JPH0221763U - - Google Patents
Info
- Publication number
- JPH0221763U JPH0221763U JP1988100074U JP10007488U JPH0221763U JP H0221763 U JPH0221763 U JP H0221763U JP 1988100074 U JP1988100074 U JP 1988100074U JP 10007488 U JP10007488 U JP 10007488U JP H0221763 U JPH0221763 U JP H0221763U
- Authority
- JP
- Japan
- Prior art keywords
- lead frames
- led lamp
- bonded
- lead
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
第１図は本考案によるＬＥＤランプの一実施例
を示す概略断面図、第２図は第１図のＬＥＤラン
プの構成を示す回路図である。
１０…ＬＥＤランプ、１１，１２…リードフレ
ーム、１３，１４…ＬＥＤチツプ、１５…レンズ
。
FIG. 1 is a schematic sectional view showing an embodiment of the LED lamp according to the present invention, and FIG. 2 is a circuit diagram showing the configuration of the LED lamp shown in FIG. 10... LED lamp, 11, 12... Lead frame, 13, 14... LED chip, 15... Lens.
Claims (1)
ームと、該リードフレームの一方の上端面に取り
付けられ且つその上面がそれぞれ他方のリードフ
レームの上端に対してワイヤボンデイングされて
いる少なくとも二つのＬＥＤチツプとを含むこと
を特徴とする、ＬＥＤランプ。 Two lead frames extending substantially vertically in parallel, and at least two LED chips attached to the upper end surface of one of the lead frames, the upper surfaces of which are each wire-bonded to the upper end of the other lead frame. An LED lamp comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988100074U JPH0221763U (en) | 1988-07-28 | 1988-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988100074U JPH0221763U (en) | 1988-07-28 | 1988-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221763U true JPH0221763U (en) | 1990-02-14 |
Family
ID=31327821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988100074U Pending JPH0221763U (en) | 1988-07-28 | 1988-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221763U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS585362B2 (en) * | 1976-07-28 | 1983-01-31 | 電測工業株式会社 | Method for detecting uneven thickness of insulating coating |
| JPS6247154B2 (en) * | 1983-05-11 | 1987-10-06 | Atsuji Tetsuko Kk |
-
1988
- 1988-07-28 JP JP1988100074U patent/JPH0221763U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS585362B2 (en) * | 1976-07-28 | 1983-01-31 | 電測工業株式会社 | Method for detecting uneven thickness of insulating coating |
| JPS6247154B2 (en) * | 1983-05-11 | 1987-10-06 | Atsuji Tetsuko Kk |