JPH02232995A - semiconductor equipment - Google Patents

Abstract

PURPOSE:To enable soldering to be easily and securely made by providing a simple structure by a method wherein a printed board support member is provided to the side face of the external electrode terminal of a power semiconductor module. CONSTITUTION:Support members 10 which support a printed board 3 are provided to the side faces of external electrode terminals 2 of a power semiconductor module 1. By this setup, when terminals 2 are soldered to the lands of the printed board 3, the board 3 is prevented from moving up or down by the members 10 provided adjacent to the lands. Therefore, stable and secure soldering can be easily made.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a power semiconductor device devised to facilitate stable and reliable soldering of a printed circuit board to an external electrode terminal of a power semiconductor module, etc. It is something. [Prior Art] FIG. 3 shows an example of a conventional power semiconductor module and its mounting method. In the figure, 1 is a power semiconductor module, 2 is an external electrode terminal of this power semiconductor module 1, and 3 is this external electrode terminal. 2 and a printed circuit board connected by solder 4 and wired to drive the power semiconductor module 1; 5 is the power semiconductor module 1;
A metal plate is attached with screws 6 and nuts 7, 8 is a support rod installed between the metal plate 5 and the printed circuit board 3 to support the printed circuit board 3, and 9 is a fixing screw thereof. A conventional power semiconductor module and its mounting method are constructed as described above, in which the power semiconductor module 1 is mounted on the metal plate 5, the external electrode terminals 2 are passed through the land holes 3a to be connected to the printed circuit board 3, and the printed circuit board is attached to the printed circuit board. 3
After fixing one side to the support rod 8, the external electrode terminal 2 is fixed to the support rod 8.
was soldered to printed circuit board 3. [Problem to be Solved by the Invention] However, when the external electrode terminals 2 of the power semiconductor module 1 are soldered to the lands of the printed circuit board 3 by the method described above, even if one side of the printed circuit board 3 is fixed, However, when applying the solder to the lands of the printed circuit board 3 and soldering, there is no support for the printed circuit board 3 near the lands to be soldered on the printed circuit board 3, so the printed circuit board 3 may be tilted vertically. The disadvantage was that it moved and made stable and reliable soldering difficult. This invention was made in order to eliminate the above-mentioned drawbacks, and its purpose is to provide a semiconductor device in which a printed circuit board can be stably, quickly and reliably soldered to an external electrode terminal of a power semiconductor module or the like. [Means for Solving the Problems] A semiconductor device according to the present invention includes a support member for supporting a printed circuit board on the surface of a power semiconductor module on the external electrode terminal side. [Function] Since the support member of the present invention stably supports the land hole side of the printed circuit board, the soldering work of external electrode terminals to the printed circuit board can be performed quickly and reliably. [Embodiment] Fig. 1 shows an embodiment of the present invention. In Fig. 1, 1 to 9 are exactly the same as in the case of the conventional device described above, so the explanation will be omitted. 10 is a power This is a support member that supports the printed circuit board 3 and is provided on the surface of the external electrode terminal 2 of the semiconductor module 1. In the power semiconductor module 1 configured as described above, when the external electrode terminal 2 is soldered to the land portion of the printed circuit board 3, the printed circuit board 3 is
Since it does not move up and down, it becomes easier to perform stable and reliable soldering. In the above embodiment, the power semiconductor module 1 is provided at two locations on both sides near the external electrode terminal 2, but as shown in FIG. Similar effects can be obtained by providing a supporting member lO around the power semiconductor module 1 as shown in FIG. [Effects of the Invention] As explained above, the present invention has a simple structure in which a support member for supporting a printed circuit board is provided on the surface of a power semiconductor module on the external electrode terminal side, thereby facilitating stable and reliable soldering. It has excellent effects.

[Brief explanation of the drawing]

Claims (1)

[Claims] In a device in which an external electrode terminal of a power semiconductor module fixed on a metal plate is connected by soldering to a land portion of a printed circuit board arranged parallel to the metal plate, the external electrode terminal side of the power semiconductor module is A semiconductor device comprising: a support member extending between the surface of the printed circuit board and the printed circuit board to support the printed circuit board;