JPH0221373A - Check device for attachment of parts - Google Patents

Abstract

PURPOSE:To check a position of an electronic parts regardless of the height of this parts by securing the discontinuous colors of the projection lines even though the coincidence of positions is obtained between the projection lines on the surface of a printed board and the surface of the electronic parts. CONSTITUTION:The slit beams having plural colors are obliquely projected onto a printed board 12, and a projection pattern including the contiguous projection lines of different colors is formed on the board 12. Thus the colors are discontinuous at the edge parts of a chip parts 14 despite the coincidence secured between the slit patterns since the contiguous slit patterns have different colors. Thus the attaching position of the parts 14 can be detected at a picture processing part 17 based on the discontinuous colors.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a component mounting inspection device for inspecting the mounting state of electronic components mounted on a printed circuit board.

<Prior Art> When chip components such as ICs, capacitors, and resistors are incorporated into various electronic devices, the electronic components are usually mounted on a printed circuit board provided with wiring. In order for an electronic device to operate normally, it goes without saying that each electronic component must be of good quality, but even if each electronic component is of good quality, it is difficult to place them in their designated positions on the printed circuit board. must be installed correctly. Therefore,
During assembly, the mounting state of electronic components on the printed circuit board is inspected.

This electronic component mounting inspection method, which has been implemented for a long time,
By projecting a slit light diagonally from above onto a printed circuit board on which electronic components are mounted, and detecting the edge of the electronic component from the deviation of the projection line between the surface of the electronic component that protrudes from the surface of the printed circuit board and the surface of the printed circuit board, This is to inspect the mounting status of electronic components.

<Problems to be Solved by the Invention> In the conventional inspection method described above, depending on the height of the electronic component from the surface of the printed circuit board, as shown in FIG. The projection line and the projection line of the surface of the electronic component 14 of the slit light 23 adjacent to this slit light 22 coincide. Therefore, the projected pattern viewed from the vertical direction becomes continuous as shown in FIG. 7, and the edges of the electronic component 14 cannot be detected. FIG. 8 shows an example in which the projection lines formed by two vertical slit lights 24 and 25 overlap.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a component mounting inspection device that can detect the mounting position of an electronic component regardless of its height.

<Means for Solving the Problems> In order to achieve the above object, in a component mounting inspection device according to the present invention, slit lights having a plurality of colors are projected onto a printed circuit board from an oblique direction, and adjacent projection lines are a projection means for forming a projection pattern with different colors on a printed circuit board; an imaging means for imaging the projection pattern on the printed circuit board; and detection means for detecting continuity and detecting the mounting position of the electronic component.

Effect> In the component mounting inspection device according to the present invention, adjacent projection lines have different colors, so even if the projection line on the surface of the printed circuit board and the projection line on the surface of the electronic component match, the color of the projection line may change. Since it is discontinuous, edges of electronic components can be detected.

<Embodiment> FIG. 2 shows the configuration of a color multi-slit light source used in the component mounting inspection apparatus of the present invention.

In the figure, 1 is a light emitting part, 2 is a condensing lens, 3a is a red color filter, 3b is a green color filter, 3c
is blue color filter + 4 a, 4 b t4
C is a slit plate, 5 is a projection lens, 6 is a shutter, 8
．． 9.10 is a color multi-slit light.

11 is an object to be inspected.

A condenser lens 2 is disposed on the light output side of each of the three light emitting units 1 for irradiating light, and the light beam is converted into a fixed wavelength on the light output side of each of the three condenser lenses 2. The color filter 3a includes slit plates 4a, 4b, and 4c that generate a plurality of slit lights from a light beam converted to a constant wavelength.

They are arranged on the light exit side of each of 3b and 3c.

Further, on the light output side of each of the slit plates 4a, 4b, 4c, there is a projection lens 5 for projecting a plurality of slit lights created by the slit plates 4a, 4b, 4c onto the inspection part of the inspection object 11. A shutter 6 is provided on the light output side of the projection lens 5 and transmits and blocks the slit light.
is installed.

When the color multi-slit light 8.9.10 that can be obtained by the color multi-slit light source device (hereinafter referred to as a light source) 7 configured as described above is projected onto the object to be inspected 11, it is shown in FIG. As shown, a plurality of color multi-slit patterns 8', 9', and 10' that do not interfere with each other are formed on an object to be inspected 11. Slit pattern 8' is red, slit pattern 9' is green, slit button 10
' is blue, and adjacent slit patterns have different colors.

FIG. 1 shows the configuration of a component mounting inspection apparatus equipped with two light sources 7, in which 6x and 6y are shutters, 7x and 7y are light sources, 12 is a printed circuit board, and 1
3 is an X-Y table, 14 is a chip component, 15 is an imaging section, 16 is an A/D conversion section, 17 is an image processing section, 18 is a control circuit section, 19 is an X-Y table drive circuit section, and 20 is an X-Y table drive circuit section. The axial drive unit 21 is a Y-axis drive unit.

A printed circuit board 12 on which a chip component 14 is mounted is placed on an X-Y table 13, and an X-axis direction light source 7x and a Y-axis direction light source 7y are provided to form the color multi-slit pattern on this printed circuit board 12. Printed circuit board 12
It is placed diagonally above. The X-axis direction light source 7x forms a slit pattern in the X-axis direction on the printed circuit board 12, and the Y-axis direction light source 7y forms a slit pattern in the Y-axis direction on the printed circuit board 12. X-axis direction light source 7x and Y
A shutter 6 x t6 is provided on the light output side of the axial light source 7y.
y are attached respectively, and these shutters 6x, 6
Due to the y movement, the X-axis direction and Y-axis direction are
The axial slit pattern is individually projected.

The imaging unit 15 images a slit pattern formed on the printed circuit board 12. The A/D converter 16 is connected to the imaging unit 1
The image signal from 5 is converted into a digital signal. The image processing unit 17 detects discontinuity of the slit pattern or discontinuity of the color of the slit pattern in the captured image, detects the mounting position of the chip component 14 on the printed circuit board 12, and detects the mounting position of the chip component 14. Determine if is within the error range.

The control circuit unit 18 moves the X-Y table 13 so that the next inspection range of the printed circuit board 12 falls within the imaging range of the imaging unit 15 in response to the completion of the detection and determination processing in the image processing unit 17. A command signal is given to the XY table drive circuit section 19.

The X-Y table drive circuit section 19 includes an X-axis direction drive section 20
A drive signal corresponding to the moving distance in the X-axis direction and the Y-axis direction is given to the Y-axis direction drive unit 21. X-axis direction drive section 20 and Y
The axial drive unit 21 drives an X-axis drive motor and a Y-axis drive motor (both not shown).

The operating procedure will be explained below.

First, the first inspection range of the printed circuit board 12 is the imaging section 15.
Drive the X-Y table 13 to enter the imaging range of
Position the printed circuit board 12.

Next, the shutter 6x of the X-axis direction light source 7x is operated to project a slit pattern in the X-axis direction onto the printed circuit board 12. Here, this slit pattern is imaged by the imaging section 15, and the obtained image signal is digitally converted by the A/D conversion section 16 and then sent to the image processing section 17. Next, the Shaftallo y is operated to project a slit pattern in the Y-axis direction, and in the same manner as described above, the slit pattern is imaged by the imaging section 15, and the image signal is digitally converted by the A/D conversion section 16 for image processing. Send to Department 17.

The image signal given to the image processing unit 17 is generated because the chip component 14 has a three-dimensional shape on the printed circuit board 12 and linear slit light is projected from an oblique direction.
The slit pattern changes depending on the shape of the chip component 14, and especially in the outer part of the chip component 14, the printed circuit board 12
It becomes discontinuous with the slit pattern on the surface. Therefore, the image processing unit 17 can detect the mounting position of the chip component 14 by detecting the discontinuous portion of the slit pattern, and can determine whether the position is within the error range.

Depending on the height of the chip component 14 from the surface of the printed circuit board 12, the slit pattern on the surface of the chip component 14 and the slit pattern on the surface of the printed circuit board 12 may match in adjacent slit patterns. However, as described above, since adjacent slit patterns have different colors, the positions of the slit patterns match, but the colors are discontinuous at the edge portions of the chi knob component 14.

Therefore, the image processing unit 17 can detect the mounting position of the chip component 14 from this color discontinuity.

By repeating the above steps of moving the X-Y table 13, projecting the slit pattern, and processing the first image, it is possible to inspect whether the mounting positions of the chip components 14 are correct over the entire printed circuit board 12. I can do it.

FIGS. 4 and 5 show the slit pattern in the X-axis direction and the Y-axis direction when the slit pattern on the chip component 14 and the slit pattern on the printed circuit board 12 overlap, and the slit pattern 8 on the white background ' is red, and the hatched slit pattern 9' is green. Image processing section 1
In step 7, the slit pattern is scanned in the direction of arrow A, and a location where the color changes from red to green or from green to red is detected as an edge of the chip component 14.

In addition, in the case of a tall chip component where two or more slit patterns on the surface of the chip component and the surface of the printed circuit board are shifted and overlap, the same method as in the above embodiment can be achieved by projecting slit lights of three or more colors. The inspection can be performed according to the principle of

Further, in the above embodiment, a shutter is used to project the slit pattern in the X-axis direction and the Y-axis direction, but instead of this shutter, a strobe may be used as the light source, or the light source may be controlled by a switch. According to
A desired slit pattern can also be obtained by emitting light only when necessary.

Furthermore, in the above embodiment, the imaging section was set at one location, but by forming a slit pattern on the entire surface of the printed circuit board at once, dividing it into a plurality of sections, and providing an imaging section for each section, - It is also possible to perform the inspection with the Y table fixed.

<Effects of the Invention> As described above, according to the present invention, since adjacent projection lines have different colors, the positions of the projection line on the surface of the printed circuit board and the projection line on the surface of the electronic component are different in the adjacent projection lines. Even if they match, the color of the projected line is discontinuous, so the position of the electronic component can be inspected regardless of the height of the electronic component. In addition, by selecting a color slit light that matches the color of the base material of the printed circuit board to be inspected,
Accurate inspection can be performed.

[Brief explanation of the drawing]

° Figure 1 is a diagram showing the configuration of an embodiment of the present invention, Figure 2 is a diagram explaining the configuration of a light source in an embodiment of the invention, Figures 3, 4, and 5 are slits of an embodiment of the present invention. FIG. 6 is a diagram illustrating how slit patterns overlap, and FIGS. 7 and 8 are diagrams showing conventional slit patterns. 1... Light emitting unit 2... Condensing lenses 3a, 3b, 3c Color filter C - Slit plate - Projection lens - Shutter - Color multi-slit light source device 4a, 4b. 5 ・ ・ ・ ・ 6 ・ ・ ・ ・ 7 ・ ・ ・ 8' 11 12 13 14 15 16 17 18 19 20 21 9'10' Color multi-slit pattern inspected object Printed circuit board X-Y table chip component imaging section A/D conversion section image processing section control circuit section X-Y table drive circuit section

Claims (1)

[Claims] In a component mounting inspection device that inspects the mounting position of electronic components on a printed circuit board on which electronic components are mounted, slit lights with multiple colors are projected diagonally onto the printed circuit board so that adjacent projection lines have different colors. projection means for forming a projected pattern on a printed circuit board; imaging means for imaging the projected pattern on the printed circuit board; 1. A component mounting inspection device comprising: a detection means for detecting a mounting position of a component.