえると基材に対する浸透
性が低下し、tgC絶縁性、耐水性が低下する傾向にあ
る75為らである。樹脂含浸ガラス布としては上記の樹
脂をガラス織布、ガラス不織布、がラスペーパー等のが
フス布基材に含浸したものである。金属箔としては銅、
アルミニウム、鉄、ステンレス鋼1.lc鍮、ニッケル
、亜鉛等の金属箔を用いるが、必要に応じて金属箔の片
面に接着剤層を設けておき、接着性を向上させることも
できるものである。積層成形としては多段プレス法、ダ
ブルベルト法、マルチロール法、無圧法等が用いられ使
用する樹脂に応じた加熱温度、加熱時間が用いられ、圧
力についても樹脂に応じた無圧、積層体自重による自重
圧、接触圧、低圧、高圧が用いられ特に限定するもので
はない。The hollow filler-containing resin base materials used in the present invention include hollow fillers such as shirasu balloons, glass balloons, pearlite, and vermiculite. Resin, melamine resin, polyimide resin, polygetadiene resin, polyamide resin, fluorinated resin, polyphenylene oxide w fat, polyphenylene sulfide resin, polybutylene terephthalate resin, polyethylene terephthalate resin, etc. alone,
A resin liquid contained in a mixture, modified product, etc. is impregnated into a base material such as woven fabric, nonwoven fabric, glass paper, synthetic fiber woven fabric or nonwoven fabric, or paper. The amount of hollow filler is preferably 1-4:)rLf! to resin. % (hereinafter simply referred to as %) is desirable. That is, if it is less than 1%, the punching property improves, but if it exceeds s<50%, the permeability to the base material decreases, and the tgC insulation properties and water resistance tend to decrease75. The resin-impregnated glass cloth is obtained by impregnating a glass cloth base material such as a glass woven cloth, a glass non-woven cloth, or a lath paper with the above-mentioned resin. Copper as metal foil,
Aluminum, iron, stainless steel 1. A metal foil such as LC brass, nickel, or zinc is used, but if necessary, an adhesive layer can be provided on one side of the metal foil to improve adhesiveness. For lamination molding, multi-stage press method, double belt method, multi-roll method, no-pressure method, etc. are used, and the heating temperature and heating time are depending on the resin used, and the pressure is also no-pressure depending on the resin, and the laminate's own weight. Self-weight pressure, contact pressure, low pressure, and high pressure are used, and are not particularly limited.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
エポキシ樹脂(Vエル化学株式会社製、商品名工ピコ−
) 10013100重量部C以下単に部と記ス)、ジ
シアンジアミド4部、ベンジルジメチル7を70.2部
、ンフスバルーン10部、メチルオキ$/)−A/Zo
o部からなる樹脂ワニスを厚さ0.2Hのガラス不織布
に乾燥後の樹脂量が45%になるように含浸、乾燥させ
て得た中空充填剤含有樹脂含浸基材5枚の上下面に、エ
ポキシ樹脂(V−C/I/化学株式会社製、商品名エピ
コート10017100部、!/Vアンジアミド4部、
ベンジルジメチルアミン0.2部、メチルオキントーf
i/100部からなる樹脂ワニスを厚さ0.2 Bのガ
ラス布に乾燥後樹脂量がmHになるように含浸、乾燥さ
せて得た樹脂含浸ガラス布を夫々1枚づつ重ね、更にそ
の上下面に厚さ0.035111の銅箔を夫々配設した
積層体を成形圧力荀に9/14.165℃で120分間
積層成形して厚さ1.6霧の両面鋼張積層板を得た。Example epoxy resin (manufactured by Vell Chemical Co., Ltd., product: Meiko Pico)
) 10013100 parts by weight C), 4 parts of dicyandiamide, 70.2 parts of benzyldimethyl 7, 10 parts of balloon, methyl oxide $/)-A/Zo
On the top and bottom surfaces of five hollow filler-containing resin-impregnated substrates obtained by impregnating a glass nonwoven fabric with a thickness of 0.2H with a resin varnish consisting of part o so that the resin amount after drying becomes 45%, and drying the resin varnish, Epoxy resin (VC/I/manufactured by Kagaku Co., Ltd., trade name Epicote 10017, 100 parts, !/Vandiamide 4 parts,
0.2 parts of benzyldimethylamine, methylokinto f
After drying, impregnate a glass cloth with a thickness of 0.2 B with a resin varnish consisting of 1/100 parts so that the amount of resin becomes mH, and then dry the resulting resin-impregnated glass cloth. The laminates each having a copper foil with a thickness of 0.035111 placed on the lower surface were laminated under a molding pressure of 9/14 at 165°C for 120 minutes to obtain a double-sided steel-clad laminate with a thickness of 1.6 mm. .
比較例
実施例と同じ樹脂量ω%の樹脂含浸ガラス布7枚を重ね
た上下面に厚さ0.035ffの鋼箔を夫々配設した積
層体を成形圧力40 kgm 、16 s℃で120分
間積層成形して厚さ1.6Hの両面鋼張積層板を得た。Comparative Example A laminate consisting of 7 sheets of resin-impregnated glass cloth with the same resin content ω% as in the example and with steel foils each having a thickness of 0.035 ff placed on the top and bottom surfaces was molded at a pressure of 40 kgm and at 16 s°C for 120 minutes. A double-sided steel clad laminate having a thickness of 1.6H was obtained by lamination molding.
実施例及び比較例の積層板の性能は、第1表で明白なよ
うに本発明のものの性能はよく、本発明の電気用積層板
の優れていることを確認した。As is clear from Table 1, the performance of the laminates of the Examples and Comparative Examples was good, confirming that the electrical laminates of the present invention were superior.
第 1 表Chapter 1 Table
Claims (1)
に、所要枚数の樹脂含浸ガラス布を重ね、更にその上面
及び又は下面に金属箔を配設した積層体を積層成形して
なることを特徴とする電気用積層板。(1) The required number of resin-impregnated glass cloths are layered on the upper and lower surfaces of the required number of hollow filler-containing resin-impregnated base materials, and a laminate is formed by laminating and molding a laminate in which metal foil is further arranged on the upper and/or lower surfaces. An electrical laminate board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28276087A JPH01123740A (en) | 1987-11-09 | 1987-11-09 | Laminated plate for electric use |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28276087A JPH01123740A (en) | 1987-11-09 | 1987-11-09 | Laminated plate for electric use |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123740A true JPH01123740A (en) | 1989-05-16 |
Family
ID=17656709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28276087A Pending JPH01123740A (en) | 1987-11-09 | 1987-11-09 | Laminated plate for electric use |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123740A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03127894A (en) * | 1989-10-13 | 1991-05-30 | Toshiba Chem Corp | Laminated board for printed circuit |
-
1987
- 1987-11-09 JP JP28276087A patent/JPH01123740A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03127894A (en) * | 1989-10-13 | 1991-05-30 | Toshiba Chem Corp | Laminated board for printed circuit |
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