JPH0223510B2 - - Google Patents
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- Publication number
- JPH0223510B2 JPH0223510B2 JP61206464A JP20646486A JPH0223510B2 JP H0223510 B2 JPH0223510 B2 JP H0223510B2 JP 61206464 A JP61206464 A JP 61206464A JP 20646486 A JP20646486 A JP 20646486A JP H0223510 B2 JPH0223510 B2 JP H0223510B2
- Authority
- JP
- Japan
- Prior art keywords
- carbon
- carbon material
- coated
- glassy
- thermal decomposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Ceramic Products (AREA)
- Carbon And Carbon Compounds (AREA)
Description
(産業上の利用分野)
この発明はシリコンウエハーなどのエピタキシ
ヤル気相成長、その他各種絶縁膜の気相成長や、
多結晶膜の気相成長などの工程におけるサセプタ
ーとして用いられるガラス状炭素被覆炭素材の製
造方法に関する。
(従来の技術)
半導体の製造工程に用いるサセプターは一般に
炭素材の表面に炭化けい素被覆を施したものが広
く用いられて来たが、炭素質素材と炭化けい素と
の間の熱膨張係数の差によつて、サセプターの使
用中に層間亀裂や、はく離が発生し易いため、炭
素質素材中の不純物によりシリコンウエハーへの
汚染を起すうれいがある上、とくに近年要求が強
まりつつあるサセプターの大型化への対応も難し
い。
一方ハロゲン化線状重合体又は天然有機重合体
を不活性雰囲気中で、生成物の炭素原子と水素原
子の原子組成比(以下、C/H比という)が1な
るピツチ状化合物に分解するまで加熱し、得られ
た化合物を芳香族溶剤と混合してスラリーを形成
し、炭素またはセラミツク材料から形成された物
品をそのスラリーで被覆し、被覆がガラス状炭素
に変るまで前記物品を不活性雰囲気中昇温下で焼
成することによつてガラス状炭素被覆物品を製造
する方法が知られている(特公昭52−39684号公
報)。
この方法によれば確かに層間亀裂や、はく離の
発生は改善されたが、ガラス状炭素被覆にピンホ
ールが形成されるという欠点があつた。ピンホー
ルが生ずると基材の炭素材に含まれている不純物
がピンホールを通つて物品の表面に出てくるの
で、その表面に載せたシリコンウエハー等を汚染
することになる。
(発明が解決しようとする問題点)
ピンホールをはじめ亀裂やはく離を来たすこと
なく、しかも緻密で平滑な表面性状を有し、半導
体の製造工程でサセプターとして有用な、ガラス
状炭素被覆炭素材の有利な製造方法を与えること
がこの発明の目的である。
(問題点を解決するための手段)
発明者らは上に述べたような欠点を解決するた
め、有機重合体の熱分解の度合いについて鋭意研
究を行つた。その結果、不完全熱分解生成物の炭
素と水素の原子組成比C/Hが1.1以上、20以下
であるものを用いると前記欠点が解消することを
見出し、この発明を完成するに至つた。
すなわち、この発明は有機重合体の不完全熱分
解生成物を有機溶剤に溶解して、炭素材表面に塗
布・乾燥し、不活性環境中で加熱することにより
該炭素材表面にガラス状炭素を被覆させる際に前
記不完全熱分解生成物として、その炭素と水素の
原子組成比C/Hが1.1以上20以下であるものを
用いることを特徴とするガラス状炭素被覆炭素材
の製造法である。
以下、この発明について詳しく説明する。
この発明で用いる有機重合体は、塩化ビニル樹
脂、ポリビニルアルコール、油溶性フエノール樹
脂、アルキルフエノール樹脂、塩素化パラフイ
ン、塩素化ポリプロピレン、酢酸ビニル樹脂また
はポリカーボネート樹脂が好適である。
とくにガラス状炭素被覆炭素材の使途が半導体
製造用サセプターの場合には、不純物の面から上
記のうち塩化ビニル樹脂がとりわけ好ましい。
これら有機重合体の不完全熱分解にはその種類
を問わず粒状品又は粉末を、不活性環境中で200
〜700℃で30分以上加熱して行う。加熱の具体的
な温度・時間は加熱装置および有機重合体の種類
によつて異なるが、不完全熱分解生成物(以下、
PC物質という)の炭素と水素の原子組成比(以
下、C/H比という)が結果的に1.1以上20以下、
好ましくは1.1以上2以下、より好ましくは1.1以
上1.5以下の範囲に入るよう実験により定めれば
よい。C/H比の測定は通常の有機化合物用の元
素分析装置によりCとHの含有率を測定してその
比を求めればよい。
なお、ここにおいて不活性環境とは窒素、アル
ゴンなどの不活性雰囲気または減圧された空気を
意味する。
熱分解生成物のC/H比が1.1未満であると、
有機溶剤には溶解しやすいが、水素原子が多いた
めに炭素化する際に水素ガスが発生し、そのため
ガラス状炭素被覆に気泡が生じ、クラツクやピン
ホールの原因になる。
熱分解生成物のC/H比が20を越えると、その
熱分解生成物は有機溶剤には溶解しなくなり、炭
素材表面へ被覆することができなくなる。
このようにして得られるピツチ状物質に有機溶
剤を加えて溶解させ、濃度10〜300g/の溶液を
作り、これを炭素材表面に塗布する。有機溶剤は
トリクロロエチレン、1,1,1−トリクロロエ
タンなどの脂肪族塩素系溶剤またはベンゼン、ト
ルエンなどの芳香族系溶剤が好ましい。塗布の方
法は超音波含浸、はけ塗り、スプレー、浸漬など
である。塗布した後に比較的低温(50〜100℃て
いど)で乾燥することが好ましい。
塗布後は、不活性環境下で800〜1300℃で30分
以上の加熱を施しPC物質をガラス化し、ガラス
状炭素被覆炭素材を得るわけである。なお、不活
性環境とは前記の通りである。
次に炭素材は好ましくは嵩密度が1.6〜2.0g/
cm3の黒鉛である。嵩密度のより低い炭素材ではそ
の強度が低すぎて耐久性に劣りかつ開気孔率が大
きくなるため塗布溶剤が表面に浸透しにくくピン
ホールの原因にもなりやすいのに反し嵩密度のよ
り高い炭素質素材は、表面の気孔が少なく滑なか
すぎるため、有機重合体の熱分解生成物溶液によ
る塗膜がはがれ易くなる。
(実施例)
実施例 1〜4
塩化ビニル樹脂(電気化学工業(株)製SS−110)
100gを管状炉に入れ、表に示す温度でアルゴン
ガス雰囲気下で90分加熱した。生成したPC物質
のC/H比をCHNコーダーで測定した。
PC物質を乳鉢で粉砕しベンゼンを加えて表に
示す濃度で溶解し、この溶液を等方性で、嵩密度
が1.75g/cm3である炭素材(30mm×50mm×10mm)
に浸漬法で塗布した。
次にアルゴンガス雰囲気中1200℃で1時間加熱
し炭素化した。
塗布及び加熱を数回くり返し、被膜厚が15μm
であるガラス状被覆炭素材を製造した。各製造条
件毎に5枚の炭素材を準備し、それぞれに溶液塗
布と炭素化をくり返し行つた。
得られた製品の評価は、顕微鏡によるピンホー
ル数の観察及び気体透過量の測定(LYSSY製
GPM−200形装置使用)を行つた。ピンホール数
の観察は5枚の試験片全部について行ない、気体
透過量の測定は5枚の試験片に製造した1枚のみ
について行つた。
気体透過量の測定値は、被覆の緻密さの度合い
を示すものであり、値が小さいほど緻密であると
みなされる。
製造した炭素材を評価した結果は表にまとめて
示した通りである。
実施例 5〜8
塩化ビニル樹脂の代りに酢酸ビニル樹脂(電気
化学工業(株)SH−10)、アルキルフエノール樹脂
(日本化成工業(株)製2306N)を用いた他は実施例
1〜4と同様にしてガラス状被覆炭素材を製造し
た。製造条件および製造した炭素材を評価した結
果は表に示した通りである。
比較例 1〜8
PC物質のC/H比が1.1未満のもの、または20
を越えるものを用いた外は実施例1〜8に準拠し
て行なつた。製造条件および製造した炭素材を評
価した結果は表に示した通りである。
(Field of Industrial Application) This invention is applicable to epitaxial vapor phase growth of silicon wafers, etc., vapor phase growth of various other insulating films,
The present invention relates to a method for manufacturing a glassy carbon-coated carbon material used as a susceptor in processes such as vapor phase growth of polycrystalline films. (Prior art) Susceptors used in semiconductor manufacturing processes have generally been widely used, with the surface of a carbon material coated with silicon carbide. Due to the difference in susceptor, interlayer cracks and delamination are likely to occur during use of the susceptor, which may cause contamination of the silicon wafer due to impurities in the carbonaceous material. It is also difficult to respond to larger sizes. On the other hand, the halogenated linear polymer or natural organic polymer is decomposed in an inert atmosphere into a pitch-like compound in which the atomic composition ratio of carbon atoms and hydrogen atoms (hereinafter referred to as C/H ratio) of the product is 1. heating and mixing the resulting compound with an aromatic solvent to form a slurry, coating an article formed from carbon or ceramic material with the slurry, and subjecting the article to an inert atmosphere until the coating converts to glassy carbon. A method for manufacturing glassy carbon-coated articles by firing at moderately elevated temperatures is known (Japanese Patent Publication No. 39684/1984). Although this method certainly improved the occurrence of interlayer cracks and peeling, it had the disadvantage that pinholes were formed in the glassy carbon coating. When a pinhole occurs, impurities contained in the carbon material of the base material pass through the pinhole and come out onto the surface of the article, contaminating the silicon wafer or the like placed on the surface. (Problems to be Solved by the Invention) A glass-like carbon-coated carbon material that does not cause pinholes, cracks, or peeling, has a dense and smooth surface, and is useful as a susceptor in the semiconductor manufacturing process. It is an object of the invention to provide an advantageous manufacturing method. (Means for Solving the Problems) In order to solve the above-mentioned drawbacks, the inventors conducted intensive research on the degree of thermal decomposition of organic polymers. As a result, the inventors found that the above drawbacks can be overcome by using incomplete thermal decomposition products having an atomic composition ratio C/H of carbon to hydrogen of 1.1 or more and 20 or less, and have completed the present invention. That is, this invention dissolves an incomplete thermal decomposition product of an organic polymer in an organic solvent, applies it to the surface of a carbon material, dries it, and heats it in an inert environment to form glassy carbon on the surface of the carbon material. A method for producing a glassy carbon-coated carbon material, characterized in that the incomplete thermal decomposition product used for coating is one whose atomic composition ratio C/H of carbon and hydrogen is 1.1 or more and 20 or less. . This invention will be explained in detail below. The organic polymer used in this invention is preferably vinyl chloride resin, polyvinyl alcohol, oil-soluble phenolic resin, alkylphenol resin, chlorinated paraffin, chlorinated polypropylene, vinyl acetate resin, or polycarbonate resin. In particular, when the glassy carbon-coated carbon material is used as a susceptor for semiconductor manufacturing, vinyl chloride resin is particularly preferred from the viewpoint of impurities. For incomplete pyrolysis of these organic polymers, any type of granular or powdered material is
This is done by heating at ~700℃ for 30 minutes or more. The specific temperature and time of heating will vary depending on the heating device and type of organic polymer, but incomplete thermal decomposition products (hereinafter referred to as
As a result, the atomic composition ratio of carbon and hydrogen (hereinafter referred to as C/H ratio) of the PC material) is 1.1 or more and 20 or less,
It may be determined by experiment to preferably fall within the range of 1.1 or more and 2 or less, more preferably 1.1 or more and 1.5 or less. The C/H ratio can be measured by measuring the content of C and H using an ordinary elemental analyzer for organic compounds and calculating the ratio. Note that the inert environment herein means an inert atmosphere such as nitrogen or argon, or reduced pressure air. When the C/H ratio of the pyrolysis product is less than 1.1,
Although it is easily soluble in organic solvents, since it contains many hydrogen atoms, hydrogen gas is generated during carbonization, which causes bubbles to form in the glassy carbon coating, causing cracks and pinholes. When the C/H ratio of the thermal decomposition product exceeds 20, the thermal decomposition product becomes insoluble in the organic solvent and cannot be coated on the surface of the carbon material. An organic solvent is added to and dissolved in the pitch-like substance thus obtained to prepare a solution having a concentration of 10 to 300 g/g/, which is applied to the surface of the carbon material. The organic solvent is preferably an aliphatic chlorine solvent such as trichloroethylene or 1,1,1-trichloroethane, or an aromatic solvent such as benzene or toluene. Application methods include ultrasonic impregnation, brushing, spraying, and dipping. After application, it is preferable to dry at a relatively low temperature (50 to 100°C). After coating, the PC material is vitrified by heating at 800 to 1300°C for 30 minutes or more in an inert environment to obtain a glassy carbon-coated carbon material. Note that the inert environment is as described above. Next, the carbon material preferably has a bulk density of 1.6 to 2.0 g/
cm 3 of graphite. Carbon materials with lower bulk densities have too low strength, poor durability, and large open porosity, making it difficult for coating solvents to penetrate the surface and easily causing pinholes, whereas carbon materials with higher bulk densities Since carbonaceous materials have few pores on their surfaces and are too smooth, a coating film formed from a solution of a thermal decomposition product of an organic polymer easily peels off. (Example) Examples 1 to 4 Vinyl chloride resin (SS-110 manufactured by Denki Kagaku Kogyo Co., Ltd.)
100 g was placed in a tube furnace and heated for 90 minutes under an argon gas atmosphere at the temperature shown in the table. The C/H ratio of the produced PC material was measured using a CHN coder. Grind the PC material in a mortar and add benzene to dissolve it at the concentration shown in the table. This solution is made isotropic and a carbon material (30 mm x 50 mm x 10 mm) with a bulk density of 1.75 g/cm 3 is prepared.
It was applied by dipping method. Next, it was carbonized by heating at 1200° C. for 1 hour in an argon gas atmosphere. After repeating coating and heating several times, the film thickness became 15μm.
A glassy coated carbon material was produced. Five sheets of carbon material were prepared for each manufacturing condition, and solution application and carbonization were repeatedly performed on each sheet. The obtained product was evaluated by observing the number of pinholes using a microscope and measuring the amount of gas permeation (manufactured by LYSSY).
(using GPM-200 type equipment). The number of pinholes was observed for all five test pieces, and the amount of gas permeation was measured for only one of the five test pieces. The measured value of the amount of gas permeation indicates the degree of denseness of the coating, and the smaller the value, the denser it is considered to be. The results of evaluating the manufactured carbon materials are summarized in the table. Examples 5 to 8 Same as Examples 1 to 4 except that vinyl acetate resin (Denki Kagaku Kogyo Co., Ltd. SH-10) and alkylphenol resin (Nippon Kasei Kogyo Co., Ltd. 2306N) were used instead of vinyl chloride resin. A glassy coated carbon material was produced in the same manner. The manufacturing conditions and the results of evaluating the manufactured carbon materials are shown in the table. Comparative Examples 1 to 8 PC substances with a C/H ratio of less than 1.1, or 20
The procedures were carried out in accordance with Examples 1 to 8, except that a material exceeding 20% was used. The manufacturing conditions and the results of evaluating the manufactured carbon materials are shown in the table.
【表】【table】
【表】
(発明の効果)
この発明により得られるガラス状被覆炭素材
は、ピンホールがほとんど皆無であり、またヘリ
ウムガスを用いた気体透過量が1×10-10c.c./
cm2・sec以下と優れた気体不浸透性を示す。[Table] (Effects of the invention) The glass-like coated carbon material obtained by this invention has almost no pinholes, and the gas permeation rate using helium gas is 1×10 -10 cc/
Shows excellent gas impermeability of less than cm 2 sec.
Claims (1)
に溶解して、炭素材表面に塗布・乾燥し、不活性
環境中で加熱することにより該炭素材表面にガラ
ス状炭素を被覆させる際に、前記不完全熱分解生
成物として、その炭素と水素の原子組成比C/H
が1.1以上20以下であるものを用いることを特徴
とするガラス状炭素被覆炭素材の製造法。1. When an incomplete thermal decomposition product of an organic polymer is dissolved in an organic solvent, applied to the surface of a carbon material, dried, and heated in an inert environment, the surface of the carbon material is coated with glassy carbon. , as the incomplete thermal decomposition product, the atomic composition ratio of carbon and hydrogen C/H
A method for producing a glassy carbon-coated carbon material, characterized in that a carbon material coated with glassy carbon is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61206464A JPS6364965A (en) | 1986-09-02 | 1986-09-02 | Manufacture of glass-like carbon-coated carbon material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61206464A JPS6364965A (en) | 1986-09-02 | 1986-09-02 | Manufacture of glass-like carbon-coated carbon material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6364965A JPS6364965A (en) | 1988-03-23 |
| JPH0223510B2 true JPH0223510B2 (en) | 1990-05-24 |
Family
ID=16523811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61206464A Granted JPS6364965A (en) | 1986-09-02 | 1986-09-02 | Manufacture of glass-like carbon-coated carbon material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6364965A (en) |
-
1986
- 1986-09-02 JP JP61206464A patent/JPS6364965A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6364965A (en) | 1988-03-23 |
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