JPH0222764B2 - - Google Patents

Info

Publication number
JPH0222764B2
JPH0222764B2 JP18651882A JP18651882A JPH0222764B2 JP H0222764 B2 JPH0222764 B2 JP H0222764B2 JP 18651882 A JP18651882 A JP 18651882A JP 18651882 A JP18651882 A JP 18651882A JP H0222764 B2 JPH0222764 B2 JP H0222764B2
Authority
JP
Japan
Prior art keywords
weight
parts
block copolymer
epoxy
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP18651882A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5975922A (ja
Inventor
Hiroshi Nishikawa
Takaki Saruta
Shinichiro Asai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP18651882A priority Critical patent/JPS5975922A/ja
Priority to US06/544,242 priority patent/US4529755A/en
Publication of JPS5975922A publication Critical patent/JPS5975922A/ja
Publication of JPH0222764B2 publication Critical patent/JPH0222764B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP18651882A 1982-10-23 1982-10-23 エポキシ樹脂系成形材料 Granted JPS5975922A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP18651882A JPS5975922A (ja) 1982-10-23 1982-10-23 エポキシ樹脂系成形材料
US06/544,242 US4529755A (en) 1982-10-23 1983-10-21 Epoxy resin composition for encapsulating semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18651882A JPS5975922A (ja) 1982-10-23 1982-10-23 エポキシ樹脂系成形材料

Publications (2)

Publication Number Publication Date
JPS5975922A JPS5975922A (ja) 1984-04-28
JPH0222764B2 true JPH0222764B2 (2) 1990-05-21

Family

ID=16189896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18651882A Granted JPS5975922A (ja) 1982-10-23 1982-10-23 エポキシ樹脂系成形材料

Country Status (1)

Country Link
JP (1) JPS5975922A (2)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61221223A (ja) * 1985-03-27 1986-10-01 Toshiba Corp 半導体封止用エポキシ樹脂組成物
JPS6222825A (ja) * 1985-07-23 1987-01-31 Toshiba Chem Corp 封止用樹脂組成物
JPH07108934B2 (ja) * 1987-06-09 1995-11-22 財団法人接着剤研究所 水添ブロツク共重合体分散液状エポキシ樹脂組成物
JPS6481847A (en) * 1987-09-24 1989-03-28 Asahi Chemical Ind Resin composition for semiconductor sealing use
JPH01236226A (ja) * 1988-03-17 1989-09-21 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPH0611783B2 (ja) * 1988-04-28 1994-02-16 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物
JP2823569B2 (ja) * 1988-10-06 1998-11-11 東レ株式会社 エポキシ系組成物
JPH0299551A (ja) * 1988-10-06 1990-04-11 Toray Ind Inc エポキシ系樹脂組成物
JP2560469B2 (ja) * 1989-02-20 1996-12-04 東レ株式会社 エポキシ系樹脂組成物
JP2503067B2 (ja) * 1989-02-20 1996-06-05 東レ株式会社 エポキシ組成物
JP2541712B2 (ja) * 1990-06-18 1996-10-09 東レ株式会社 半導体封止用エポキシ樹脂組成物
JPH04202555A (ja) * 1990-11-30 1992-07-23 Toray Ind Inc 半導体封止用エポキシ樹脂組成物
JP4395343B2 (ja) 2003-08-01 2010-01-06 株式会社エクセディ ロックアップ装置のダンパー機構

Also Published As

Publication number Publication date
JPS5975922A (ja) 1984-04-28

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