JPH0241000A - How to install electronic parts - Google Patents

How to install electronic parts

Info

Publication number
JPH0241000A
JPH0241000A JP63191752A JP19175288A JPH0241000A JP H0241000 A JPH0241000 A JP H0241000A JP 63191752 A JP63191752 A JP 63191752A JP 19175288 A JP19175288 A JP 19175288A JP H0241000 A JPH0241000 A JP H0241000A
Authority
JP
Japan
Prior art keywords
electronic component
slit
recognized
component
station
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63191752A
Other languages
Japanese (ja)
Other versions
JP2712336B2 (en
Inventor
Takahiro Yonezawa
隆弘 米澤
Masayuki Seno
瀬野　眞透
Wataru Hirai
弥 平井
Muneyoshi Fujiwara
宗良 藤原
Takeshi Okada
毅 岡田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP63191752A priority Critical patent/JP2712336B2/en
Publication of JPH0241000A publication Critical patent/JPH0241000A/en
Application granted granted Critical
Publication of JP2712336B2 publication Critical patent/JP2712336B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Supply And Installment Of Electrical Components (AREA)
  • Image Analysis (AREA)

Abstract

PURPOSE:To detect the shape and position of an electronic component accurately by irradiating the component with a plurality and a large number of parallel slit beams having the fixed angles of inclination and recognizing the inflection point of a slit image. CONSTITUTION:An electronic component 11 sucked and held by a suction nozzle 13 at a first position and turned in the specified direction at a second position is irradiated with a plurality and a large number of parallel slit beams 21 by a lighting unit 23 at a third position while slit images 102a, 102b are recognized by a camera 20 from a lower section. Inflection points 102c are recognized respectively at both end sections of slit images 102a in the component 11. These inflection points 102c are tied respectively, thus recognizing the underside border lines of the component 11. Accordingly, the shape and location of the component 11 can be recognized accurately at a time.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は吸着保持した電子部品を移送して基板の所定位
１？ｌに装着する間に、前記電子部品に光を照射しその
像を撮像することによって電子部品を認識する電子部品
の認識方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention transfers electronic components held by suction to a predetermined position on a board. The present invention relates to a method for recognizing an electronic component, in which the electronic component is recognized by irradiating the electronic component with light and capturing an image of the electronic component while the electronic component is being attached to the device.

従来の技術 基板に装着する電子部品の形状や位置などを認識して、
基板の所定位置に前記電子部品を正確に装着するための
従来技術の一つに、第３図に示すように、２木のスリッ
ト光１０１ａと、それ七〇〇°の角をなす１本のスリッ
ト光１０１ｃを、’＋Ｊｆ、子部品に照射し、前記スリ
ット像の変曲点１０１ｅを認識する仁とＫよシ、前記電
子部品の位置の認識を行っている。Conventional technology Recognizes the shape and position of electronic components mounted on the board,
As shown in FIG. 3, one of the conventional techniques for accurately mounting the electronic components at predetermined positions on the board is two slit lights 101a and one slit light 101a forming an angle of 700 degrees with the two slit lights 101a. The position of the electronic component is recognized by irradiating the slit light 101c onto the child component and recognizing the inflection point 101e of the slit image.

発明が解決しようとする課題 しかし、上記従来例は、次のような問題点を有する。Problems that the invention aims to solve However, the above conventional example has the following problems.

１　第７図ａに示すように、電子部品の角は一般的に丸
味をおびているため、スリット像１０１ａ。1 As shown in FIG. 7a, the corners of electronic components are generally rounded, so the slit image 101a.

１０１Ｃの変曲点１０１ｏが不明確になり、前記電子部
品を正確に認識することはできない（課題１　）。The inflection point 101o of 101C becomes unclear, making it impossible to accurately recognize the electronic component (Problem 1).

２　第７図すに示すようＫＳ電子部品１１が傾いている
場合、電子部品１１ａを１１ａ′のように誤認するよう
なことが起き、前記電子部品を正確に認識することはで
きない（課題２）。2 If the KS electronic component 11 is tilted as shown in Fig. 7, the electronic component 11a may be mistakenly recognized as 11a', and the electronic component cannot be recognized accurately (Problem 2). .

３　第７図Ｃに示すように、ＱＦＰ電子部品１１ｂ等の
形状の複雑な部品の認識を行う場合、フリット光３本で
は、正確な形状を認識することはできない（課題３）。3. As shown in FIG. 7C, when recognizing a component with a complicated shape, such as the QFP electronic component 11b, the accurate shape cannot be recognized with three frit lights (Problem 3).

課題を解決するだめの手段 本発明は、前記３つの課題を解決するため、吸着保持し
た電子部品を移送して基板の所定位置に装着する間に、
第４図に示すように、前記電子部品に斜め下方から一定
の傾斜角を持つ複数多数かつ平行なスリット光を照射し
、前記スリット像の変曲点を認識することにより、電子
部品の形状及び位置を認識することを特徴とする。Means for Solving the Problems In order to solve the three problems mentioned above, the present invention provides a method for transferring the electronic components held by suction and attaching them to predetermined positions on the board.
As shown in FIG. 4, by irradiating the electronic component with a plurality of parallel slit lights having a constant inclination angle from diagonally downward and recognizing the inflection point of the slit image, the shape of the electronic component can be determined. It is characterized by location recognition.

ここで、電子部品の厚みとスリット光の照射角によシ、
各スリット光が重なり一直線となることを避けるため、
第４図ａに示す特許請求の範囲第２項記載の発明は、ス
リット光が一直線となり変曲点が認識できない場合、傾
斜角可変な鏡を用いてスリット光の照射角を変化させ認
識することを特徴とする。Here, depending on the thickness of the electronic component and the irradiation angle of the slit light,
In order to avoid each slit light from overlapping and forming a straight line,
The invention recited in claim 2 shown in FIG. 4a is that when the slit light is in a straight line and the point of inflection cannot be recognized, the slit light is recognized by changing the irradiation angle of the slit light using a variable tilt angle mirror. It is characterized by

同様に、各スリット光が重なシー直線となることを避け
るため、第４図すに示す特許請求の範囲第３項記載の発
明は、線幅の異なるスリット光を用いて認識することを
特徴とする。Similarly, in order to prevent the slit lights from forming overlapping sea straight lines, the invention as set forth in claim 3 shown in FIG. 4 is characterized in that recognition is performed using slit lights with different line widths shall be.

作　　用 本発明によれば、電子部品に対して斜め下方から一定の
傾斜角を持つ複数多数かつ平行なスリット光を照射し、
電子部品でのスリット像と吸着ノズルでのスリット像と
を下方から認識すると、電子部品でのスリット像はこの
電子部品の下面輪郭線に沿って吸着ノズルでのスリット
像との間に変曲点を生ずる。この変曲点は、吸着ノズル
でのスリット像が形成されなくても生ずる。従って、電
子部品での多数のスリット像の各変曲点を結ぶことによ
勺、−度に電子部品の形状及び位置を認識することがで
きる。ここで、多数のスリット光を用いることで、電子
部品の角の丸味等によるスリット像の検出誤差が平均化
され、精度向上が図れる。また、形状の複雑な電子部品
の認識も行うことができる。この結果、電子部品の形状
を問わず、−度で正確な電子部品の形状及び位置を認識
することができる。According to the present invention, a plurality of parallel slit lights having a constant inclination angle are irradiated from diagonally downward to the electronic component,
When the slit image on the electronic component and the slit image on the suction nozzle are recognized from below, the slit image on the electronic component will be at an inflection point between the slit image on the suction nozzle and the slit image on the suction nozzle along the bottom contour of the electronic component. will occur. This inflection point occurs even if no slit image is formed by the suction nozzle. Therefore, by connecting the inflection points of a large number of slit images on the electronic component, the shape and position of the electronic component can be recognized at once. Here, by using a large number of slit lights, detection errors in the slit image due to rounded corners of electronic components, etc. are averaged out, and accuracy can be improved. It is also possible to recognize electronic components with complex shapes. As a result, regardless of the shape of the electronic component, it is possible to accurately recognize the shape and position of the electronic component.

さらに、電子部品の厚みとスリット光の照射角により、
第１図Ｃに示すように、各スリット光が重なり−ｒｘ、
線となり、スリット像の変曲点を認識することができな
い。そこで、第２図に示すように、傾斜角可変な鏡を用
いてスリット光の照射角を変化させることで、各スリッ
ト光が重なることを避ける。この結果、電子部品の厚み
とスリット光の照射角にかかわらず、特許請求の範囲第
１項記載の認識を行うことができる。Furthermore, depending on the thickness of the electronic components and the irradiation angle of the slit light,
As shown in Fig. 1C, each slit beam overlaps -rx,
It becomes a line, and the inflection point of the slit image cannot be recognized. Therefore, as shown in FIG. 2, by changing the irradiation angle of the slit lights using a variable-angle mirror, the slit lights can be prevented from overlapping each other. As a result, the recognition described in claim 1 can be performed regardless of the thickness of the electronic component and the irradiation angle of the slit light.

また、他の方法として、第３図に示すように、線幅の異
なるスリット光を用いることで、スリット像が一直線上
になっても、線幅の違いによシ、スリット光変曲点を認
識することができる。この結果、電子部品の厚みとスリ
ット光の照射角にかかわらず、特許請求の範囲＠１項記
載の認識を行うことができる。As another method, as shown in Figure 3, by using slit lights with different line widths, even if the slit images are on a straight line, the inflection point of the slit lights can be changed due to the difference in line width. can be recognized. As a result, the recognition described in claim @1 can be performed regardless of the thickness of the electronic component and the irradiation angle of the slit light.

実施例 本発明の第１実施例？、第１図ないし第５図に基き説明
する。Example First example of the present invention? , will be explained based on FIGS. 1 to 5.

本実施例における電子部品装着装置は、第５図ａに示す
ように、ヘッドフレーム１によって回転可能に支持され
る回転主軸２を垂設し、この回転主軸２の下端部に固設
した回転枠３に８基の部品装着ヘッド４を昇降可能に配
設している。回転主軸２の上端部は、前記ヘッドフレー
ム１の上面側に設置された間欠回転駆動部５に接続され
ている。As shown in FIG. 5a, the electronic component mounting apparatus in this embodiment has a rotating main shaft 2 vertically supported by a head frame 1 in a rotatable manner, and a rotating frame fixed to the lower end of the rotating main shaft 2. 3 and 8 component mounting heads 4 are arranged so as to be movable up and down. The upper end of the rotating main shaft 2 is connected to an intermittent rotation driving section 5 installed on the upper surface side of the head frame 1.

前記部品装着ヘッド４のヘッドブロック６は、前記回転
枠３に立設固定したガイドシャフト７によって上下方向
にガイドされている。前記ヘッドブロック６はポールネ
ジ８を上下方向に螺合状態で挿通保持している。このボ
ールネジ８の上端部に、昇降用従動歯車９を固設してい
る。The head block 6 of the component mounting head 4 is guided in the vertical direction by a guide shaft 7 erected and fixed on the rotation frame 3. The head block 6 holds a pole screw 8 inserted in the vertical direction in a screwed state. An elevating driven gear 9 is fixed to the upper end of the ball screw 8.

これら部品装着ヘッド４は回転枠３の間欠回転に応じて
、第５図すに示すように、８箇所のステージョンＳ１〜
Ｓ８を通過する。第１ステーシヨンＳ１では吸着ノズル
１３が昇降し、電子部品１１を吸着する。第２ステーシ
ヨンＳ２では吸着ノズル保持軸１０を回転させるとと纜
よって電子部品１１を所定の向きに回転させる。第３ス
テーシヨンＳ３では電子部品１１の形状、位置及び厚み
寸法が認識される。第３ステーシヨンＳ３における電子
部品１１の認識データは、第２ステージジンＳ２での吸
着ノズ／Ｌ／１３０回転角に基いて回転させられている
。第４ステーシヲンＳ４では電子部品１１の回転方向で
のズレが補正される。第６ステーシヨンＳ６では電子部
品１１の厚み寸法に応じて吸着ノズＡ／１３が下降し、
電子部品１１を基板１９に装着する。第６ヌテーシヨン
Ｓ６では吸着ノズル１３の回転位置が戻される。第７ス
テーシヨンＳ７では不良の電子部品１１が排出される。These component mounting heads 4 are mounted at eight stations S1 to S1 as shown in FIG.
Pass through S8. At the first station S1, the suction nozzle 13 moves up and down to suction the electronic component 11. At the second station S2, when the suction nozzle holding shaft 10 is rotated, the electronic component 11 is rotated in a predetermined direction. At the third station S3, the shape, position, and thickness of the electronic component 11 are recognized. The recognition data of the electronic component 11 at the third station S3 is rotated based on the rotation angle of the suction nozzle /L/130 at the second stage engine S2. In the fourth station S4, the deviation of the electronic component 11 in the rotational direction is corrected. At the sixth station S6, the suction nozzle A/13 descends according to the thickness of the electronic component 11,
The electronic component 11 is mounted on the board 19. In the sixth nutrition S6, the rotational position of the suction nozzle 13 is returned. At the seventh station S7, defective electronic components 11 are discharged.

第８　ス？　−Ｖ　曹ンＳ８では、次の第１ステーシヨ
ンＳ１　で吸着する電子部品１１のサイズに応じて吸着
ノズ／１／１３が、図示しない吸着ノズル切換機構によ
り切替えられる。8th Su? -V In S8, the suction nozzle/1/13 is switched by a suction nozzle switching mechanism (not shown) according to the size of the electronic component 11 to be suctioned at the next first station S1.

第３ヌテーシヨンＳ３には、第２図に示すように、吸着
ノズ／ｌ／１３に吸着保持された電子部品１１を下方か
ら認識するカメラ２０と、前記電子部品１１に対して斜
め下方から、スリット光２１の照射角ａを変化させるガ
ルバノミラ−２２と、複数多数かつ平行なスリット光２
１を照射するヌリット光発光装置２３とからなる電子部
品認識装置を配設している。照明装置２３は、光源２６
と、光源２６からの光を平行光に屈折させるレンズ２４
と、平行光を遮って前記スリット光２１を形成するヌリ
ット２７を多数媚えたマヌク２６とからなる。As shown in FIG. 2, the third nutation S3 includes a camera 20 that recognizes the electronic component 11 sucked and held by the suction nozzle /l/13 from below, and a slit that recognizes the electronic component 11 from below diagonally with respect to the electronic component 11. A galvanometer mirror 22 that changes the irradiation angle a of the light 21, and a plurality of parallel slit lights 2
An electronic component recognition device consisting of a Nulit light emitting device 23 that irradiates the light source 1 is provided. The lighting device 23 includes a light source 26
and a lens 24 that refracts the light from the light source 26 into parallel light.
and a manuk 26 with a large number of nulls 27 that block parallel light and form the slit light 21.

第１ステーシヨンＳ１及び第５ステーシヨンＳ６には、
第６図ａに示すように、前記昇降用従動歯車９に噛合す
る昇降用駆動歯車２９とこの駆動歯車２９を回転させる
モータ３ｏとを夫々配設している。第５ステーシヨンＳ
５のモータ３ｏは、第３ステーシヨンＳ３で検出された
電子部品１１の厚み寸法りに応じて吸着ノズ／ｌ／１３
の下降量を調整スる。第２ヌテーシヨンＳ２　、第４ス
テーシヨンＳ４及び第６ヌテーシランＳ６には、前記回
転用従動歯車１７に噛合する回転用駆動歯車３１と、こ
の駆動歯車３１を回転させるモータ３２とを夫々配設し
ている。第２．第４．第６ステーシヨンＳ２．Ｓ４．Ｓ
６において回転させられた回転用従動歯車１７は、前記
回転ロック部材１８によって回１賑がロックされる。The first station S1 and the fifth station S6 include
As shown in FIG. 6a, an elevating drive gear 29 that meshes with the elevating driven gear 9 and a motor 3o that rotates the drive gear 29 are provided. 5th station S
The motor 3o of No. 5 has a suction nozzle of /l/13 according to the thickness of the electronic component 11 detected at the third station S3.
Adjust the amount of descent. A rotation drive gear 31 that meshes with the rotation driven gear 17 and a motor 32 that rotates the drive gear 31 are respectively disposed in the second nutation station S2, the fourth station S4, and the sixth nutrition run S6. . Second. 4th. 6th station S2. S4. S
The rotational driven gear 17 rotated in step 6 is locked from the first rotation by the rotation locking member 18.

以上の構成において、第１ステーシヨンＳ１で、吸着ノ
ズ）ｖ１３に吸着保持され、第２ヌテーシ３ンＳ２で所
定の向きに回転させられた電子部品１１は、第１図、第
２図に示すように、第３ステーシヨンＳ３において照明
装置２３によシ、複数多数かつ平行なスリット光２１が
照射されると共に、下方からカメラ２０によシそのスリ
ット像１０２ａ。In the above configuration, the electronic component 11 is held by suction nozzle v13 at the first station S1 and rotated in a predetermined direction at the second station S2, as shown in FIGS. 1 and 2. At the third station S3, a plurality of parallel slit lights 21 are irradiated by the illumination device 23, and a slit image 102a of the light is irradiated by the camera 20 from below.

１０２ｂが認識される。このときカメラ２０には、第１
図すに示すように、電子部品１１の下面でのスリット像
１０２ａと、吸着ノズＡ／１３の下端面でのスリット像
１０２ｂとが認識される。そして電子部品１１でのスリ
ット像１０２ａの両端部に変曲点１０２Ｃが各々認識さ
れる。これらの変曲点１０２ｃを各々結ぶことによって
、電子部品１１の下面輪郭線を認識することができる。102b is recognized. At this time, the camera 20 has the first
As shown in the figure, a slit image 102a on the lower surface of the electronic component 11 and a slit image 102b on the lower end surface of the suction nozzle A/13 are recognized. Inflection points 102C are recognized at both ends of the slit image 102a of the electronic component 11, respectively. By connecting these inflection points 102c, the lower surface contour of the electronic component 11 can be recognized.

これにより、電子部品１１の形状及び位置を、−度に正
確に認識することができる。Thereby, the shape and position of the electronic component 11 can be recognized accurately.

第４ステーシヨンＳ４で、電子部品１１の形状及び位置
に基いて、電子部品１１０回転ズレが補正される。＠５
ステーションＳ５で、電子部品１１の厚み寸法りに応じ
て部品装着ヘッド４が下降し、吸着ノズ／Ｉ／１３が電
子部品１１を基板１９の所定位置に装着する。そして、
第６ステーシヨンＳ６で吸着ノズ／Ｌ／１３の回転位置
が戻され、第７ステーシヨンＳ７で不良の電子部品１１
が排出された後、第８ステーシヨンＳ８で吸着ノズル１
３が切替えられて第１ヌテーシヨンＳ１　に戻る。At the fourth station S4, the rotational deviation of the electronic component 110 is corrected based on the shape and position of the electronic component 11. @5
At station S5, the component mounting head 4 descends according to the thickness of the electronic component 11, and the suction nozzle/I/13 mounts the electronic component 11 at a predetermined position on the board 19. and,
At the sixth station S6, the rotational position of the suction nozzle/L/13 is returned, and at the seventh station S7, the defective electronic component 11 is returned.
is discharged, the suction nozzle 1 is removed at the eighth station S8.
3 is switched and returns to the first nutrition S1.

このようにして、電子部品１１の装着を順次行うことが
できる。In this way, the electronic components 11 can be sequentially mounted.

第３ステーシヨンにおいて、第１図Ｃに示すように、電
子部品１１でのスリット像１０２ａの両端部に変曲点１
０２Ｃが認識されなかった場合には、第２図に示すガル
バノミラ−２２によシ、照射角ａを変えて、再度認識を
行い、形状及び位置を認識する。At the third station, as shown in FIG.
If 02C is not recognized, the galvanometer mirror 22 shown in FIG. 2 is used to change the irradiation angle a and perform recognition again to recognize the shape and position.

また、第３ステーシヨンＳ３において、照明装置２３の
マスク２６に、各々線幅の異なるスリット２７を多数設
けることで、第３図に示すように、電子部品１１の下面
でのスリット像が一直線上に重なっても、スリット像１
０３ａの両端部に変曲点１０３Ｃを認識することができ
る。従って、特許請求の範囲第３項記載に示す、この認
識法によれば、第２図に示すガルバノミラ−２２は不要
トなる。Furthermore, in the third station S3, by providing a large number of slits 27 with different line widths in the mask 26 of the illumination device 23, the slit images on the lower surface of the electronic component 11 are aligned in a straight line, as shown in FIG. Even if they overlap, slit image 1
Inflection points 103C can be recognized at both ends of 03a. Therefore, according to this recognition method described in claim 3, the galvanometer mirror 22 shown in FIG. 2 is not required.

本発明は上記実施例に示す外、種々の態様に構成するこ
とができる。The present invention can be configured in various ways other than those shown in the above embodiments.

発明の効果 以上、本発明によれば、複数多数のスリット光を用いる
ことで、−度に電子部品の形状及び位置を認識できるた
め、電子部品の移載時間を短縮することができる。また
、多数のスリット光を用いることで、電子部品の角の丸
味等によるスリット像の検出誤差が平均化され認識の精
度向上が図れる。さらに、複数多数のスリット光を用い
ることで、形状の複雑な電子部品の認識を行うことがで
きる。Effects of the Invention As described above, according to the present invention, by using a plurality of slit lights, the shape and position of the electronic component can be recognized at once, so the time for transferring the electronic component can be shortened. Further, by using a large number of slit lights, detection errors in slit images due to rounded corners of electronic components, etc. are averaged out, and recognition accuracy can be improved. Furthermore, by using a plurality of slit lights, electronic components with complex shapes can be recognized.

又、スリット光の照射角を変化させることで、電子部品
の形状を問わず、認識を行うことができる。Furthermore, by changing the irradiation angle of the slit light, recognition can be performed regardless of the shape of the electronic component.

さらにスリット光を、線幅の異なるスリット光にするだ
けで、電子部品の形状を問わず認識を行うことができる
。Furthermore, by simply changing the slit light beams to have different line widths, recognition can be performed regardless of the shape of the electronic component.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａは本発明の第１実施例を示すスリット光が照射
された電子部品の概略斜視図、第１図すはカメラに取込
まれるスリット光の照射された電子部品の平面図、第１
図Ｃは条件によシ変曲点が現われない場合の電子部品の
平面図、第２図は本発明のｐｔｒｊ１実施例を示すスリ
ット光発生装置の概略側面図、第３図は線幅の異なるス
リット光の照射された電子部品の平面図、第４図ａは本
発明の第１実施例の認識工程を示すフローチャート図、
第４図すは本発明の他の実施例の工程を示すフローチャ
ート図、第５図ａは本発明の第１実施例を示す部品装着
装置の概略斜視図、第５図すは電子部品装着時の同要部
拡大平面図、第６図とは従来例のスリット光の照射され
た電子部品の概略斜視図、第６図すは従来例のスリット
光の照射された電子部品の平面図、第７図ａ、ｂ、ｃは
従来例の問題となる認識方法での電子部品の平面図であ
る。 １１・・・・・・電子部品、１０２ａ、１０２ｂ・・・
・・・スリット像、１０２　ｃ・・・・・・変曲点、１
３・・・・・・吸着ノズル、２０・・・・・・カメラ、
２１・・・・・・スリット光、２２・・・・・・ガルバ
ノミラ−１２３・・・・・・スリット光発光装置、１０
３ａ、１０３ｂ・・・・・・線幅の異なるスリット像。 代理人の氏名　弁理士　粟　野　重　孝　ほか１名実　
１　図 １１−−・電子部品 ２ｆ−−−スリａｔ 第 図 第 つ 図 第 図 （ｂ） 第 図 （ＯＪン 第 図FIG. 1a is a schematic perspective view of an electronic component irradiated with slit light, showing a first embodiment of the present invention; FIG. 1
Figure C is a plan view of an electronic component when an inflection point does not appear depending on the conditions, Figure 2 is a schematic side view of a slit light generator showing the PTRJ1 embodiment of the present invention, and Figure 3 is a diagram showing lines with different line widths. A plan view of the electronic component irradiated with the slit light, FIG. 4a is a flowchart showing the recognition process of the first embodiment of the present invention,
FIG. 4 is a flowchart showing the steps of another embodiment of the present invention, FIG. 5a is a schematic perspective view of a component mounting device showing the first embodiment of the present invention, and FIG. FIG. 6 is a schematic perspective view of an electronic component irradiated with slit light in a conventional example, and FIG. 6 is a plan view of an electronic component irradiated with slit light in a conventional example. 7a, b, and c are plan views of electronic components in the problematic recognition method of the conventional example. 11...Electronic components, 102a, 102b...
...Slit image, 102 c...Inflection point, 1
3... Suction nozzle, 20... Camera,
21... Slit light, 22... Galvano mirror 123... Slit light emitting device, 10
3a, 103b...Slit images with different line widths. Name of agent: Patent attorney Shigetaka Awano and one other person
1 Figure 11--・Electronic component 2f---Sliat Figure (b) Figure (OJ

Claims (3)

【特許請求の範囲】[Claims] （１）吸着保持した電子部品を移送して基板の所定位置
に装着する間に、前記電子部品に光を照射しその像を撮
像することによって電子部品を認識する電子部品の認識
方法において、電子部品に斜め下方から一定の傾斜角を
持つ複数多数かつ平行なスリット光を照射し、前記スリ
ット像の変曲点を認識することにより、電子部品の形状
及び位置を認識することを特徴とする電子部品の認識方
法。(1) In an electronic component recognition method, an electronic component is recognized by irradiating the electronic component with light and capturing an image of the electronic component while the electronic component is being transferred and mounted on a board at a predetermined position. An electronic device characterized in that the shape and position of an electronic component are recognized by irradiating the component with a plurality of parallel slit lights having a constant inclination angle from diagonally downward and recognizing the inflection point of the slit image. How to recognize parts. （２）傾斜角可変な鏡を用いてスリット光の照射角を変
化させ認識することを特徴とする特許請求の範囲第１項
記載の電子部品の認識方法。(2) A method for recognizing an electronic component according to claim 1, characterized in that recognition is performed by changing the irradiation angle of the slit light using a mirror with a variable tilt angle. （３）複数多数の線幅の異なるスリット光を用いて認識
することを特徴とする特許請求の範囲第１項記載の電子
部品の認識方法。(3) A method for recognizing an electronic component according to claim 1, characterized in that recognition is performed using a plurality of slit lights having different line widths.
JP63191752A 1988-07-29 1988-07-29 How to mount electronic components Expired - Fee Related JP2712336B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63191752A JP2712336B2 (en) 1988-07-29 1988-07-29 How to mount electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63191752A JP2712336B2 (en) 1988-07-29 1988-07-29 How to mount electronic components

Publications (2)

Publication Number Publication Date
JPH0241000A true JPH0241000A (en) 1990-02-09
JP2712336B2 JP2712336B2 (en) 1998-02-10

Family

ID=16279914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63191752A Expired - Fee Related JP2712336B2 (en) 1988-07-29 1988-07-29 How to mount electronic components

Country Status (1)

Country Link
JP (1) JP2712336B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0991441A (en) * 1995-09-26 1997-04-04 Matsushita Electric Works Ltd Method for detecting interference of objects
JP2012079859A (en) * 2010-09-30 2012-04-19 Panasonic Corp Component mounting method, and component mounting machine

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61500341A (en) * 1983-11-05 1986-02-27 ゼバテツチ　ア−ゲ− Method and apparatus for positioning elements relative to a workpiece
JPS63109308A (en) * 1986-10-27 1988-05-14 Sharp Corp Apparatus for inspecting mounting of chip component
JPH01295140A (en) * 1988-05-23 1989-11-28 Sharp Corp Parts mounting inspection device
JPH0221373A (en) * 1988-07-08 1990-01-24 Sharp Corp Check device for attachment of parts

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61500341A (en) * 1983-11-05 1986-02-27 ゼバテツチ　ア−ゲ− Method and apparatus for positioning elements relative to a workpiece
JPS63109308A (en) * 1986-10-27 1988-05-14 Sharp Corp Apparatus for inspecting mounting of chip component
JPH01295140A (en) * 1988-05-23 1989-11-28 Sharp Corp Parts mounting inspection device
JPH0221373A (en) * 1988-07-08 1990-01-24 Sharp Corp Check device for attachment of parts

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0991441A (en) * 1995-09-26 1997-04-04 Matsushita Electric Works Ltd Method for detecting interference of objects
JP2012079859A (en) * 2010-09-30 2012-04-19 Panasonic Corp Component mounting method, and component mounting machine

Also Published As

Publication number Publication date
JP2712336B2 (en) 1998-02-10

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