JPH02230673A - Semiconductor socket - Google Patents

Semiconductor socket

Info

Publication number
JPH02230673A
JPH02230673A JP5222689A JP5222689A JPH02230673A JP H02230673 A JPH02230673 A JP H02230673A JP 5222689 A JP5222689 A JP 5222689A JP 5222689 A JP5222689 A JP 5222689A JP H02230673 A JPH02230673 A JP H02230673A
Authority
JP
Japan
Prior art keywords
socket
semiconductor
semiconductor socket
lever
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5222689A
Other languages
Japanese (ja)
Inventor
Hiroyuki Fukuda
浩之 福田
Atsushi Ozaki
尾崎 敦司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5222689A priority Critical patent/JPH02230673A/en
Publication of JPH02230673A publication Critical patent/JPH02230673A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は半導体ソケットに関するものである。[Detailed description of the invention] [Industrial application field] This invention relates to semiconductor sockets.

〔健来の技術〕[Kenki's technology]

第2図愼1{b;は従来の半導体ソケットに半導体装置
(以下、soyとする)t−装着した状態をを示す図で
あり, talは正面断面図、+b+ n Ill!l
而断面図である。
FIG. 2 is a diagram showing a state in which a semiconductor device (hereinafter referred to as "SOY") is attached to a conventional semiconductor socket, tal is a front sectional view, and +b+ n Ill! l
It is a sectional view.

図において%+111はSO.T,巾は半導体ソケット
、21に半導体ソケット…のX極部分、131は8os
dvのリード、14+ Viパッケージ、、51はso
.y+1Ui半導体ソグツ} Il+から脱着する際に
用いる細い棒状の物である。
In the figure, %+111 is SO. T, width is a semiconductor socket, 21 is the X pole part of the semiconductor socket, 131 is 8os
dv lead, 14+ Vi package, 51 is so
.. y+1Ui Semiconductor Sog} It is a thin rod-shaped thing used when detaching from Il+.

次VC@作について説明丁る。8 0 J .111を
半導体ソケット…から脱着する際には、半導体ソケット
…と8 0 .7 .111のパッケージ14:との空
隙に先端の抽い棒伏の物+61を題し込んでてこの作用
で睨着する◎ 〔発明が解決しようとする課題〕 従来の半導体ソケットハ半導体ソケットとSOJの偽か
な2l2!原に、主に金属の先熾が細くなっている憧伏
の吻?差し込んで,てこの作用で脱着させるため.ソケ
ットが菫耗したり.soyのパッケージに鶴が付いたり
,さらVCは,金稿性の俸伏の物がソケットの′小極部
に康触し,ショートの原因になるなどの問題点があった
I will explain about the next VC @ work. 80 J. When attaching and detaching 111 from the semiconductor socket... and 80. 7. Package 14 of 111: In the gap between package 14: and the object with a drawer at the tip + 61, it is used as a leverage. [Problem to be solved by the invention] Is the conventional semiconductor socket a fake of the semiconductor socket and SOJ? 2l2! A longing proboscis with a tapered metal tip on the original? To insert and remove using lever action. The socket is worn out. There were problems such as cranes sticking to the soy package, and VC's metal parts touching the small end of the socket and causing a short circuit.

この究明は,上記の問題点を解決するためになされたも
ので,ソケットの摩耗や80Jのパッケージに傷が付か
ず,j4属性の棒状の′吻がソケットと′1極部とのシ
ョートの危険性がなく,容易に半導体ソケットからso
yt悦膚可能な半導体ソケット金得ること金目的とする
This investigation was carried out in order to solve the above-mentioned problems.It does not cause the socket to wear out or the 80J package to be damaged, and the rod-shaped proboscis of the j4 attribute prevents the risk of short circuit between the socket and the pole part. Easy to remove from semiconductor socket.
yt's objective is to obtain a viable semiconductor socket.

〔課題を贋決fるための手段〕[Means for rejecting assignments]

この発明に係る半導体ソケットは半導体ソケットにレバ
ーを設けることで,80Jiソケットから、容易に脱着
可能としたものである。
The semiconductor socket according to the present invention can be easily attached and detached from an 80Ji socket by providing a lever on the semiconductor socket.

〔作用〕[Effect]

この発明における半導体ソケットは半導体ソケットVC
B Off f持ち,上げるレバー金設けることにより
,80J金容易に睨着することを可能にする。
The semiconductor socket in this invention is a semiconductor socket VC.
By providing a lever metal to hold and raise B Off f, it is possible to easily glare at 80J gold.

〔天施例〕[Heavenly example]

以下、この発明の一実褌例?図について説明丁る.第1
図は,80J全ソケットに装着した時の図であり.ta
lri正面断面図、fbnに画面断而図である。(7:
は溝がある半導体ソケットで,80J(直り全持ち上げ
るレバー18)がこの溝の中全通っており.(81[レ
バーtelの軸となる部分である。(41ij: 8 
0 J tllJのパッケージ.13:はSOJLIυ
のリードで、半導体ソケット12)の電極部分と妥触し
ている。
Is the following an example of this invention? Explain the diagram. 1st
The figure shows when all 80J sockets are installed. ta
A front sectional view of LRI, and a screen cutaway view of FBN. (7:
This is a semiconductor socket with a groove, and the 80J (lever 18 that lifts the entire socket) passes completely through this groove. (81 [This is the part that becomes the axis of the lever tel. (41ij: 8
0 J tllJ package. 13: is SOJLIυ
The lead is in contact with the electrode portion of the semiconductor socket 12).

次VC動作について説明する。Next, the VC operation will be explained.

80Ji半導体ソケット7}から脱着する場合、半導体
ソケット(71のレバー16)に(91の方向に力倉加
えると,レバー161μ80JIIυに+Ifllの方
向に力が作用し,So,TLIIIは脱着する。
80Ji semiconductor socket 7}, when a force is applied to the semiconductor socket (lever 16 of 71) in the direction of (91), a force acts on the lever 161μ80JIIυ in the direction of +Ifll, and So and TLIII are attached and detached.

〔開明の幼果〕[Young fruit of Kaimei]

以上のように、この発明によれば半導体ソケットのレバ
ーを半導体ソケットに取付けたので、容易にBOJf脱
着することができ、脱着する一に生じる半導体ソケット
の摩耗やパッケージへの嚇付けを防ぐことができ、レバ
ーを半導体ソケツの溝部分に埋め込んであるので,装着
した際のSOJの安定性が良いという効果もある。
As described above, according to the present invention, since the lever of the semiconductor socket is attached to the semiconductor socket, it is possible to easily attach and detach the BOJf, and it is possible to prevent wear of the semiconductor socket and damage to the package that occur during attachment and detachment. Since the lever is embedded in the groove of the semiconductor socket, it also has the effect of improving the stability of the SOJ when installed.

4.図而のi#I屯な説明 第1図ij80,Ti半導体ソケットに装着した状態の
図であり%ia+は正面断面図、fb+は則而断而図で
ある。第8図は従来の半導体ソケットにEIOJ1ft
装着し九図であり, IJLIは正面断面図、b1は刈
而断面図である。
4. Figure 1 is a diagram of the ij80 installed in a Ti semiconductor socket, with %ia+ being a front sectional view and fb+ being a sectional view. Figure 8 shows EIOJ1ft installed in a conventional semiconductor socket.
Figure 9 shows the installation, IJLI is a front sectional view, and b1 is a sectional view.

図において,{71は韓がある半導体ソケット、+21
 flンゲットの電極部分,・31ijSOJのリード
,41ij80Jのパッケージ%161ハ半導体ソケッ
ト(フ)のレバー%+81 +ゴレバーの支点である。
In the figure, {71 is a semiconductor socket with a handle, +21
The electrode part of the fl ringet, the lead of 31ij SOJ, the package of 41ij80J%161c is the lever of the semiconductor socket (F)%+81+the fulcrum of the go lever.

なお,図中,同一符′pjハ同一 又は相当部分倉示す
In addition, in the figure, the same symbol 'pj' indicates the same or a corresponding portion.

Claims (1)

【特許請求の範囲】[Claims] 半導体ソケットにおいて、半導体装置を脱着するための
レバーを設けることで、半導体装置を容易に脱着できる
ことを特徴とする半導体ソケット。
A semiconductor socket characterized in that a semiconductor device can be easily attached and detached by providing a lever for attaching and detaching a semiconductor device.
JP5222689A 1989-03-03 1989-03-03 Semiconductor socket Pending JPH02230673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5222689A JPH02230673A (en) 1989-03-03 1989-03-03 Semiconductor socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5222689A JPH02230673A (en) 1989-03-03 1989-03-03 Semiconductor socket

Publications (1)

Publication Number Publication Date
JPH02230673A true JPH02230673A (en) 1990-09-13

Family

ID=12908828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5222689A Pending JPH02230673A (en) 1989-03-03 1989-03-03 Semiconductor socket

Country Status (1)

Country Link
JP (1) JPH02230673A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100466400C (en) * 2004-03-12 2009-03-04 安普泰科电子有限公司 IC socket

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100466400C (en) * 2004-03-12 2009-03-04 安普泰科电子有限公司 IC socket

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