JPH02211489A - 訓練および装置評価用プリント回路熱電対機構、その製作方法およびその使用法 - Google Patents

訓練および装置評価用プリント回路熱電対機構、その製作方法およびその使用法

Info

Publication number
JPH02211489A
JPH02211489A JP1306343A JP30634389A JPH02211489A JP H02211489 A JPH02211489 A JP H02211489A JP 1306343 A JP1306343 A JP 1306343A JP 30634389 A JP30634389 A JP 30634389A JP H02211489 A JPH02211489 A JP H02211489A
Authority
JP
Japan
Prior art keywords
thermocouple
printed circuit
circuit board
conductor
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1306343A
Other languages
English (en)
Japanese (ja)
Inventor
William J Siegel
ウィリアム・ジェイ・シーゲル
Louis A Abbagnaro
ルイス　エイ　アバナーロ
William J Kantter
ウィリアム　ジェイ　コウター
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pace Inc
Original Assignee
Pace Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pace Inc filed Critical Pace Inc
Publication of JPH02211489A publication Critical patent/JPH02211489A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09B—EDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
    • G09B19/00—Teaching not covered by other main groups of this subclass
    • G09B19/24—Use of tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Business, Economics & Management (AREA)
  • Entrepreneurship & Innovation (AREA)
  • Physics & Mathematics (AREA)
  • Educational Administration (AREA)
  • Educational Technology (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Electrically Operated Instructional Devices (AREA)
JP1306343A 1988-11-23 1989-11-24 訓練および装置評価用プリント回路熱電対機構、その製作方法およびその使用法 Pending JPH02211489A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US27643288A 1988-11-23 1988-11-23
US276432 1988-11-23

Publications (1)

Publication Number Publication Date
JPH02211489A true JPH02211489A (ja) 1990-08-22

Family

ID=23056648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1306343A Pending JPH02211489A (ja) 1988-11-23 1989-11-24 訓練および装置評価用プリント回路熱電対機構、その製作方法およびその使用法

Country Status (6)

Country Link
JP (1) JPH02211489A (fr)
CA (1) CA2003202A1 (fr)
DE (1) DE3938847A1 (fr)
FR (1) FR2646313A1 (fr)
GB (1) GB2225663B (fr)
IT (1) IT1236825B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019530514A (ja) * 2016-10-04 2019-10-24 セント・ジュード・メディカル，カーディオロジー・ディヴィジョン，インコーポレイテッド 可撓性電子回路を有するアブレーション・カテーテル・チップ

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2261984B (en) * 1991-11-27 1995-04-19 Automobile Ass Limited The Improvements in and relating to simulating electrical characteristics of components
CN110519910B (zh) * 2019-08-28 2020-10-16 生益电子股份有限公司 通过导电介质粘结散热介质的pcb检测方法及pcb
CN114838768B (zh) * 2020-10-28 2024-11-22 乔娜娜 一种集成电路焊点检测工艺、系统

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54147886A (en) * 1978-05-12 1979-11-19 Pace Inc Method and device for detecting variation in physical quantity

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2413646A1 (fr) * 1978-01-02 1979-07-27 Saint Gobain Fluxmetre thermique
US4394711A (en) * 1979-06-01 1983-07-19 Interconnection Technology, Inc. Circuit board with weldable terminals
JPS5672321A (en) * 1979-11-20 1981-06-16 Kensetsusho Kenchiku Kenkyu Shocho Radiation thermocouple and its manufacture
JPS5810875A (ja) * 1981-07-14 1983-01-21 Toshiba Chem Corp シ−ト状熱電対の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54147886A (en) * 1978-05-12 1979-11-19 Pace Inc Method and device for detecting variation in physical quantity
JPS61233351A (ja) * 1978-05-12 1986-10-17 ペ−ス　インコ−ポレ−テツド 組み立て作業もしくは修理作業を模倣する方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019530514A (ja) * 2016-10-04 2019-10-24 セント・ジュード・メディカル，カーディオロジー・ディヴィジョン，インコーポレイテッド 可撓性電子回路を有するアブレーション・カテーテル・チップ

Also Published As

Publication number Publication date
GB2225663B (en) 1992-07-15
CA2003202A1 (fr) 1990-05-23
IT1236825B (it) 1993-04-02
IT8922500A0 (it) 1989-11-23
IT8922500A1 (it) 1991-05-23
GB8926492D0 (en) 1990-01-10
DE3938847A1 (de) 1990-05-31
FR2646313A1 (fr) 1990-10-26
GB2225663A (en) 1990-06-06

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