JPH02219302A - Microstrip line capacitor - Google Patents

Abstract

PURPOSE:To vary the capacity of a capacitor in which microstrip lines are arranged oppositely arbitrarily by connecting a land provided at the joining part of a microstrip line conductor pattern to another pattern with a ribbon. CONSTITUTION:The microstrip line conductor patterns 1 and 2 are arranged oppositely via a gap 3, and plural recessed parts 1a are formed at the pattern 1, and the land 4 consisting of a conductor is formed in the recessed part 1a. The gap 3 is reduced by connecting the land 4 to the microstrip pattern 2, thereby, the capacitance is increased. Also, when the number of connection between the land 4 and the pattern 2 is increased, the capacitance can be increased by that share. In other words, it is possible to adjust the capacitance of the capacitor in a direction to increase it, thereby, the capacitance of the capacitor can be varied arbitrarily.

Description

[Detailed Description of the Invention] [Summary] Regarding a microstrip line capacitor having a configuration in which microstrip lines are arranged facing each other through a gap, the capacitance of the capacitor created by arranging the microstrip lines facing each other can be arbitrarily varied. A first aspect of the invention is to arrange two microstrip line conductor patterns facing each other with a gap therebetween, form a plurality of recesses of a predetermined shape in at least one of these microstrip line conductor patterns, and form a plurality of recesses in a predetermined shape. A conductor land is arranged in each of the recesses, and the conductor land is connected to one of the microstrip line conductor patterns by a conductor ribbon so that the capacitance between the microstrip lines can be varied.

In a second invention, two microstrip line conductor patterns are arranged opposite to each other with a gap therebetween, and one of the microstrip line conductor patterns has a plurality of convex portions of a predetermined shape on the other microstrip line conductor pattern. A concave portion having the same shape as the convex portion is formed at a position corresponding to the convex portion, and a predetermined number of the convex portions are separated from the microstrip line conductor pattern so that the capacitance between the microstrip lines can be varied.

[Industrial Field of Application] The present invention relates to a microstrip line capacitor having a configuration in which microstrip lines are arranged opposite each other with a gap therebetween, and more particularly relates to a microstrip line capacitor used in a microwave band.

When realizing a circuit that operates in a high frequency region, especially LSI
When implementing a circuit for this purpose, an inductance component or a capacitance component is implemented using a microstrip pattern formed within the circuit.

The reason for this is that when integrated into an LSI, both active elements and passive elements in the circuit are required to be small. For this reason, when realizing capacity, it is desirable to be able to arbitrarily vary its value.

[Prior Art] FIG. 6 is a diagram showing a configuration example of a capacitor using a conventional microstrip line conductor pattern. Microstrip line conductor patterns 1 and 2 are placed facing each other with a gap 3 interposed therebetween.

A rectangular recess 1a is formed on the microstrip line conductor pattern 1 side, and a protrusion 2a is formed on the microstrip line conductor pattern 2 side at a position corresponding to the recess.
is formed. A gap 3 is formed between the concave portion 1a and the convex portion 2a.

The volume Mc per unit area between two parallel plates is C-ε
・It is expressed as S/d (1). Here, ε is the vacuum permittivity, d is the distance between two parallel plates, and S is the area of the conductor plate.

In the case of the configuration shown in FIG. 6, the capacitance cannot be simply calculated using equation (1), but it is thought that the capacitance can be calculated using equation (1) in a form similar to 4. In other words, the capacitance is considered to be inversely proportional to the gap 3 and proportional to the area S of the conductor flat plate (corresponding to the microstrip line conductor pattern here).

Specifically, in the configuration shown in the figure, the capacitance is determined by the width and length of the gap 3 and the thickness and dielectric constant of the dielectric substrate (not shown).

[Problems to be Solved by the Invention] As described above, in a conventional capacitor using a microstrip line conductor pattern, the capacitance is fixed, so the capacitance cannot be adjusted by pattern adjustment.

Therefore, in the conventional method, if you want to accurately match the capacitance, you have to cut and try the width and length of the gap 3, the thickness of the dielectric substrate (not shown), etc. each time to make the final capacitance adjustment. However, considering the complexity of the LSI package manufacturing process and the enormous cost increase due to changes in the manufacturing process, such capacity adjustment was actually impossible.

The present invention has been made in view of these problems, and an object of the present invention is to provide a microstrip line capacitor in which the capacitance of a capacitor made by arranging microstrip lines facing each other can be arbitrarily varied. The purpose is

[Means for Solving the Problems] FIG. 1 is a diagram showing the principle configuration of the present invention. Components that are the same as those in FIG. 6 are designated by the same reference numerals. In the figure, the microstrip line conductor pattern 1- has a plurality of recesses 1a.
is formed, and a land 4 from which a conductor comes out is formed in this recess 1a. In the example shown in the figure, Micros I
- Although neither convex portions nor concave portions are formed on the lip line conductor pattern 2 side, an arbitrary number of convex portions having a shape as shown in 2a in FIG. 6 may be formed. Further, the shapes of the convex portions and the concave portions do not necessarily have to be rectangular as shown in the figures, but may be of any arbitrary shape, such as a semicircular shape. 5 is a conductor ribbon for connecting the land 4 to the microstrip line conductor pattern 2.

[When the action conductor 4 and the microstrip line conductor pattern 2 are connected with the conductor ribbon 5, the gap 3 becomes narrower, and as is clear from equation (1), the capacitance
increases. If the number of lands 4 connected to the microstrip line conductor pattern 2 by the conductor ribbons 5 is increased,
The capacitance increases accordingly. In this way, the capacitance of the capacitor formed by the microstrip line can be arbitrarily adjusted in the direction of increasing it. FIG. 2 is an equivalent circuit of the principle diagram. A variable capacitor is placed on the ground line.

[Embodiments] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 3 is a configuration diagram showing an embodiment of the present invention.

In this embodiment, as described above, the microstrip line conductor pattern 2 is partially provided with a convex portion 2a. Components that are the same as those in FIG. 1 are designated by the same reference numerals. In the figure, a concave portion 1a is formed in a microstrip line conductor pattern 1, and a convex portion 2a is formed in a part of a microstrip line conductor pattern 2. This convex portion 2a has the same effect as connecting the lands 4 with the conductor ribbon 5. Note that this protrusion does not have to be formed at the lower stage, but can be provided at any position.

FIG. 4 is a block diagram showing another embodiment of the present invention. In this figure, first, a convex portion 2a as shown in FIG. As shown in the figure, the capacitance is adjusted in the direction of decreasing the capacitance by burning out the capacitance.

6 in the figure shows a land formed by burning off the convex portion 2a.

FIG. 5 is a diagram showing an example of the overall configuration of a microstrip line capacitor. Components that are the same as those in FIGS. 1 and 3 are designated by the same reference numerals. In the figure, 10 is a ground conductor, and a dielectric substrate 11 is placed on this ground conductor 10. Microstrip line conductor patterns 1 and 2 are formed on the surface of this dielectric substrate 11. 12 is the capacitor section mentioned above.

In the above-mentioned embodiment, the case where three convex portions or concave portions are provided is taken as an example, but it goes without saying that the present invention is not limited to this, and any number of convex portions or concave portions may be provided. be able to. Further, the direction of the convex portion and the concave portion may be reversed from the above-mentioned example. That is, a convex portion may be formed on the left side and a concave portion may be formed on the right side.

[Effects of the Invention] As described above in detail, according to the present invention, the land provided at the junction of a pair of microstrip line conductor patterns arranged opposite to each other with a gap is connected to one microstrip line using a conductor ribbon. Connect to a conductor pattern or
Alternatively, by cutting the protrusion, the capacitance can be increased or decreased by a certain amount, and the capacitance of a canopy made by arranging microstrip lines facing each other can be arbitrarily varied. .

[Brief explanation of the drawing]

Fig. 1 is a block diagram of the principle of the present invention, Fig. 2 is an equivalent circuit of the principle diagram, Fig. 3 is a configuration diagram showing one embodiment of the invention, and Fig. 4 is a configuration showing another embodiment of the invention. 5 is a diagram showing an example of the overall configuration of a microstrip line capacitor, and FIG. 6 is a diagram showing an example of the conventional configuration of a capacitor using a microslip line conductor pattern. In FIG. 1, 1.2 is a microstrip line conductor pattern, 1a is a recess, 3 is a gap, 4 is a land, and 5 is a conductor ribbon.

Claims (2)

[Claims] (1) Two microstrip line conductor patterns (1
), (2) are arranged facing each other with a gap therebetween, a plurality of recesses (1a) of a predetermined shape are formed in at least one of these microstrip line conductor patterns (1), (2), and these plurality of recesses A conductor land (4) is placed in each of (1a), and the conductor land (4) is connected to one side of the microstrip line conductor pattern using a conductor ribbon (5) to vary the capacitance between the microstrip lines. A microstrip line capacitor characterized in that it is configured to allow. (2) Two microstrip line conductor patterns (1
), (2) are arranged facing each other with a gap therebetween, and one of these microstrip line conductor patterns (1), (2) has a plurality of convex portions (2) of a predetermined shape.
In a), in the other microstrip line conductor pattern, a concave part of the same shape is formed at a position corresponding to the convex part, and a predetermined number of the convex parts (2a) are cut off from the microstrip line conductor pattern to form a part between the microstrip lines. A microstrip line capacitor characterized by being configured to have variable capacitance.