JPH02202090A - Large current board device - Google Patents
Large current board deviceInfo
- Publication number
- JPH02202090A JPH02202090A JP2112189A JP2112189A JPH02202090A JP H02202090 A JPH02202090 A JP H02202090A JP 2112189 A JP2112189 A JP 2112189A JP 2112189 A JP2112189 A JP 2112189A JP H02202090 A JPH02202090 A JP H02202090A
- Authority
- JP
- Japan
- Prior art keywords
- bus bar
- lead terminal
- board
- circuit element
- type lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
この発明は、大電流基板装置に関し、特に回路素子およ
びバスバーの固定方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a large current board device, and particularly to a method for fixing circuit elements and bus bars.
[従来の技術]
第2図は、例えば実開昭55−77882号公報に示さ
れた従来の大電流基板装置の要部の構成を示す断面図で
ある0図において、tl>はバスバ(2)はバスバー(
1)のバーリング部、(3)は回路素子、(4)はリー
ド端子、(5)はバーリング部(2)の透孔、(6)は
基板、(7)は基板(6)の挿入透孔、(8)は基板(
6)とバスバー(1)間に介在する銅箔パターン、(9
)は半田である。[Prior Art] FIG. 2 is a cross-sectional view showing the configuration of the main parts of a conventional large current board device disclosed in, for example, Japanese Utility Model Application Publication No. 55-77882. ) is the busbar (
1) is the burring part, (3) is the circuit element, (4) is the lead terminal, (5) is the through hole of the burring part (2), (6) is the board, and (7) is the insertion hole of the board (6). hole, (8) is the substrate (
6) and the copper foil pattern interposed between the bus bar (1) and the bus bar (1).
) is solder.
基板(6)の挿入透孔(7)にはバスバー(1)のバー
リング部(2) が挿入されている。このバーリング部
(2)の透孔(5)には回路素子(3)のリード端子(
4)が挿入され、溶融半田によって半田付けされ、バス
バー(1)とリード端子(4)の電気的接続が行なわれ
ている。The burring portion (2) of the bus bar (1) is inserted into the insertion hole (7) of the substrate (6). The through hole (5) of this burring part (2) has a lead terminal (
4) is inserted and soldered with molten solder to establish an electrical connection between the bus bar (1) and the lead terminal (4).
第2図から明らかなように、回路素子(3)のリード端
子(4)はバーリング部(2)で直接バスバー+1)と
接続されているので、その導通路の電気インピーダンス
を低減することができる。As is clear from Figure 2, the lead terminal (4) of the circuit element (3) is directly connected to the bus bar +1 at the barring part (2), so the electrical impedance of the conduction path can be reduced. .
[発明が解決しようとする課題]
従来の大電流基板装置は以上のように構成されているの
で、バスバー(11のバーリング部(2)が各リード端
子(4) との半田付は性を良くするためにテーパー状
となっており、テーパーの先端付近で半田付けしている
。このため、バスバー(1)と半田(9)との電気的接
続の信頼性が悪く、インピーダンスの低減にも限界があ
る。また、このようなバスバー(1)の形状や固定方法
では機械的にも弱く、大電流を流すのに不向きである。[Problems to be Solved by the Invention] Since the conventional high-current board device is configured as described above, the barring portion (2) of the bus bar (11) can be soldered to each lead terminal (4) with good soldering properties. It has a tapered shape and is soldered near the tip of the taper.For this reason, the reliability of the electrical connection between the bus bar (1) and the solder (9) is poor, and there is a limit to the reduction of impedance. Furthermore, the shape and fixing method of the bus bar (1) is mechanically weak and unsuitable for passing large currents.
さらに、バスバー+1)は基板(6)に銅箔パターン(
8)を介して半田付は固定されているが、バスバー(1
)を固定する目的のみで銅箔パターン(8) を形成す
ることは、作業が面倒で工程が長くなり、製造コストの
低減にも逆行するものであるなどの問題点があった。Furthermore, the busbar +1) is attached to the copper foil pattern (
The soldering is fixed via the bus bar (1).
) There are problems in that forming the copper foil pattern (8) only for the purpose of fixing the copper foil pattern (8) is cumbersome and prolongs the process, and goes against the reduction in manufacturing costs.
この発明は上記のような問題点を解消するためになされ
たもので、電気的接続の信頼性および機械的強度が向上
して大電流低インピーダンスの通電が可能で、しかも生
産性の向上した大電流基板装置を得ることを目的とする
。This invention was made in order to solve the above problems, and it is possible to improve the reliability and mechanical strength of electrical connections, to enable the conduction of large currents and low impedance, and to improve productivity. The purpose is to obtain a current substrate device.
し課題を解決するための手段]
この発明に係る大電流基板装置は、挿入透孔を有する基
板、バーリング長さが上記挿入透孔の深さを越えないバ
ーリング部を有し、このバーリング部が上記挿入透孔に
挿入されて嵌合するバスバ、先端部にねじ山が形成され
た先端側小径リード端子が上記バーリング部に貫挿され
るとともに根本側の大径リード端子が上記バスバーに当
接する回路素子、および上記小径リード端子のねじ山と
螺合して上記回路素子を固定するナツトを備えたもので
ある。[Means for Solving the Problems] A large current board device according to the present invention includes a board having an insertion hole, a burring portion whose burring length does not exceed the depth of the insertion hole, and the burring portion has a A circuit in which a bus bar is inserted and fitted into the insertion hole, a small diameter lead terminal on the distal end with a thread formed at the tip is inserted through the bar ring part, and a large diameter lead terminal on the base side comes into contact with the bus bar. The circuit element is provided with a nut that is screwed into the screw thread of the small-diameter lead terminal to fix the circuit element.
[作用]
この発明においては、回路素子は大径リード端子とナツ
トによりバスバーと基板を挾んで固定され、しかも回路
素子の大径リード端子とバスバーとの接触が面接触とな
るため、機械的強度および電気的接続の信頼性が非常に
向上し、電気インピーダンスを低減し、大電流を流すこ
とができる。[Function] In this invention, the circuit element is fixed between the bus bar and the board by the large diameter lead terminal and the nut, and the contact between the large diameter lead terminal of the circuit element and the bus bar is surface contact, so that the mechanical strength is improved. The reliability of electrical connections is greatly improved, electrical impedance is reduced, and large currents can flow.
さらに、バスバーを基板に固定するための銅箔パターン
は不要となるので、作業が簡素化されて生産性が著しく
向上し、用途拡大が可能となる。Furthermore, since a copper foil pattern for fixing the bus bar to the board is not required, the work is simplified, productivity is significantly improved, and applications can be expanded.
[実施例]
以下、この発明の一実施例を図について説明する。第1
図において、(21)はバスバー(1)のバーリング部
であり、そのバーリング長さが基板(6)の挿入透孔(
7)の深さを越えないように構成されており、バーリン
グ部(21)を基板(6)の挿入透孔(7)に挿入した
とき、この例では間隙(10)が生じる。(41)は根
本側の大径リード端子であり、回路素子(3)に固定さ
れている。(42)は先端部にねじ山が形成された先端
側小径リード端子、(+ 11はナツトである。[Example] Hereinafter, an example of the present invention will be described with reference to the drawings. 1st
In the figure, (21) is the burring part of the bus bar (1), and the burring length is the insertion hole (21) of the board (6).
7), and when the burring portion (21) is inserted into the insertion hole (7) of the substrate (6), a gap (10) is created in this example. (41) is a large diameter lead terminal on the root side, which is fixed to the circuit element (3). (42) is a small-diameter lead terminal on the tip side with a thread formed at the tip, and (+11 is a nut).
基板(6)の挿入透孔(7)にバスバー(1)のバーリ
ング部(21)が挿入されて嵌合している。さらに、バ
スバー+11の上から回路素子(3)の小径リード端子
(42)が貫挿されている。この時、大径リード端子(
41)がバスバー(1)に当接して挿入寸法を限定する
ストッパーの役目を果たし、小径リード端子(42)の
ねじ部が基板(6)から突出するように構成されており
、突出した小径リード端子(42)のねじ部にナツト(
I 1)をねじ込みバスバー(1)および基板(6)を
締め付けることによって回路素子(3)は強固に固定さ
れている。The burring portion (21) of the bus bar (1) is inserted and fitted into the insertion hole (7) of the substrate (6). Further, a small diameter lead terminal (42) of the circuit element (3) is inserted through the top of the bus bar +11. At this time, use the large diameter lead terminal (
41) comes into contact with the bus bar (1) and serves as a stopper to limit the insertion dimension, and the screw portion of the small diameter lead terminal (42) is configured to protrude from the board (6), and the small diameter lead terminal (42) that protrudes from the board (6) Attach a nut (
The circuit element (3) is firmly fixed by screwing in the bus bar (1) and the board (6).
[発明の効果]
以上のように、この発明によれば、挿入透孔を有する基
板、バーリング長さが上記挿入透孔の深さを越えないバ
ーリング部を有し、このバーリング部が上記挿入透孔に
挿入されて嵌合するバスバ、先端部にねじ山が形成され
た先端側小径リード端子が上記バーリング部に貫挿され
るとともに根本側の大径リード端子が上記バスバーに当
接する回路素子、および上記小径リード端子のねじ山と
螺合して上記回路素子を固定するナツトを備えたので、
電気的接続の信頼性および機械的強度が向上して大電流
低インピーダンスの通電が可能でしかも生産性の向上し
た大電流基板装置が得られる効果がある。[Effects of the Invention] As described above, according to the present invention, there is provided a substrate having an insertion hole, a burring portion whose burring length does not exceed the depth of the insertion hole, and this burring portion is connected to the insertion hole. a bus bar that is inserted and fitted into the hole, a circuit element in which a small diameter lead terminal on the distal end having a thread formed at the distal end is inserted through the bar ring part and a large diameter lead terminal on the root side abuts on the bus bar; Since it is equipped with a nut that screws into the thread of the small diameter lead terminal to fix the circuit element,
The reliability and mechanical strength of electrical connections are improved, and a large current board device that can conduct large current with low impedance and has improved productivity can be obtained.
第1図はこの発明の一実施例による大電流基板装置の要
部の構成を示す断面図、第2図は従来の大電流基板装置
の要部の構成を示す断面図である。
図において、(1)はバスバー (2)、(211はバ
ーリング部、(3)は回路素子、(4)はリード端子、
(41)は大径リード端子、(42)は小径リード端子
、(6) は基板、(7)は挿入透孔、(II)はナツ
トである。
なお、各図中同一符号は同一または相当部分を示す。FIG. 1 is a sectional view showing the structure of the main part of a large current board device according to an embodiment of the present invention, and FIG. 2 is a sectional view showing the structure of the main part of a conventional large current board device. In the figure, (1) is a bus bar (2), (211 is a barring part, (3) is a circuit element, (4) is a lead terminal,
(41) is a large diameter lead terminal, (42) is a small diameter lead terminal, (6) is a substrate, (7) is an insertion hole, and (II) is a nut. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
入透孔の深さを越えないバーリング部を有し、このバー
リング部が上記挿入透孔に挿入されて嵌合するバスバー
、先端部にねじ山が形成された先端側小径リード端子が
上記バーリング部に貫挿されるとともに根本側の大径リ
ード端子が上記バスバーに当接する回路素子、および上
記小径リード端子のねじ山と螺合して上記回路素子を固
定するナットを備えた大電流基板装置。(1) A substrate having an insertion hole, a burring portion whose burring length does not exceed the depth of the insertion hole, and a bus bar to which the burring portion is inserted and fitted into the insertion hole, and a tip portion thereof. A small-diameter lead terminal on the tip side with a thread formed thereon is inserted through the bar ring part, and a large-diameter lead terminal on the base side is screwed into the circuit element that comes into contact with the bus bar, and with the thread of the small-diameter lead terminal. A high-current board device equipped with nuts that secure circuit elements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2112189A JPH02202090A (en) | 1989-01-31 | 1989-01-31 | Large current board device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2112189A JPH02202090A (en) | 1989-01-31 | 1989-01-31 | Large current board device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02202090A true JPH02202090A (en) | 1990-08-10 |
Family
ID=12046050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2112189A Pending JPH02202090A (en) | 1989-01-31 | 1989-01-31 | Large current board device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02202090A (en) |
-
1989
- 1989-01-31 JP JP2112189A patent/JPH02202090A/en active Pending
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