JPH02235361A - Hermetic seal cover and its manufacturing method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a low-cost, highly reliable hermetic seal cover and a method for manufacturing the same.

[Conventional technology]

Ceramic packages are a type of pancaging for semiconductor devices. This type of passocage uses a laminated wood board with wiring formed inside, and the top of the element mounting area is covered with a metal cover (usually made of Kovar). This kind of cover is called a hermetic seal cover. This hermetic seal cover has various structures, the simplest one is just a Kovar plate punched and molded to the required dimensions, and the most complex one is nickel-plated and gold-plated, and has a ring. A typical example is one made by laminating wax metal (seal rings) molded into shapes.

A sealing force bar 1 shown in an enlarged cross-sectional view in FIG. 4 is a type of such a hermetic seal cover, and a metal cover body 2 is coated with an alloy brazing material 3 whose main components are lead, tin, indium, etc. has been done. This cover 1 is made by laminating a tape 5 made of an alloy brazing material whose main components are lead, tin, indium, etc. on one main surface of a metal strip 4, as shown in FIG. It is obtained by performing press punching using an upper die 6 and a lower die 7. Cover 1 like this
is relatively easy to manufacture, and since it holds the brazing filler metal 3, the metal cover body 2 can be bonded to the ceramic substrate simply by placing it on the required location on the ceramic substrate and heating the whole. , low-cost buncaging is possible.

[Problem to be solved by the invention]

However, in a package using the sealing force bar 1 of this conventional structure, as shown in FIG. It becomes a raised shape. Such a bonding situation not only gives rise to doubts about the bonding between the cover body 2 and the ceramic substrate 8, but also concerns the actual reliability because the groove between the peak of the filler metal 3 and the cover body 2 causes airtightness. It may break.

An object of the present invention is to eliminate the drawbacks of the seal force bar of the conventional structure and provide a hermetic seal cover with high reliability.

(Means for Solving the Problems) In order to achieve the above object, the hermetic seal cover of the present invention has the same alloy brazing material applied to the side surface of the metal cover as that applied to one main surface. It is characterized by the fact that This hermetic seal cover manufacturing method involves pressing a laminated material of a metal strip and a brazing material tape with the brazing material layer facing downward, and pressing the die so that the sides of the punched hermetic seal cover are covered with the brazing material. The feature is that the clearance between the mold and the lower mold is reduced.

FIG. 1 is an enlarged sectional view of a hermetic seal cover 11 of the present invention, in which a metal cover body 12 is coated with an alloy brazing filler metal 13 mainly composed of lead, tin, indium, etc., as in FIG. 4. The difference from FIG. 4 is that the side surfaces of the cover body 12 are covered with the same brazing material. This sealing force bar 11 can basically be manufactured by the conventional press punching method, but as shown in FIG. Subjecting to press and upper mold 16 and lower mold 17
It can be manufactured by reducing the clearance between the

[For production]

As shown in FIG. 3, a package using the sealing force bar 11 of the present invention is covered with a brazing material l3 up to the side surface of the cover body l2, thereby improving reliability both in appearance and in practice. The clearance between the upper and lower dies affects punching accuracy, punching force, die life, etc., and is determined empirically depending on the type and thickness of the material. The sides of normal punched products have a sheared surface and a fractured surface. The conventional product shown in FIG.
The area near the top of the filler metal 3 becomes a fractured surface and is easily oxidized.
It will probably become impossible to get wet. On the other hand, if the clearance is made small as in the present invention, the edges of the punched product will sag, deteriorating the shape accuracy and shortening the mold life.
As shown in the figure, the blurring of the edge of the brazing material layer l3 supplies the brazing material 13 to the side surface, and even if there is a break in the cover body l2 at the end of the punching process, the broken surface is covered with the brazing material l3. become. [Effects of the Invention] According to the sealing force bar of the present invention, sufficient hermetic sealing can be performed both in appearance and in substance, and the reliability of the semiconductor package can be improved.

[Brief explanation of the drawing]

Fig. 1 is an enlarged sectional view of the hermetic seal cover of the present invention, Fig. 2 is a conceptual diagram of press punching to obtain this seal cover, and Fig. 3 is a seal of a semiconductor device package using the hermetic seal cover of the present invention. FIG. Fig. 4 is an enlarged sectional view of a conventional hermetic seal cover, Fig. 5 is a conceptual diagram of press punching to obtain this seal cover, and Fig. 6 is a seal portion of a semiconductor device package using a conventional hermetic seal cover. FIG. 1...Hermetical seal cover of the present invention, 12...Cover body, 3...Alloy brazing material.

Claims (2)

[Claims] (1) In a hermetic seal cover in which an alloy brazing filler metal mainly composed of lead, tin, indium, etc. is adhered to the entire surface of one main surface of the metal cover for a hermetic seal, the same alloy as above is applied to the side surface of the cover. A hermetic seal cover that is coated with brazing filler metal. (2) A hermetic seal cover is formed by applying an alloy brazing material containing lead, tin, indium, etc. as the main ingredients to one main surface of the metal plate that will serve as the cover material for the hermetic seal, laminating it and then punching it out using a press. In this method, the laminated material is pressed with the brazing material layer facing downward, and the clearance between the upper and lower molds is made small so that the sides of the punched hermetic seal cover are covered with the brazing material. A method for manufacturing a hermetic seal cover, characterized by: