JPH0220858Y2 - - Google Patents

Description

[Detailed Description of the Invention] "Purpose of the Invention" The present invention relates to the invention of a printed wiring board material, and aims to provide a novel printed wiring board material with increased signal transmission speed.

Industrial fields of use Base materials for printed wiring boards used in electronic devices, etc.

2. Description of the Related Art Printed wiring boards are widely used in electronic devices as an alternative to complicated conductor connections and arrangements. That is, such conventional printed wiring boards generally have conductors forming an electric circuit directly disposed on an epoxy base material, a glass epoxy base material, a ceramic base material, or the like.

Note that there is also one in which the circuit-forming conductor is directly adhesively formed on the surface of a flexible base material such as polyimide resin or polyester resin.

Problems that the invention aims to solve However, in recent years, ultra-high-speed devices such as gallium arsenide ICs have been developed, and increasing the speed of printed wiring boards such as the one mentioned above has become an issue.
The propagation time delay is affected by the dielectric constant of the material, and in order to increase the speed of equipment, it is required that the dielectric constant of the base material is small, but in the conventional products as mentioned above, this dielectric constant is 4 to 7. (at1 MHz), which is quite large, making it difficult to respond quickly enough to such requests.

"Structure of the invention" Means for solving the problem A polytetrafluoroethylene porous material is made into strips, and the porous strips are made of other materials such as epoxy resin, polyester resin, polyimide resin, or bismaleimide triazine resin. A printed wiring board material characterized by being mixed into a composite resin.

Function By cutting polytetrafluoroethylene into small pieces, it is evenly mixed and dispersed in other resins with different properties.

Since the strips are made porous, they can be properly bonded to other resins to obtain a composite and integrated substrate material.

EXAMPLE To explain the specific embodiment of the present invention as shown in the attached drawings, the porous material strips 2 made by rolling or stretching polytetrafluoroethylene are mixed with epoxy resin, polyester resin, polyimide resin, or bismaleimide resin. A sheet-like or plate-like molded product 10 is obtained by mixing and compounding other resin 1 such as triazine resin. Glass cloth 3 as shown in
or by interposing a piece of paper and integrating the impregnation. Dimensional stability can be improved.

The aforementioned polytetrafluoroethylene porous material strips 2 should have a size of 0.1 to 5 mm, particularly 0.5 to 1.0 mm, taking into consideration the dimensions of the base material to be obtained, and the amount of mixed material should be approximately 0.5 to 1.0 mm. It is preferable that the ratio is 0.5:2, particularly about 0.8 to 1.2 to the other resins mentioned above.

A specific manufacturing example of the product according to the present invention will be described below.

0.5~ of polytetrafluoroethylene porous material
The 1.0 mm size pieces were mixed with epoxy resin at a volume ratio of 1:1 and molded into a 1.6 mm thick plate, and the epoxy resin was cured to form a product. did.

In other words, when we measured the dielectric constant of this material, it was found to be 3.3, which was confirmed to be equivalently lower than the dielectric constant of 4.5 of the conventional material made only of epoxy resin. It was confirmed that the performance of the wiring board for electronic equipment can be appropriately improved.

``Effects of the invention'' According to the invention as explained above, polytetrafluoroethylene resin is made into a porous body due to differences in melting point and other factors, and this is made into small pieces, so that it can be used in epoxy, polyester and other resins. In this way, by adding and mixing polytetrafluoroethylene to epoxy resin, etc., the dielectric constant of printed wiring board materials can be appropriately lowered, improving the characteristics of modern ultra-high-speed devices, etc. It is possible to form an electric circuit that makes full use of this, and it is an idea that has great industrial effects.

[Brief explanation of the drawing]

The drawings show embodiments of the invention,
1 and 2 are sectional views of embodiments of the present invention, respectively. However, in these drawings, 1 indicates a resin other than an epoxy resin or a fluororesin, 2 a strip of polytetrafluoroethylene porous material, and 3 a glass cloth.

Claims (1)

[Claims for Utility Model Registration] 1. A polytetrafluoroethylene porous material is formed into strips, and the porous strips are placed in other resins such as epoxy resin, polyester resin, polyimide resin, or bismaleimide triazine resin. A printed wiring board material characterized by being mixed and composited. 2 Claim No. 1 for utility model registration in which glass cloth or paper pieces are also interposed and impregnated into a composite.
Printed wiring board material described in section.