JPH0221692A - Method of packaging electronic component - Google Patents
Method of packaging electronic componentInfo
- Publication number
- JPH0221692A JPH0221692A JP17064488A JP17064488A JPH0221692A JP H0221692 A JPH0221692 A JP H0221692A JP 17064488 A JP17064488 A JP 17064488A JP 17064488 A JP17064488 A JP 17064488A JP H0221692 A JPH0221692 A JP H0221692A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- circuit board
- printed circuit
- adhesive sheet
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子部品のプリント基板への実装方法に関し、
特に半導体素子をプリント基板に埋め込む実装方法に関
する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for mounting electronic components on a printed circuit board,
In particular, the present invention relates to a mounting method for embedding a semiconductor element in a printed circuit board.
従来、第４図に示すように、半導体素子１をプリント基
板２に埋め込んで半田付けを行う実装においては、次の
方法がある。Conventionally, as shown in FIG. 4, there are the following mounting methods in which a semiconductor element 1 is embedded in a printed circuit board 2 and soldered.
第５図に示すように半導体素子１をプリント基板２に挿
入し、半導体素子１のリード部６とプリント基板２のプ
リント筋部７を半田ゴテを用い半田付けする方法や、第
６図に示すようにあらかじめプリント筋部１６にクリー
ム半田１７が塗布されたプリント基板１８に半導体素子
１を挿入し、高温雰囲気中でクリーム半田を溶かすこと
により、半導体素子１のリード部６とプリント箔１６を
半田付けする方法である。As shown in FIG. 5, the semiconductor element 1 is inserted into the printed circuit board 2, and the lead part 6 of the semiconductor element 1 and the printed line part 7 of the printed circuit board 2 are soldered using a soldering iron, or as shown in FIG. The semiconductor element 1 is inserted into the printed circuit board 18 on which cream solder 17 has been applied to the printed lines 16 in advance, and the lead parts 6 of the semiconductor element 1 and the printed foil 16 are soldered by melting the cream solder in a high temperature atmosphere. This is the method of attaching.
上述した従来の方法は、それぞれ次の欠点がある。 The conventional methods described above each have the following drawbacks.
第５図の方法は、半田ゴテを用いるため自動半田付は機
が使用できず、量産性に乏しい。また第６図の方法は第
３図に示すように重なり部のプリント基板面積縮小のた
めプリント基板１０の裏・表から半導体素子９，９′を
実装する場合、裏と表の計２回、半田付けを行うことに
なるが、第７図に示すように半導体素子９をプリント基
板２０に半田付は後、プリント基板２０を裏返し、半導
体素子９′をプリント基板２０に挿入後、半田付けを行
なう際に高温雰囲気により、半導体素子９を固定してい
る半田も溶け、半導体素子９がプリント基板２０から脱
落するという欠点がある。Since the method shown in FIG. 5 uses a soldering iron, a machine cannot be used for automatic soldering, and it is not suitable for mass production. In addition, the method shown in FIG. 6 is used when mounting the semiconductor elements 9, 9' from the back and front of the printed circuit board 10 in order to reduce the printed board area at the overlapped portion as shown in FIG. As shown in FIG. 7, after soldering the semiconductor element 9 to the printed circuit board 20, turn the printed circuit board 20 over and insert the semiconductor element 9' into the printed circuit board 20. There is a drawback that the solder fixing the semiconductor element 9 melts due to the high temperature atmosphere during this process, and the semiconductor element 9 falls off from the printed circuit board 20.
本発明の実装方法は、電子部品をプリント基板に挿入後
、粘着シートにより、半導体素子をプリント基板に仮り
止めし、噴流半田で半田付けを行ない、粘着シートをは
がす方法である。The mounting method of the present invention is a method in which, after inserting an electronic component into a printed circuit board, the semiconductor element is temporarily fixed to the printed circuit board using an adhesive sheet, soldering is performed using a jet solder, and the adhesive sheet is peeled off.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の実装方法の一実施例である。FIG. 1 shows an embodiment of the mounting method of the present invention.
第１図に付した（ａ）〜（ｅ）は、実装の手順を示す付
量で、各手順は次の内容である。第１図（ａ）のように
半導体素子１をプリント基板２に挿入する。The numbers (a) to (e) in FIG. 1 indicate the mounting steps, and each step has the following contents. A semiconductor element 1 is inserted into a printed circuit board 2 as shown in FIG. 1(a).
次いで第１図（ｂ）のようにプリント基板２の表面３と
、半導体素子１の表面４に粘着シート５を貼り付ける。Next, as shown in FIG. 1(b), an adhesive sheet 5 is attached to the surface 3 of the printed circuit board 2 and the surface 4 of the semiconductor element 1.
第１図（Ｃ）のごとくプリント基板２をうら返し、半導
体素子１のリード部６とプリント箔７に半田を噴流し、
第１図（ｄ）のように半田付けを行ない、次いで第１図
（ｅ）のように粘着シート５をはがす。Turn the printed circuit board 2 over as shown in FIG.
Soldering is performed as shown in FIG. 1(d), and then the adhesive sheet 5 is peeled off as shown in FIG. 1(e).
第２図は本発明の実装方法の実施例２である。FIG. 2 shows a second embodiment of the mounting method of the present invention.
第２図に付した（ａ）〜（ｈ）は、実装の手順を示す付
量で各手順は次の内容である。(a) to (h) attached to FIG. 2 indicate mounting procedures, and each procedure has the following contents.
（ａ） 半導体素子９をプリント基板１０に挿入する
。(a) Insert the semiconductor element 9 into the printed circuit board 10.
（ｂ） プリント基板１０の表面１１と半導体素子９
の表面１２に粘着シート１３を貼り付ける。(b) Surface 11 of printed circuit board 10 and semiconductor element 9
An adhesive sheet 13 is pasted on the surface 12 of.
（ｃ） プリント基板１０とうら返し、半導体素子９
のリード部１４とプリント箔１５に半田を噴流し、半田
付けを行なう。(c) Printed circuit board 10 and reverse, semiconductor element 9
Solder is jetted onto the lead portion 14 and the printed foil 15 to perform soldering.
（ｄ） 粘着シート１３をはがす。(d) Peel off the adhesive sheet 13.
（ｅ） 半導体素子９をプリント基板１０に挿入する
。(e) Insert the semiconductor element 9 into the printed circuit board 10.
（「）プリント基板１０の表面１１′と半導体素子９′
の表面１２′に粘着シート１３′を貼り付ける。('') Surface 11' of printed circuit board 10 and semiconductor element 9'
An adhesive sheet 13' is pasted on the surface 12'.
（ｇ） プリント基板１０をうら返し、半導体素子９
′のリード部１４′とプリント箔１５′に半田を噴流し
、半田付けを行なう。(g) Turn the printed circuit board 10 over and attach the semiconductor element 9
Solder is jetted onto the lead portion 14' and the printed foil 15' to perform soldering.
（ｈ） 粘着シート１３′をはがす。(h) Peel off the adhesive sheet 13'.
この実施例では、粘着シート１３′を用い、半導体素子
９′を仮り固定することでプリント基板１０から半導体
素子９および９′が脱落することなく、半田付けが行な
えることから、第３図に示すプリント基板１０の面積を
有効に利用する裏表の両面からの半導体素子９．９”の
実装に噴流半田を用いることができ、自動半田付は機の
使用が容易で量産性に富む効果がある。In this embodiment, by temporarily fixing the semiconductor elements 9' using the adhesive sheet 13', soldering can be performed without the semiconductor elements 9 and 9' falling off the printed circuit board 10. Jet soldering can be used to mount the semiconductor element 9.9" from both the front and back sides, making effective use of the area of the printed circuit board 10 shown in FIG. .
以上説明したように本発明は、粘着シート５を用い、半
導体素子１をプリント基板２に仮り固定することにより
、噴流半田での半田付けが可能で自動半田付は機の利用
が、容易であり、量産性に富む効果がある。As explained above, in the present invention, by temporarily fixing the semiconductor element 1 to the printed circuit board 2 using the adhesive sheet 5, it is possible to solder the semiconductor element 1 with jet soldering, and it is easy to use a machine for automatic soldering. , which is effective in mass production.
る例、第５図、第６図、第７図は従来の実装方法示す図
である。For example, FIGS. 5, 6, and 7 are diagrams showing conventional mounting methods.
１．９．９’・・・・・・半導体素子、２，１０，１８
゜２０・・・・・・プリント基板、３．４．１１．１１
’、 １２゜１２′・・・・・・表面、５．１３．１３
’・・・・・・粘着シート、６．１４．１４’・・・・
・・リード部、７，１５．１５’１６・・・・・・プリ
ント箔、１９・・・・・・重なり部。1.9.9'... Semiconductor element, 2, 10, 18
゜20...Printed circuit board, 3.4.11.11
', 12゜12'・・・Surface, 5.13.13
'・・・Adhesive sheet, 6.14.14'...
...Lead part, 7,15.15'16...Printed foil, 19...Overlapping part.
代理人 弁理士 内 原 晋Agent: Patent Attorney Susumu Uchihara
第１図（ａ）〜（ｅ）は、本発明の実装方法の一実施例
、第２図（ａ）〜（ｈ）は、本発明の実装方法の実施例
２、第３図および第４図は、本発明で実装す（ｂ）
噴流半田
第１図
第２図
オ古着レート
第２図
第３図
第７図
第５図FIGS. 1(a) to (e) show an embodiment of the mounting method of the present invention, and FIGS. 2(a) to (h) show embodiments 2, 3, and 4 of the mounting method of the present invention. The figure is implemented by the present invention (b) Jet soldering Figure 1 Figure 2 O Used clothing rate Figure 2 Figure 3 Figure 7 Figure 5
Claims (1)
シートを用いて該部品を半田付けすることを特徴とする
電子部品の実装方法。1. A method for mounting electronic components, which includes soldering the components using an adhesive sheet in mounting the electronic components on a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17064488A JPH0221692A (en) | 1988-07-08 | 1988-07-08 | Method of packaging electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17064488A JPH0221692A (en) | 1988-07-08 | 1988-07-08 | Method of packaging electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221692A true JPH0221692A (en) | 1990-01-24 |
Family
ID=15908700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17064488A Pending JPH0221692A (en) | 1988-07-08 | 1988-07-08 | Method of packaging electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221692A (en) |
-
1988
- 1988-07-08 JP JP17064488A patent/JPH0221692A/en active Pending
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