JPH02226752A - Manufacture of electronic component - Google Patents

Abstract

PURPOSE:To manufacture an electronic component, such as an IC, an LSI and the like, by a simple process by a method wherein a substrate is formed of a low-cost material like a glass ebonite in place of a sheet made of a polyimide resin. CONSTITUTION:Through holes 2 are formed in a substrate 1 consisting of an electrically insulative and low-cost synthetic resin, such as a glass ebonite and the like, and thereafter, lead parts 4 are radially formed from the side of the center of the surface of the substrate toward the outside of the surface. Then, conductive parts 5 are respectively formed on the inner periphery parts of the holes 2. Then, the substrate 1 is punched by a punching machine 3 along the holes 2 under the outside parts of the lead parts 4 and a bare chip 8 is mounted on a grounding part 6 in the center of the substrate 1 by a die bonder. This chip 8 is mounted on the substrate 1 in such a way that protruding electrodes (bump electrodes) of the chip 8 are grounded to the inner side parts of the lead parts 4. Then, after a unit 7 in the interior of the punching machine 3 is separated from the substrate 1, the substrate is mounted on a lead frame 11.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a method for manufacturing electronic components, and more particularly, to a method for easily manufacturing electronic components such as ICs and LSIs using inexpensive materials such as Gala Evo.

(Conventional technology) Electronic components such as ICs and LSIs are manufactured by mounting a bare chip on a lead frame using a die bonder, then connecting the two with a wire such as an ultra-thin gold wire using a wire bonder, and then mounting the bare chip using a mold press machine. It is manufactured by forming a molded body for sealing, and then cutting and bending the lead portions of the lead frame using a press device.

However, electronic components manufactured by such methods are
Since there is a limit to increasing the density of the lead portion, the TAB method, which can cope with miniaturization and high integration, has been reconsidered in recent years.

FIGS. 7(a) to 7(f) show the manufacturing process of electronic components using this kind of conventional TAB method.

In the same figure (a), 101 is a sheet made of polyimide resin, and lead portions 1 are etched on its upper surface.
02 are formed radially. This sheet 101 is formed by cutting a long film at a constant pitch.

Next, as shown in FIG. 5B, a bare chip 103 such as a flip chip is mounted on the center of the sheet 101 using a die bonder, and then the sheet 101 is cut to form a unit in which the lead portion 102 protrudes like a tongue. 104 (FIG. (C)), and then each lead part 102 is attached to the lead frame 1.
The unit 104 is mounted on the lead frame 105 so that it lands on each lead part 106 of 05 (FIG. 1D).
), then mold body 10 for sealing bare chip 103
After forming the lead frame 105 (FIG. 7(e)),
The electronic component 108 is completed by cutting and bending the lead portion 106 ((f) in the same figure).

(Problems to be Solved by the Invention) In the TAB method, since the lead portion 102 is formed by etching, it is possible to achieve small size and high integration.Also, since a bare chip such as a flip chip is mounted, connection work using a wire bonder is required. Although there are advantages such as eliminating the need for a polyimide resin, the polyimide resin that is the material of the sheet 101 is extremely expensive, so it has the disadvantage of increasing costs.

In addition, since the sheet 101 is extremely thin at approximately 20 μm in thickness, the unit 104 is attached to the lead frame 105.
The lead part 102 tends to wobble when mounted on the
For this reason, it was difficult to properly land each lead portion 102 on each lead portion IOG of the lead frame 105.

Further, the sheet 101 is formed by cutting a long film, but this long film requires time and effort to handle, and in particular, transporting it is troublesome, so there is a problem that work efficiency is not improved.

Therefore, an object of the present invention is to provide a method for easily manufacturing electronic components similar to those manufactured by the above TAB method using inexpensive materials.

(Means for Solving the Problems) For this purpose, the present invention includes the following steps: (i) forming a lead portion on the upper surface of a substrate made of an electrically insulating material by etching from the center toward the outside; (ii) , a step of punching out the substrate along the outer side of the lead portion; (1) a step of mounting the bare chip on the substrate so that the electrodes of the bare chip land on the inner side of the lead portion; (iv) A step of mounting the unit punched out from the substrate on a lead frame and connecting the lead portion with the lead portion of the lead frame; and (v) a step of forming a mold body for sealing the unit mounted on the lead 2 frame. and,(
vi) The step of cutting and bending the lead part from the lead frame, and the step of manufacturing the electronic component.

(Function) According to the above configuration, the substrate can be formed from an inexpensive material such as Gala Evo instead of the conventional polyimide resin sheet, and electronic components can be manufactured through simple steps.

(Example 1) Next, the present invention will be described in detail with reference to the drawings.

FIGS. 1(a) to (i) are parts diagrams in the order of manufacturing steps,
In the figure (a), reference numeral 1 denotes a substrate, which is made of an electrically insulating and inexpensive synthetic resin such as glass epoxy resin. Its thickness is, for example, about 0.3 to 1.3 mm, and it has considerable rigidity. After forming through-holes 2 in this substrate 1, a plurality of lead portions 4 shown in FIG. 2(b) are formed radially outward from the center. This lead part 4 is
It is formed by attaching a conductive sheet such as copper foil to the substrate 1 and etching to remove unnecessary parts. The through hole 2 is located on the outer side of the lead portion 4 formed in this way, and then on the inner wall surface of the through hole 2,
The conductive portion 5 is formed by plating means or the like.

Next, as shown by the punching line 3 in FIG. 2C, the board 1 is punched out along the through holes 2 on the outside of the lead part 4, and then a flip chip is attached to the landing part 6 at the center of the board 1 using a die bonder. A bare chip 8 like this is mounted ((d) in the same figure).

The bare chip 8 has its protruding electrodes (bumps) connected to the lead portion 4.
It is mounted on the board l so that it lands on the inside part of the board l. Next, the unit 7 inside the punched wire 3 is separated from the substrate 1 (FIG. 1(e)), and then mounted on the lead frame 11 (FIG. 2(f)).

FIG. 2 shows the lead frame 11. This lead frame 11 is made of a thin conductive metal plate, glass plate, ceramic plate, etc., and has a rectangular opening 12 formed in its center. A large number of tongue-shaped lead portions 13 are formed along the edge of the opening 12.
The unit 7 is mounted on the lead frame 11 so as to land on the through-hold portion 13 thereof. Further, around the opening 12, a rectangular small hole 1 is formed.
4 is formed, and small holes 15 for pitch feeding are formed on both sides of the lead frame 11. 1st
In the partial enlarged view of FIG. is the conductive part 5 and bond 1
6.

The lead frame 11 on which the unit 7 is mounted in this manner is sent to a mold press machine, and the bare chip 8 is sealed with a mold body 17 (see (g) in the same figure), and then sent to a press machine to form a lead part. 13 is cut and bent from the lead frame 11, and the electronic component 19 is completed ((h) and (i) in the same figure). In the partially enlarged view of the same figure (f), the broken line 18 is a cutting line that cuts the lead part 13 from the lead frame 11, and in the same figure (i),
20 is a protruding electrode (bump) provided protrudingly from the bare chip 8 .

By the way, the characteristics of this type of electronic component are tested by applying an electrode of a characteristics testing device to the lead portion of -m and actually applying current to the lead.

In the case of this electronic component 19, the characteristic inspection is performed in FIGS.
Perform step (e). At this stage, the lead portion 4
are exposed on the upper surface of the substrate 1 or the unit 7, and therefore inspection can be easily performed by applying the electrodes of the characteristic testing device to the lead portion 4 while conveying the line.

This inspection may be performed at any stage from (d) to (e), but at stage (d), the unit 7 is protected by being attached to the board 1, so even if it is handled roughly, it will not be damaged. Therefore, it is easier to conduct a characteristic test in stage (d) than in stage (e).

(Example 2) FIG. 3 shows another example, which includes:
The lead portion 4 is formed on the substrate 1 by etching.
a)) Next, this is punched out to form the unit 7, and a bare chip 8 such as a flip chip is mounted (FIG. 4(b)).As shown in FIG. A protruding electrode 25 is formed on the protruding electrode 2.
A bare chip 8a having no bumps may be mounted on the chip 5.

Next, this unit 7 is mounted on a lead frame 11 with the bare chip 8 facing downward (see (C) in the same figure).The lead portion 13 of the lead frame 11 has protruding electrodes 25 protruding from the lead portion 4. This protruding electrode 25 is grounded. Incidentally, as shown in FIG. 5, a protruding electrode 26 may be formed on the outer side of the lead part 4 on the unit 7 side, and this protruding electrode 26 may be made to land on the lead part 13. Next, the molded body 17 is formed in the same manner as in the first embodiment, and the lead portions 13 are cut and bent to complete the electronic component. According to this means, the steps of forming the through holes 2 and the conductive portions 5 and the step of applying the bond 16 can be omitted.

Note that in the above embodiment, one electronic component 1 is transferred from one substrate 1.
The explanation was given using the case of a single-cavity machine manufacturing 9 as an example.
As shown in FIG. 6, multiple electronic components may be produced simultaneously from a large substrate 21. Further, the above process order may be changed as appropriate; for example, after punching the substrate 1, the through holes 2 may be formed, or punching and forming the through holes 2 may be performed at the same time. It is a good thing.

(Effects of the Invention) As explained above, according to the present invention, electronic components can be easily manufactured using an inexpensive and easy-to-handle material such as Gala Evo instead of expensive polyimide resin.

[Brief explanation of the drawing]

The figure shows an embodiment of the present invention, and FIG. 1(a)
- (1) are parts diagrams in the order of the manufacturing process, Figure 2 is a perspective view of the lead frame, Figures 3 (3m) - (C) are parts diagrams in the order of the manufacturing process of other examples, Figures 4 and 3 5 is a partial side view of another embodiment, FIG. 6 is a perspective view of a multi-piece board, and FIGS. 7(a) to 7(f) are component diagrams showing the order of manufacturing steps in a conventional method. 1...Substrate 4...Lead part 7...Unit 8.8a...Bare chip 11...Lead frame 13...Lead part 17...Mold body

Claims (1)

[Claims] (i) forming a lead portion on the upper surface of a substrate made of an electrically insulating material by etching from the center to the outside; (ii) forming a lead portion on the upper surface of the substrate along the outer side of the lead portion; (iii) mounting the bare chip on the board so that the electrodes of the bare chip land on the inside of the lead part; (iv) mounting the unit punched from the board on a lead frame. (v) forming a molded body for sealing the unit mounted on the lead frame; and (vi) cutting the lead part from the lead frame. A method of manufacturing an electronic component, comprising: a step of bending the component by bending the component.