JPS5975922A - エポキシ樹脂系成形材料 - Google Patents

エポキシ樹脂系成形材料

Info

Publication number
JPS5975922A
JPS5975922A JP18651882A JP18651882A JPS5975922A JP S5975922 A JPS5975922 A JP S5975922A JP 18651882 A JP18651882 A JP 18651882A JP 18651882 A JP18651882 A JP 18651882A JP S5975922 A JPS5975922 A JP S5975922A
Authority
JP
Japan
Prior art keywords
epoxy resin
weight
block copolymer
molding material
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18651882A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0222764B2 (2
Inventor
Hiroshi Nishikawa
洋 西川
Takaki Saruta
猿田　宇樹
Shinichiro Asai
新一郎 浅井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP18651882A priority Critical patent/JPS5975922A/ja
Priority to US06/544,242 priority patent/US4529755A/en
Publication of JPS5975922A publication Critical patent/JPS5975922A/ja
Publication of JPH0222764B2 publication Critical patent/JPH0222764B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP18651882A 1982-10-23 1982-10-23 エポキシ樹脂系成形材料 Granted JPS5975922A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP18651882A JPS5975922A (ja) 1982-10-23 1982-10-23 エポキシ樹脂系成形材料
US06/544,242 US4529755A (en) 1982-10-23 1983-10-21 Epoxy resin composition for encapsulating semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18651882A JPS5975922A (ja) 1982-10-23 1982-10-23 エポキシ樹脂系成形材料

Publications (2)

Publication Number Publication Date
JPS5975922A true JPS5975922A (ja) 1984-04-28
JPH0222764B2 JPH0222764B2 (2) 1990-05-21

Family

ID=16189896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18651882A Granted JPS5975922A (ja) 1982-10-23 1982-10-23 エポキシ樹脂系成形材料

Country Status (1)

Country Link
JP (1) JPS5975922A (2)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61221223A (ja) * 1985-03-27 1986-10-01 Toshiba Corp 半導体封止用エポキシ樹脂組成物
JPS6222825A (ja) * 1985-07-23 1987-01-31 Toshiba Chem Corp 封止用樹脂組成物
JPS63308027A (ja) * 1987-06-09 1988-12-15 Setsuchiyakuzai Kenkyusho 水添ブロツク共重合体分散液状エポキシ樹脂組成物
JPS6481847A (en) * 1987-09-24 1989-03-28 Asahi Chemical Ind Resin composition for semiconductor sealing use
JPH01236226A (ja) * 1988-03-17 1989-09-21 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPH01275620A (ja) * 1988-04-28 1989-11-06 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPH0299513A (ja) * 1988-10-06 1990-04-11 Toray Ind Inc エポキシ系組成物
JPH0299551A (ja) * 1988-10-06 1990-04-11 Toray Ind Inc エポキシ系樹脂組成物
JPH02218736A (ja) * 1989-02-20 1990-08-31 Toray Ind Inc エポキシ系樹脂組成物
JPH02218734A (ja) * 1989-02-20 1990-08-31 Toray Ind Inc エポキシ組成物
JPH04202555A (ja) * 1990-11-30 1992-07-23 Toray Ind Inc 半導体封止用エポキシ樹脂組成物
JPH04226123A (ja) * 1990-06-18 1992-08-14 Toray Ind Inc 半導体封止用エポキシ樹脂組成物
US7108112B2 (en) 2003-08-01 2006-09-19 Exedy Corporation Damper mechanism for a lockup clutch

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61221223A (ja) * 1985-03-27 1986-10-01 Toshiba Corp 半導体封止用エポキシ樹脂組成物
JPS6222825A (ja) * 1985-07-23 1987-01-31 Toshiba Chem Corp 封止用樹脂組成物
JPS63308027A (ja) * 1987-06-09 1988-12-15 Setsuchiyakuzai Kenkyusho 水添ブロツク共重合体分散液状エポキシ樹脂組成物
JPS6481847A (en) * 1987-09-24 1989-03-28 Asahi Chemical Ind Resin composition for semiconductor sealing use
JPH01236226A (ja) * 1988-03-17 1989-09-21 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPH01275620A (ja) * 1988-04-28 1989-11-06 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPH0299513A (ja) * 1988-10-06 1990-04-11 Toray Ind Inc エポキシ系組成物
JPH0299551A (ja) * 1988-10-06 1990-04-11 Toray Ind Inc エポキシ系樹脂組成物
JPH02218736A (ja) * 1989-02-20 1990-08-31 Toray Ind Inc エポキシ系樹脂組成物
JPH02218734A (ja) * 1989-02-20 1990-08-31 Toray Ind Inc エポキシ組成物
JPH04226123A (ja) * 1990-06-18 1992-08-14 Toray Ind Inc 半導体封止用エポキシ樹脂組成物
JPH04202555A (ja) * 1990-11-30 1992-07-23 Toray Ind Inc 半導体封止用エポキシ樹脂組成物
US7108112B2 (en) 2003-08-01 2006-09-19 Exedy Corporation Damper mechanism for a lockup clutch

Also Published As

Publication number Publication date
JPH0222764B2 (2) 1990-05-21

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