JPH02220429A - Coating device of resist and coating therewith - Google Patents

Abstract

PURPOSE:To minimize further differences of resist film thicknesses between a center part and the other parts of a substrate by providing an oscillation generating device and a transmission means of oscillations generated by the above oscillation generating device so that the oscillations are transmitted from the above device to the substrate to be coated when resist coating is performed. CONSTITUTION:A protruding outer circumference cylindrical part 11a which rotates in the same direction as the rotation direction of a mask substrate 13 and comes into contact with water 17 is made up, for example, so that the cylindrical part 11a may abut on the outer circumference lower end of a vacuum chuck. Then the vacuum chuck 11 is combined with a container 6 and then contact resistance between the vacuum chuck 11 and water 17 becomes low by connecting a rotation axis 12 to a drive source motor 15 through a belt 14. This configuration makes the vacuum chuck 11 rotate at great speed. Further, oscillations generated by a supersonic wave generating device 18, e.g. oscillations 30kHz are transmitted to the vacuum chuck 11 effectively. Such a transmission system minimizes differences of resist film thicknesses between a center part and the other parts of the substrate to be coated. Resist coating which is superior in reliability is thus performed.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a resist coating apparatus and a resist coating method used in the manufacture of semiconductor devices.

(Prior art) Conventionally, as a technology in this field, for example, Japanese Patent Application Laid-open No. 5
There were those shown in No. 8-12336 and Japanese Patent Application Laid-open No. 104650/1983.

Its configuration will be explained using FIGS. 5 and 6.

In these figures, l is a vacuum chuck, 2 is a rotation axis of the vacuum chuck l, and 3 is a mask substrate (or wafer). By making the top surface of mask substrate 1 and the surface of mask substrate 3 on the same plane, the resist film thickness at the outer peripheral portion of mask substrate 3 is prevented from becoming thicker than the film thickness at the center portion.

(Plot 1! I) However, even in the device with the above conventional configuration, the mask base Ii
The resist film thickness at the outer periphery of No. 3 is 1 to 1.5 of the film thickness at the center.
This makes it difficult to perform 1aII processing of the mask substrate 3.

SUMMARY OF THE INVENTION An object of the present invention is to provide a resist coating apparatus and a coating method thereof that can eliminate the above-mentioned problems and further reduce the difference in resist film thickness between the center and other parts of a substrate to be coated. .

(Means for solving !i!!l) In order to achieve the above object, the present invention provides a vibration generator (18) and a vibration generating device (18) in a resist coating apparatus used in a semiconductor device manufacturing process. A means (11,
16, 17).

In the resist coating method in the manufacturing process of a semiconductor device, vibration is applied and the resist is coated on the substrate to which the resist is coated.

(Function) According to the present invention, as described above, since the resist is applied while applying vibration to the substrate to be coated, that is, the mask substrate or the wafer, the resist can be applied to the center of the substrate to be coated and other parts. The difference in film thickness can be reduced, and resist coating with high reliability can be performed.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view of a resist coating device showing an embodiment of the present invention, FIG. 2 is a perspective view of the top of the resist coating device, and FIG. 3 is a perspective view of the vacuum chuck of the resist coating device viewed from below. FIG. 4 is a perspective view of a container for transmitting vibrations.

In these figures, 11 is a vacuum chuck, 12
13 is a rotating shaft of the vacuum chuck 11, 13 is a mask substrate, 14 is a belt connecting the rotating shaft 12 and the motor 15,
16 is a container for storing water 17 for transmitting vibrations, 18
is an ultrasonic generator, which generates vibrations of, for example, 30 KHz.

As shown in FIG. 3, the vacuum chuck 11 has a protruding outer circumferential cylindrical portion 11a which is a contact portion with water 17 in the same direction as the rotational direction of the mask substrate 13, and is provided, for example, at the lower end of the outer circumference of the vacuum chuck 11. ing. Also,
As shown in FIG. 4, the container 16 has a protruding cylindrical part 16a located around the rotating shaft 12, and an outer peripheral cylindrical part 16b formed coaxially with the protruding cylindrical part 16a, which are connected by a bottom part 16c. I'm trying to store 17 ounces of water.

A resist coating device can be obtained by combining the vacuum chuck 11 and the container 16 and connecting the rotary shaft 12 to a motor 15 as a drive source via the belt 14.

With this configuration, the vacuum chuck 1
1 and the water 17 becomes small, the vacuum chuck 11 can be rotated at high speed, and vibrations from the ultrasonic generator F1B, for example, vibrations of 30 KHz, can be effectively transmitted to the vacuum chuck 11. can.

FIG. 7 is a sectional view of a vacuum chuck showing another embodiment of the present invention. In this embodiment, the protruding cylindrical portion 11b protruding from the lower part of the vacuum chuck 11 is not provided on the outer periphery of the vacuum chuck 11. , and is arranged in the middle part of the inner side thereof.

Next, a resist coating method using this resist coating apparatus will be described.

■First, set the mask substrate 13 on the vacuum chuck 11, operate the ultrasonic generator 18, and
Apply 30KHz vibration to 3.

■The motor 15 rotates the mask substrate 13 (50~1
Resist is dropped while rotating at 0100 rpm. At this time, the vibration from the ultrasonic generator 18 remains transmitted to the mask substrate 13.

■ After dropping the resist onto the mask substrate @ 13 and spreading the resist to an appropriate level (enough to cover 50% of the mask substrate 13), move the vacuum chuck 11 at high speed (1000 to 2000
rpm). At this time as well, the vibrations from the ultrasonic generator 18 are kept being transmitted to the mask substrate 13.

After the 0 time has sufficiently elapsed (about 1 minute), the operation of the ultrasonic generator 18 is stopped, and the rotation of the vacuum chuck 11 is stopped.

In the above embodiments, a mask substrate was used as the object to be coated, but it is not limited to this, and it goes without saying that semiconductor articles such as wafers may be used.

Furthermore, the present invention is not limited to the above embodiments (
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

(Effects of the Invention) As described above in detail, according to the present invention, when applying resist, vibration is applied to the substrate to be coated, so that vibrations are applied to the center part and other parts of the substrate to be coated. The difference in resist film thickness can be reduced, and highly reliable resist coating can be performed.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a resist coating device showing an embodiment of the present invention, FIG. 2 is a perspective view of the top of the resist coating device, and FIG. 3 is a perspective view of the vacuum chuck of the resist coating device viewed from below. FIG. 4 is a perspective view of a container for transmitting vibrations according to the present invention, FIG. 5 is a sectional view of a vacuum chuck of a conventional resist coating device, FIG. 6 is a plan view of a vacuum chuck of the resist coating device, and FIG. FIG. 7 is a sectional view of a vacuum chuck of a resist coating apparatus showing another embodiment of the present invention. 11... Vacuum chuck, 12... Rotating shaft, I
3... Mask a [(wafer), 14... Belt, 1
5...Motor, 16...Container, 17...Water, 18
...Ultrasonic generator. Patent applicant: Oki Electric Industry Co., Ltd. Agent, Patent attorney: Mamoru Shimizu (one other person)

Claims (2)

[Claims] (1) A resist coating apparatus used in the manufacturing process of semiconductor devices, comprising: (a) a vibration generator; and (b) means for transmitting vibrations from the vibration generator to a substrate to be coated during resist coating. A resist coating device characterized by: (2) A method for applying a resist in a manufacturing process of a semiconductor device, which comprises applying vibration and applying a resist to a substrate to which the resist is applied.