JPH0222258Y2 - - Google Patents
Info
- Publication number
- JPH0222258Y2 JPH0222258Y2 JP4506781U JP4506781U JPH0222258Y2 JP H0222258 Y2 JPH0222258 Y2 JP H0222258Y2 JP 4506781 U JP4506781 U JP 4506781U JP 4506781 U JP4506781 U JP 4506781U JP H0222258 Y2 JPH0222258 Y2 JP H0222258Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- heat
- resin
- duct
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 23
- 238000005266 casting Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Insulating Of Coils (AREA)
- Transformer Cooling (AREA)
Description
【考案の詳細な説明】
本考案は変圧器用樹脂モールドコイルの注型金
型に関するものである。従来のこの種の注型金型
は第1図に示すように外周面用の外金型1と内周
面および底面用の内金型2とよりなり、1次コイ
ルと2次コイルとの間に冷却用のダクトを設ける
場合は、円孤形の1対のダクト金型3を使用して
いた。ところで、これらの金型に、第2図に示す
ように1次コイル4および2次コイル5を挿入
し、樹脂6を注入、硬化して樹脂モールドコイル
とする場合は、樹脂の硬化時の発熱によつてモー
ルド樹脂の内部にグラフで示すような温度差を生
ずる。すなわち、外周面は外気と接触する面積が
大きく、かつ自然対流があるので、その温度T1
は最も低く、内周面は外周面よりも面積が小さ
く、かつ自然対流が殆んどないのでその温度T2
はT1よりも高く、中間の温度T3が最も高い。そ
してT1が80℃のときはT2は90℃、T3は110℃と
なり、T1とT3の温度差Δtは30degとなる。この
温度差Δtはコイルが大型化するとさらに大きく
なる。[Detailed Description of the Invention] The present invention relates to a casting mold for a resin molded coil for a transformer. As shown in Fig. 1, this type of conventional casting mold consists of an outer mold 1 for the outer circumferential surface and an inner mold 2 for the inner circumferential surface and the bottom surface. When a cooling duct is provided between them, a pair of arc-shaped duct molds 3 are used. By the way, when a primary coil 4 and a secondary coil 5 are inserted into these molds as shown in Fig. 2, and a resin 6 is injected and hardened to make a resin molded coil, the heat generated when the resin hardens This causes a temperature difference inside the mold resin as shown in the graph. In other words, since the outer peripheral surface has a large area in contact with the outside air and there is natural convection, its temperature T 1
is the lowest, and since the inner surface has a smaller area than the outer surface and there is almost no natural convection, its temperature T 2
is higher than T 1 , and the intermediate temperature T 3 is the highest. When T 1 is 80°C, T 2 is 90°C and T 3 is 110°C, and the temperature difference Δt between T 1 and T 3 is 30 degrees. This temperature difference Δt becomes even larger as the coil becomes larger.
このように樹脂硬化時に内部に大きな温度差が
生ずると樹脂の硬化収縮が不均一になり、複雑な
内部応力を発生し、モールド樹脂にクラツクを生
ずる。また、樹脂モールド時にクラツクが発生し
なくても内部応力は残在しているので使用中にク
ラツクの生ずるおそれがある。クラツクの発生を
防止するためには樹脂モールド時の内部温度を均
一にすることが有効であり、このためには低温度
で長時間加熱することにより樹脂の硬化反応を緩
やかにすればよいが、製造時間が長くなつて生産
性が低下する。そして、この低温長時間加熱の効
果は大型の樹脂モールドコイルに対しては限度が
あつて適用しない。そこで結局、クラツクの発生
しない高価な樹脂を使用しなければならない結果
となる。 If a large temperature difference occurs inside the resin during curing, the curing and shrinkage of the resin will become uneven, generating complex internal stresses and causing cracks in the molded resin. Further, even if no cracks occur during resin molding, internal stress remains, so there is a risk that cracks may occur during use. In order to prevent the occurrence of cracks, it is effective to make the internal temperature uniform during resin molding, and for this purpose, the curing reaction of the resin can be slowed down by heating at a low temperature for a long time. Manufacturing time increases and productivity decreases. The effect of this low-temperature, long-time heating is limited and cannot be applied to large resin molded coils. As a result, an expensive resin that does not cause cracks must be used.
本考案は上記の問題点を解決することを目的と
するものであつて、内金型およびダクト金型にヒ
ートパイプを取付け、該ヒートパイプによつて樹
脂モールドコイルの内部に発生する熱を外部に導
出して放散させることを意図するものである。ヒ
ートパイプは第3図に示すように、銅、アルミ等
の熱伝導の良好な金属よりなる密閉金属管7の内
面に毛細管作用を有する多孔物質(ウイツク)よ
りなる吸着層8を形成し、内部に熱媒体液9
(水、フロン、アルコール等)を収容し、その一
端を集熱部A(蒸発部)、他端を放熱部B(凝縮部)
とするものである。10は熱伝導の良好な金属よ
りなる集熱板、11は同じく放熱板である。集熱
部Aが集熱板10の集熱した熱によつて加熱され
ると、熱媒体液9は蒸発して密閉金属管7の内部
を矢印aの方向に進行する。そして放熱部Bに達
した熱媒体の蒸気は放熱板11によつて吸熱され
て凝縮、液化し、吸着層8に沿つて矢印bで示す
ように集熱部Aに還流する。このヒートパイプの
熱輸送能力は熱伝導率の大きい銅やアルミよりも
2桁以上大きく、樹脂よりも4桁以上大きい。 The purpose of the present invention is to solve the above-mentioned problems.A heat pipe is attached to the inner mold and the duct mold, and the heat generated inside the resin molded coil is transferred to the outside by the heat pipe. It is intended to be derived and dissipated. As shown in Fig. 3, the heat pipe is made by forming an adsorption layer 8 made of a porous material (wick) with capillary action on the inner surface of a sealed metal tube 7 made of a metal with good thermal conductivity such as copper or aluminum. heat transfer liquid 9
(water, fluorocarbons, alcohol, etc.), one end of which is the heat collection part A (evaporation part), and the other end of which is the heat radiation part B (condensation part).
That is. 10 is a heat collecting plate made of a metal with good heat conduction, and 11 is a heat radiating plate. When the heat collecting portion A is heated by the heat collected by the heat collecting plate 10, the heat medium liquid 9 evaporates and moves inside the sealed metal tube 7 in the direction of the arrow a. The vapor of the heat medium that has reached the heat radiation part B is absorbed by the heat radiation plate 11, condensed and liquefied, and flows back to the heat collection part A along the adsorption layer 8 as shown by the arrow b. The heat transport capacity of this heat pipe is more than two orders of magnitude greater than that of copper or aluminum, which have high thermal conductivity, and more than four orders of magnitude greater than that of resin.
本考案の実施例を第4図ないし第7図について
説明する。第4図は内金型2の内面にヒートパイ
プの集熱部Aを装着した実施例を示している。こ
の場合、内金型2はヒートパイプの集熱板にな
る。第5図は内金型2それ自体をヒートパイプの
集熱部とした場合、すなわちヒートパイプの集熱
部Aで内金型2を形成した実施例である。第6図
はダクト金型3をヒートパイプの集熱部Aで形成
した本考案の実施例である。なおこのダクト金型
3は第4図の実施例のようにダクト金型に穴をあ
けてヒートパイプの集熱部Aを挿入してもよい。
外金型1は自然冷却が有効に行なわれるので第1
図の縦来の外金型をそのまゝ使用するが必要に応
じてヒートパイプを取付けてもよい。 An embodiment of the present invention will be described with reference to FIGS. 4 to 7. FIG. 4 shows an embodiment in which a heat collecting part A of a heat pipe is attached to the inner surface of the inner mold 2. In this case, the inner mold 2 becomes a heat collecting plate of a heat pipe. FIG. 5 shows an example in which the inner mold 2 itself is used as the heat collecting part of a heat pipe, that is, the inner mold 2 is formed by the heat collecting part A of the heat pipe. FIG. 6 shows an embodiment of the present invention in which the duct mold 3 is formed by the heat collecting part A of a heat pipe. Note that this duct mold 3 may be constructed by drilling a hole in the duct mold and inserting the heat collecting part A of the heat pipe as in the embodiment shown in FIG.
Outer mold 1 is effectively cooled naturally, so
The vertical outer mold shown in the figure is used as is, but a heat pipe may be attached if necessary.
本考案の金型を使用した場合の樹脂モールドコ
イル内の温度分布は第7図のグラフに示すとおり
であり、T1の温度が80℃のときはT2を81℃、T3
を83℃、Δtを5deg程度にすることができ、樹脂
モールドコイル内の温度分布をほぼ均一にするこ
とができる。したがつて前述の理由によつて樹脂
の硬化時にクラツクが発生するのを防止すること
ができ、また、硬化した樹脂には内部応力が殆ん
ど残存しないので、使用中にクラツクの生ずるお
それはない。そして樹脂の硬化温度を高くしても
温度分布を均一にすることができるのでその硬化
時間を短縮して樹脂モールドコイルの生産性を向
上し、かつ、樹脂の十分な硬化反応によりその架
橋密度を高めて電気的、機械的に安定な、耐熱性
のすぐれた樹脂モールドコイルをうることができ
る。 The temperature distribution inside the resin molded coil when using the mold of the present invention is as shown in the graph of Figure 7. When the temperature of T 1 is 80℃, T 2 is 81℃, and T 3 is 81℃.
can be set to 83℃ and Δt to about 5deg, making the temperature distribution inside the resin molded coil almost uniform. Therefore, it is possible to prevent cracks from occurring when the resin is cured for the reasons mentioned above, and since almost no internal stress remains in the cured resin, there is no risk of cracks occurring during use. do not have. Even if the curing temperature of the resin is increased, the temperature distribution can be made uniform, so the curing time can be shortened and the productivity of resin molded coils can be improved. It is possible to obtain a resin-molded coil that is electrically and mechanically stable and has excellent heat resistance.
第1図:従来の樹脂モールドコイルの注型金型
の斜視図、第2図:第1図の金型の使用中の断面
図、第3図:ヒートパイプの構造説明図、第4
図、第5図:本考案の注型金型の実施例の斜視
図、第6図:本考案のダクト金型の実施例の斜視
図、第7図:本考案の金型の使用中の断面図。
記号、1…外金型、2…内金型、3…ダクト金
型、4…1次コイル、5…2次コイル、6…樹
脂、7…密閉金属管(ヒートパイプ)、8…吸着
層、9…熱媒体液、10…集熱板、11…放熱
板、A…集熱部、B…放熱部。
Figure 1: A perspective view of a conventional casting mold for resin-molded coils, Figure 2: A sectional view of the mold shown in Figure 1 during use, Figure 3: An explanatory diagram of the structure of a heat pipe, Figure 4
Figures, Figure 5: A perspective view of an embodiment of the casting mold of the invention, Figure 6: A perspective view of an embodiment of the duct mold of the invention, Figure 7: During use of the mold of the invention. Cross-sectional view. Symbol, 1...Outer mold, 2...Inner mold, 3...Duct mold, 4...Primary coil, 5...Secondary coil, 6...Resin, 7...Sealed metal tube (heat pipe), 8...Adsorption layer , 9... Heat medium liquid, 10... Heat collecting plate, 11... Heat sink, A... Heat collecting section, B... Heat dissipating section.
Claims (1)
金型と、ダクト金型とよりなる注型金型におい
て、前記内金型およびダクト金型はヒートパイプ
の集熱板又はそれ自体が集熱部を形成しているこ
とを特徴とする樹脂モールドコイルの注型金型。 In a casting mold consisting of an outer mold for the outer peripheral surface, an inner mold for the inner peripheral surface and the bottom surface, and a duct mold, the inner mold and the duct mold are formed of a heat collecting plate of a heat pipe or the like. A casting mold for a resin molded coil that itself forms a heat collecting part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4506781U JPH0222258Y2 (en) | 1981-03-30 | 1981-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4506781U JPH0222258Y2 (en) | 1981-03-30 | 1981-03-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57159417U JPS57159417U (en) | 1982-10-06 |
| JPH0222258Y2 true JPH0222258Y2 (en) | 1990-06-15 |
Family
ID=29841972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4506781U Expired JPH0222258Y2 (en) | 1981-03-30 | 1981-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0222258Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103854846B (en) * | 2012-12-03 | 2017-04-19 | 深圳联影医疗科技有限公司 | Synchronous coil ejector and method for releasing coils from molds by aid of synchronous coil ejector |
-
1981
- 1981-03-30 JP JP4506781U patent/JPH0222258Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57159417U (en) | 1982-10-06 |
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