JPH02215192A - Manufacture of multilayer printed board - Google Patents
Manufacture of multilayer printed boardInfo
- Publication number
- JPH02215192A JPH02215192A JP3667589A JP3667589A JPH02215192A JP H02215192 A JPH02215192 A JP H02215192A JP 3667589 A JP3667589 A JP 3667589A JP 3667589 A JP3667589 A JP 3667589A JP H02215192 A JPH02215192 A JP H02215192A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- prepreg
- multilayer printed
- printed board
- surface roughness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 19
- 230000009477 glass transition Effects 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 11
- 230000003746 surface roughness Effects 0.000 abstract description 8
- 239000003822 epoxy resin Substances 0.000 abstract description 6
- 229920000647 polyepoxide Polymers 0.000 abstract description 6
- 238000005553 drilling Methods 0.000 abstract description 4
- 238000003475 lamination Methods 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 4
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- 239000011889 copper foil Substances 0.000 abstract description 2
- 239000004744 fabric Substances 0.000 abstract description 2
- 229920005992 thermoplastic resin Polymers 0.000 abstract description 2
- 239000002966 varnish Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 3
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- -1 fluororesin Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器、電気機器、コンピューター、通信機
器等に用いられる多層プリント基板の製造方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a multilayer printed circuit board used in electronic equipment, electrical equipment, computers, communication equipment, etc.
従来の多層プリント基板はフェノール樹脂系にあっては
１６０℃位、エポキシ樹脂系にあっては１７１５〜１８
０℃で積層成形されるのが一般的で、樹脂の硬化、冷却
により内層材の回路パターンが表面に浮き上がり表面粗
度が大となりドリル穴明は時の位置精度を低下させて込
る。Conventional multilayer printed circuit boards are made of phenolic resin at around 160 degrees Celsius, and those made of epoxy resin at temperatures of 1715 to 18 degrees Celsius.
Laminate molding is generally performed at 0°C, and as the resin hardens and cools, the circuit pattern of the inner layer material rises to the surface, increasing the surface roughness and reducing the positional accuracy when drilling holes.
従来の技術で述べたように多層プリント基板の表面粗度
は多層化される程悪く、最近のファインパターン化では
問題になっている。本発明は従来の技術における上述の
問題点に鑑みてなされたもので、その目的とするところ
は表面粗度、穴明は時の位置精度のよい多層プリント基
板の製造方法を提供することにある。As described in the related art section, the surface roughness of a multilayer printed circuit board becomes worse as the number of layers increases, and this has become a problem in recent fine patterning. The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to provide a method for manufacturing a multilayer printed circuit board with good surface roughness and hole positioning accuracy. .
本発明は所要枚数の内層材の上面及び又は下面に所要枚
数のプリプレグを配し、最外層に外層材を配設した積層
体を、プリプレグ樹脂のガラス転移温度より５〜３０℃
高温で積層一体化することを特徴とする多層プリント基
板の製造方法のため、樹脂硬化、一体化を充分にし且つ
過剰な樹脂の収縮を防止し表面粗度、穴明は時の位置精
度・を向上させることができたもので、以下本発明の詳
細な説明する。The present invention provides a laminate in which a required number of prepregs are arranged on the upper and/or lower surfaces of the required number of inner layer materials, and an outer layer material is provided as the outermost layer, by 5 to 30°C below the glass transition temperature of the prepreg resin.
Since the manufacturing method of multilayer printed circuit boards is characterized by lamination and integration at high temperatures, it is possible to sufficiently cure and integrate the resin, prevent excessive resin shrinkage, and improve surface roughness, hole drilling, and positional accuracy. The present invention will be described in detail below.
本発明に用いる内層材はフェノール樹脂、エボキシ樹脂
、不飽和ポリエステル樹脂、ポリイミド樹脂、フッ素樹
脂、ポリフェニレンオキサイド樹脂等の熱硬化性樹脂や
熱可塑性樹脂の積層板の片面又は両面に電気回路を形成
したものである。プリプレグとしては樹脂にフェノ−・
ル樹脂、クレゾール樹脂、エポキシ樹脂、不飽和ポリエ
ステル樹脂、ポリイミド樹脂、熱硬化型ポリフェニレン
オキサイド樹脂等の熱硬化性樹脂全般を用−ることがで
きるが、好ましくはエポキシ樹脂を用いることがより効
果が大で望ましｂことである。プリプレグの基材として
はガラス、アスベスト等の無機繊維やポリエステル、ポ
リアミド、ポリビニルアルコール、アクリル等の有機合
成繊維や木綿等の天然繊維からなる織布、不織布、マッ
ト或は紙又はこれらの組合せ基材等である。基材への樹
脂含浸蓋は乾燥後樹脂量で４０〜６０１ｉｔｓ（以下単
にチと記す）が好ましい。外層材としては内層材に用Ａ
られる積層板の片面金属張積層板や厚みが１８〜１０５
ミクロンの銅、アルミニウム、二９ケル、亜鉛、鉄等の
単独、合金、複合箔を用することができ、必要に応じて
その片面又は両面に化学的処理、物理的処理を施したり
、片面に接着剤層を設けた金属箔である。積層成形時の
温度はプリプレグ樹脂のガラス転移温度より５〜３０℃
高温であることが必要である。即ち５℃未満では樹脂の
硬化、一体化が不充分となり、３０℃をこえると樹脂の
収縮が大となるためである。The inner layer material used in the present invention is a laminate of thermosetting resin or thermoplastic resin such as phenol resin, epoxy resin, unsaturated polyester resin, polyimide resin, fluororesin, polyphenylene oxide resin, etc., with an electric circuit formed on one or both sides. It is something. As a prepreg, phenol is added to the resin.
Although general thermosetting resins such as resin, cresol resin, epoxy resin, unsaturated polyester resin, polyimide resin, and thermosetting polyphenylene oxide resin can be used, it is preferable to use epoxy resin because it is more effective. This is highly desirable. Base materials for prepreg include woven fabrics, non-woven fabrics, mats, paper, or combinations of these, made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acrylic, and natural fibers such as cotton. etc. The resin-impregnated lid on the base material preferably has a resin amount of 40 to 601 its (hereinafter simply referred to as ``chi'') after drying. As the outer layer material, use A for the inner layer material.
Single-sided metal-clad laminates and thicknesses of 18 to 105
Single, alloy, or composite foils of micron copper, aluminum, 29 Kel, zinc, iron, etc. can be used, and if necessary, one or both sides can be chemically or physically treated, or one side can be treated with It is a metal foil with an adhesive layer. The temperature during lamination molding is 5 to 30℃ higher than the glass transition temperature of the prepreg resin.
It is necessary to be at high temperature. That is, if the temperature is lower than 5°C, curing and integration of the resin will be insufficient, and if the temperature exceeds 30°C, the resin will shrink significantly.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例１乃至３と比較例
先ず厚さ０．１５ ｍのガラス布に、エポキシ樹脂（シ
ェル化学株式会社製、エピコート８２ｇ ） １００重
量部（以下単に部と記す）に対しジアミノジフェニルメ
タン２８部、ベンジルジメチルアミン０．２部メチルオ
キシトール５０部を加えてなるエポキシＩｔｌｌｌワニ
ス（硬化後のガラス転移温度１４０℃）を乾燥後の樹脂
量がＳＯＷになるように含浸、乾燥してプリプレグを得
た。次に厚さ０．８ｆｆの両面銅張積層板の両面に電気
回路を形成した内層材の上下面に上記プリプレグを夫々
２枚づつ介在させてから厚さ０．０１８ｍの銅箔を配設
した積層体を成形圧力５ＯＫｑ／ｄ 、成形温度は実施
例１につｂでは１５５℃、実施例２につｂでは１６０℃
、実施例３については１６５℃、比較例については１８
０℃で夫々９０分間積層成形して４層プリント基板を得
た。Examples 1 to 3 and Comparative Example First, 28 parts of diaminodiphenylmethane and benzyl were added to 100 parts by weight (hereinafter simply referred to as "parts") of an epoxy resin (manufactured by Shell Chemical Co., Ltd., Epikote 82 g) on a glass cloth with a thickness of 0.15 m. It was impregnated with epoxy Itll varnish (glass transition temperature after curing: 140° C.) prepared by adding 0.2 parts of dimethylamine and 50 parts of methyloxytol so that the amount of resin after drying was SOW, and dried to obtain a prepreg. Next, two sheets of the prepreg were interposed on each of the upper and lower surfaces of the inner layer material on which electric circuits were formed on both sides of a double-sided copper-clad laminate with a thickness of 0.8 ff, and then a copper foil with a thickness of 0.018 m was placed. The laminate was molded at a pressure of 5 OKq/d and a molding temperature of 155°C in Example 1 and 160°C in Example 2 and b.
, 165°C for Example 3, 18°C for Comparative Example
Each layer was laminated and molded at 0° C. for 90 minutes to obtain a four-layer printed circuit board.
実施例！乃至３と比較例の多層プリント基板の性能は第
１表のようである。Example! The performances of the multilayer printed circuit boards of 3 to 3 and the comparative example are shown in Table 1.
注
＊１ 内層回路のパターン部浮き上がりを表面粗度とし
てみる。Note *1: The lifting of the pattern part of the inner layer circuit is considered as surface roughness.
※２ 使用ドリル０．４ｆｉ径、重ね枚数２枚。*2 Drill used: 0.4fi diameter, number of sheets stacked: 2.
本発明は上述した如く構成されている。特許請求の範囲
第１項に記載した構成を有する多層プリント基板の製造
方法においては表面粗度、穴明は時の位置精度を向上す
る効果がある。The present invention is constructed as described above. In the method for manufacturing a multilayer printed circuit board having the structure described in claim 1, surface roughness and perforation have the effect of improving positional accuracy.
Claims (1)
のプリプレグを配し、最外層に外層材を配設した積層体
を、プリプレグ樹脂のガラス転移温度より５〜３０℃高
温で積層一体化することを特徴とする多層プリント基板
の製造方法。(1) A laminate in which the required number of prepreg sheets are placed on the upper and/or lower surfaces of the required number of inner layer materials and the outer layer material is placed on the outermost layer is laminated together at a temperature 5 to 30 degrees Celsius higher than the glass transition temperature of the prepreg resin. A method for manufacturing a multilayer printed circuit board, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1036675A JP2503630B2 (en) | 1989-02-15 | 1989-02-15 | Method for manufacturing multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1036675A JP2503630B2 (en) | 1989-02-15 | 1989-02-15 | Method for manufacturing multilayer printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02215192A true JPH02215192A (en) | 1990-08-28 |
| JP2503630B2 JP2503630B2 (en) | 1996-06-05 |
Family
ID=12476430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1036675A Expired - Lifetime JP2503630B2 (en) | 1989-02-15 | 1989-02-15 | Method for manufacturing multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2503630B2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57149799A (en) * | 1980-09-02 | 1982-09-16 | Buerkle Gmbh & Co Robert | Method and device for producing multilayer printed circuit board |
| JPS6112732A (en) * | 1984-06-28 | 1986-01-21 | Hitachi Chem Co Ltd | Preparation of prepreg for printed circuit board |
| JPS6172018A (en) * | 1984-09-17 | 1986-04-14 | Matsushita Electric Works Ltd | Epoxy resin composition |
-
1989
- 1989-02-15 JP JP1036675A patent/JP2503630B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57149799A (en) * | 1980-09-02 | 1982-09-16 | Buerkle Gmbh & Co Robert | Method and device for producing multilayer printed circuit board |
| JPS6112732A (en) * | 1984-06-28 | 1986-01-21 | Hitachi Chem Co Ltd | Preparation of prepreg for printed circuit board |
| JPS6172018A (en) * | 1984-09-17 | 1986-04-14 | Matsushita Electric Works Ltd | Epoxy resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2503630B2 (en) | 1996-06-05 |
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