JPH02242538A - Structure of circuit block - Google Patents

Structure of circuit block

Info

Publication number
JPH02242538A
JPH02242538A JP6314489A JP6314489A JPH02242538A JP H02242538 A JPH02242538 A JP H02242538A JP 6314489 A JP6314489 A JP 6314489A JP 6314489 A JP6314489 A JP 6314489A JP H02242538 A JPH02242538 A JP H02242538A
Authority
JP
Japan
Prior art keywords
piece
holding
molded substrate
circuit block
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6314489A
Other languages
Japanese (ja)
Inventor
Yoshiro Koga
古賀 義朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP6314489A priority Critical patent/JPH02242538A/en
Publication of JPH02242538A publication Critical patent/JPH02242538A/en
Pending legal-status Critical Current

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  • Switch Cases, Indication, And Locking (AREA)

Abstract

PURPOSE:To make soldering process unnecessary and lower the production cost by carrying out bending process of a supporting spring just before assembly of a circuit device depending on an open part formed in a substrate. CONSTITUTION:A device installation part 30 is so formed integrally in a molded substrate 21 as to correspond to the central part of a pair of holding springs 2 3 and open parts 31 are formed in a molded substrate 28 in the both outside ends of the device installation part 30 and opened along with each holding piece 23b. Owing to the open parts 31, supporting springs 23 can be bending- processed just before assembly of a circuit device so that qualities of the holding pieces 23b and supporting pieces 23a are stabilized and moreover holding and connecting the circuit device are carried out by the holding springs 23 and holding pieces 23b so that soldering process becomes unnecessary. As a result, installations for soldering is also unnecessary and production cost can be lowered.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明はオフ時にネオン管のような表示素子を点灯させ
て暗闇でスイッチの場所を表示するスイッチに内蔵させ
る回路ブロックの構造に関するものである。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to the structure of a circuit block built into a switch that lights up a display element such as a neon tube when it is off to indicate the location of the switch in the dark. .

[従来の技術] 第9図は所謂はたる型スイッチの断面図を示しており、
このスイッチは器体1の底部に配置された導電金具2の
支持突起3にて可動接触体4を揺動自在に支持させ操作
ハンドル5の中央リフ5a部分に設けた六6に上半分を
挿着したコイルスプリング7の下半分を可動接触体4に
嵌着し、操作ハンドル5の反転動作に応してコイルスプ
リング7を屈曲反転させ可動接触体4を支持突起3を中
心として左、右に回動させるようになっており、この左
、右の回動によって可動接触体4の上部側面に設けであ
る可動接点8は固定端子板9に設けである固定接点10
に対して接触、開離してオン、オフ動作するのである。
[Prior Art] FIG. 9 shows a cross-sectional view of a so-called barrel switch.
In this switch, a movable contact body 4 is swingably supported by a support protrusion 3 of a conductive metal fitting 2 placed at the bottom of the device body 1, and the upper half is inserted into a 66 provided at a central ridge 5a of an operation handle 5. The lower half of the attached coil spring 7 is fitted onto the movable contact body 4, and the coil spring 7 is bent and reversed in response to the reversing operation of the operating handle 5, and the movable contact body 4 is moved left and right around the support protrusion 3. The movable contact 8 provided on the upper side surface of the movable contact body 4 changes to the fixed contact 10 provided on the fixed terminal plate 9 by this rotation to the left or right.
It operates on and off by contacting and separating from the surface.

連結端子用鎖錠金911又は12は固定端子板9又は前
記導電金具2の端子板部2aとて速結端子13又は14
を構成する。
The connecting terminal lock 911 or 12 is connected to the fixed terminal plate 9 or the terminal plate portion 2a of the conductive metal fitting 2 to connect the quick connection terminal 13 or 14.
Configure.

而して図において可動接点8と固定接点10とが接触し
た状態で両連結端子L3.14間が通電され、スイッチ
としてオン状態となっているわけである。
In the figure, when the movable contact 8 and the fixed contact 10 are in contact with each other, the connection terminals L3 and 14 are energized, and the switch is turned on.

ところてこの種のスイッチはスイッチのオフ時にスイッ
チの位置を表示するためのネオン管のような表示素子]
5を設けて、透光材からなる操作ハンドル5のランプカ
バーを介して照光させるようになっているわけであるが
、従来のスイッチに内蔵する表示回路ブロックは第10
図<a)(b)に示すようにプリント基板16に表示素
子15と限流用抵抗素子17とを半田付けによって直列
に取り付は配線して予めブロック化し、このブロック化
した部材を、プリント基板16に設けている孔18に操
作ハンドル5の中央リブ5aを挿着することによって操
作ハンドル5に取付けている。
However, this type of switch has a display element like a neon tube to display the switch position when the switch is turned off]
5 is provided, and the light is illuminated through the lamp cover of the operation handle 5 made of a transparent material. However, the display circuit block built into the conventional switch is the 10th one.
As shown in Figures <a> and (b), the display element 15 and the current-limiting resistor element 17 are connected in series to the printed circuit board 16 by soldering and wired in advance to form a block. It is attached to the operating handle 5 by inserting the central rib 5a of the operating handle 5 into the hole 18 provided in the opening 16.

そして抵抗素子17の一方のリード線20の一端を前記
コイルスプリング7の上端に電気的に接続し、表示素子
15の一端に接続された接点部1つをプリント基板L6
の端部下面に設け、操作ハンドル5をオフ側に投入する
と、接点部1つが固定端子板9の上面に接触し、連結端
子14、導電金具2、可動接触体4、コイルスプリング
7、抵抗素子17、表示素子15、固定端子板9、連結
端子13の通電回路が形成され、表示素子15が発光点
灯するようになっている。
Then, one end of one lead wire 20 of the resistance element 17 is electrically connected to the upper end of the coil spring 7, and one contact portion connected to one end of the display element 15 is connected to the printed circuit board L6.
When the operation handle 5 is turned to the OFF side, one contact portion contacts the upper surface of the fixed terminal plate 9, and the connection terminal 14, the conductive metal fitting 2, the movable contact body 4, the coil spring 7, and the resistance element 17, an energizing circuit is formed for the display element 15, the fixed terminal plate 9, and the connecting terminal 13, so that the display element 15 emits light.

このようなスイッチは表示回路ブロックを組み込むこと
によって暗闇のスイッチの存在場所が表示できて使用者
に大変便利なものであるが、従来の表示回路ブロックは
上述のようにプリン1へ基板]6上て抵抗素子17と表
示素子15とを直列に半田向けにより接続して、しかも
各部品はとりわげ抵抗素子17はプリント基板16上で
直立させる構造であったなめ、安定性がなく、操作ハン
ドル5のオン、オフ操作によって振動か伝わり断線する
という問題があり、また組み立てが大変面倒であった。
This type of switch is very convenient for the user because it can display the location of the switch in the dark by incorporating a display circuit block, but the conventional display circuit block is not connected to the board 1 as described above. The resistance element 17 and the display element 15 were connected in series by soldering, and each component was constructed so that the resistance element 17 stood upright on the printed circuit board 16. There was a problem in that vibrations were transmitted and the wires broke when the switch was turned on and off, and assembly was very troublesome.

そこで電路を埋め込んだ第11図に示すような成形基板
2]を用い、この成形基板21の成形時に抵抗素子]7
を成形保持体26で成形基板21に保持し、この保持し
た抵抗素子17のリード線20′を成形基板21に突設
した端子22に半田イ4けして内部電路に接続する構造
のものが提案されている。第12図は第11図の表示回
路ブロックを組み込んなスイッチの断面を示している。
Therefore, a molded substrate 2] as shown in FIG.
is held on a molded substrate 21 by a molded holder 26, and the lead wire 20' of the held resistance element 17 is soldered to a terminal 22 protruding from the molded substrate 21 to connect it to the internal electrical circuit. has been done. FIG. 12 shows a cross section of a switch incorporating the display circuit block of FIG. 11.

[発明が解決しようとする課題] しかしなから第11図の構造ては抵抗素子17のリード
線20°を半田付けする工程を必要とし、そのため半田
付り工程の設備が必要となり、その分生産コスI・か高
くなるという問題があった。
[Problems to be Solved by the Invention] However, the structure shown in FIG. 11 requires a process of soldering the 20° lead wire of the resistor element 17, which requires equipment for the soldering process, which reduces production accordingly. There was a problem that the cost was high.

本発明は上述の問題点に鑑みて為されたもので、その目
的とするところは組み立て性と品質の向上とか図れ、し
かも設備の削減等によって生産コスl〜の低減が図れる
回路ブロックを提供するにある。
The present invention has been made in view of the above-mentioned problems, and its purpose is to provide a circuit block that can improve assembly ease and quality, and also reduce production costs by reducing equipment. It is in.

[課題を解決するための手段] 本発明はフープ状金属板を打ち抜いて電路を形成すると
ともにこの形成された電路をインサート成形により埋設
した合成樹脂製の成形基板を形成して該成形基板に抵抗
素子等の回路素子を配設した回路ブロックにおいて、成
形基板に形成される上面と両端部とか開口した素子配置
部の両端外方及び少なくとも片側外方の成形基板に上下
貫通の開口部を設け、素子配置部の少なくとも片側外方
の成形基板に設けた開口部の開口部内周面より一端が突
出して延長先端を素子配置部の下方に延長した支持片と
、その支持片先端から更に素子配置部の両端を結ぶ延長
線上で素子配置部とは反対方向に延長し、素子配置部の
端部外方に設けた開口部下方に臨ませた保持片とからな
る保持ばねを一対、素子配置部の両端部に設けるともに
各保持片を素子配置部の両端部側で夫々垂立させ、素子
配置部に回路素子を組み込んだ該回路素子両端の電極に
保持片を弾接させて回路素子を保持するとともに電気的
に接続したものである。
[Means for Solving the Problems] The present invention punches out a hoop-shaped metal plate to form an electric path, forms a synthetic resin molded substrate in which the formed electric path is embedded by insert molding, and adds resistance to the molded substrate. In a circuit block in which a circuit element such as an element is arranged, an opening that passes through the upper and lower sides of the molded board is provided on the upper surface and both ends of the molded board, and on both ends of the open element placement part and at least on one side of the molded board, A support piece with one end protruding from the inner circumferential surface of the opening provided in the molded substrate on at least one side of the outer side of the element placement part and having an extended tip extending below the element placement part; A pair of retaining springs, each consisting of a retaining piece extending in the opposite direction to the element arranging part on an extension line connecting both ends of the element arranging part and facing below an opening provided outside the end of the element arranging part, are attached to the element arranging part. Each holding piece is provided at both ends, and each holding piece is made to stand vertically at both ends of the element placement portion, and the holding piece is brought into elastic contact with the electrodes at both ends of the circuit element that is incorporated in the element placement portion to hold the circuit element. It is electrically connected to the

更に詳しくは請求項2記載の発明では保持ばねをE形状
に形成して中足片を保持片とするとともに両側足片と、
両側足片及び中足片を連結する連結片とで支持片とし、
支持片の両側足片に対応するように素子配置部の両側外
方の成形基板に開口部を設けている。
More specifically, in the invention as claimed in claim 2, the retaining spring is formed in an E shape so that the middle leg piece is used as the retaining piece, and both side leg pieces are formed.
A supporting piece is made up of a connecting piece that connects both side foot pieces and a middle foot piece,
Openings are provided in the molded substrate on both sides of the element placement section so as to correspond to the legs on both sides of the support piece.

また請求項3記載の発明では保持ばねをU形状に形成し
てそのL部を支持片とするとともにこのL部先端に一体
連結された片を保持片とし、■、部の支持片に対応する
ように素子配置部の片側外方の成形基板に開口部を設け
ている。
In addition, in the invention as claimed in claim 3, the holding spring is formed into a U shape, and the L part thereof is used as a support piece, and the piece integrally connected to the tip of this L part is used as a holding piece, which corresponds to the support piece in the section (■). An opening is provided in the molded substrate on one side outside the element placement section.

請求項4記載の発明では支持片と保持片とを直角に連設
して保持ばねをし形状に形成し、支持片に対応するよう
に素子配置部の片側外方の成形基板に開口部を設けてい
る。
In the invention as set forth in claim 4, the support piece and the holding piece are arranged in series at right angles to form a holding spring, and an opening is formed in the molded substrate on one side outside of the element arrangement portion so as to correspond to the supporting piece. It is set up.

請求項5記載の発明ては保持ばねをT形状に形成して横
片を支持片とするとともに縦片を保持片とし、支持片の
両端部に対応するように素子配置部の片側外方の成形基
板に開口部を設けている。
In the invention as claimed in claim 5, the holding spring is formed in a T-shape, the horizontal piece is used as a supporting piece, the vertical piece is used as a holding piece, and one side of the outer side of the element arrangement part is formed so as to correspond to both ends of the supporting piece. An opening is provided in the molded substrate.

[作用] 而して本発明回路ブロックの構造によれば成形基板に設
けた開口部の存在によって回路素子の組み込み直前で保
持ばねの折曲加工を行うことができ、従って保持片、支
持片の曲げ部位の品質か安定し、しかも回路素子の保持
と、出来的接続とを保持ばねの保持片で行うため、半田
付は工程が必要なくなり、そのため半田付けのための設
備も不要で生産コストの低減が図れる。更に支持片の基
端から保持片に至るまでの長さを限られたスペースの中
で長くすることができ、結果保持ばねのたわみ量を大き
くすることができて優れた保持はねのばね特性と加工性
が得られ、素子の保持に対する高い信頼性が得られる。
[Function] According to the structure of the circuit block of the present invention, the holding spring can be bent immediately before the circuit element is assembled due to the presence of the opening provided in the molded substrate, and therefore the holding piece and the supporting piece can be bent. The quality of the bent part is stable, and since the retaining piece of the retaining spring holds the circuit element and makes the finished connection, no soldering process is required, and therefore no soldering equipment is required, reducing production costs. This can be reduced. Furthermore, the length from the base end of the support piece to the holding piece can be increased within a limited space, and as a result, the amount of deflection of the holding spring can be increased, resulting in excellent spring characteristics of the holding spring. This provides high workability and high reliability in holding the element.

[実施例] 以下本発明を実施例図により説明する。[Example] The present invention will be explained below with reference to the drawings.

第1図(a)〜(c)は長尺金属板28の電路形成工程
を示しており、フープ状に巻き取られた0、2mrn厚
の長尺金属板28を第1図<1))に示すように第1図
(b)、(c)の打ち抜き機Uで電路部分や、抵抗素子
17の保持ばね23や、表示素子15のリード線24を
かしめ固定する端子25a、’251)等を打ち抜き形
成するようになっている。
FIGS. 1(a) to (c) show the process of forming electric circuits on the long metal plate 28. As shown in FIG. 1, the punching machine U shown in FIGS. 1(b) and 1(c) is used to cut the electrical circuit portion, the holding spring 23 of the resistive element 17, the terminal 25a for fixing the lead wire 24 of the display element 15 by caulking, etc. It is designed to be formed by punching.

第2図は金属板28を打ち抜き加工した部位の拡大上面
図を示しており、−表示回路ブロックに対応する部分の
中央には孔18に対応する丸孔18aが開口され、この
丸孔]、 8 aの両側には夫々抵抗素子17を保持す
るための一対の保持ばね23の概略形を打ち抜き加工し
、また表示素子15のリード線24をかしめ固定するた
めの端子25a、25bの概略形25を打ち抜き加工し
ている。
FIG. 2 shows an enlarged top view of a punched part of the metal plate 28, in which a round hole 18a corresponding to the hole 18 is opened in the center of the part corresponding to the display circuit block; On both sides of 8a, there are punched outline shapes of a pair of holding springs 23 for holding the resistance element 17, and outline shapes 25 of terminals 25a and 25b for caulking and fixing the lead wires 24 of the display element 15. is punched out.

ここで各保持ばね23はE状形に形成され、両側足片と
両側足片を連結する連結片とて支持片23aを、中央足
片で保持片23bを夫々構成しており、支持片23aの
両端は金属板28の電路片りに一体に連結され、保持片
231〕の先端は金属板28より切り離されていない状
態にある。また端子25a、25bは分断形成されない
概略形状25の状態で加工形成されている。一対の保持
はね23は支持片23aをの一部を構成する連結片が背
中合わせとなるようにして線対称に形成され、各保持片
23bを同一直線上に配置してその先端を逆方向に向け
ている。
Here, each holding spring 23 is formed in an E-shape, and the connecting piece that connects both side legs to each other constitutes a supporting piece 23a, and the central leg constitutes a holding piece 23b, and the supporting piece 23a Both ends of the holding piece 231 are integrally connected to the electric circuit pieces of the metal plate 28, and the tip of the holding piece 231 is not separated from the metal plate 28. Further, the terminals 25a and 25b are processed and formed into a general shape 25 without being separated. The pair of retaining springs 23 are formed line-symmetrically so that the connecting pieces constituting a part of the supporting piece 23a are placed back to back, and each retaining piece 23b is arranged on the same straight line, with the tips thereof facing in opposite directions. I'm aiming.

次に第3図(a)〜(c)は上述のように電路片りや、
保持ばね23、端子25a、25bを形成した後に巻き
取られたフープ状の金属板28の各電路片部分を成形基
板21て被覆するように成形機Vでインサート成形する
工程を示している。
Next, FIGS. 3(a) to (c) show broken electrical circuits and
This figure shows a step of insert molding using a molding machine V so that each electric circuit piece portion of the hoop-shaped metal plate 28 wound up after forming the holding spring 23 and the terminals 25a and 25b is covered with a molded substrate 21.

第4図(a)〜(c)はインサート成形後の表示回路ブ
ロックの半分を示しており、上述の一対の保持ばね23
の中央部に対応するように素子配置部30を成形基板2
1に一体に形成してあり、この素子配置部30の両側外
方の成形基板28には開口部31を夫々設け、また上記
各保持片23bに沿うように開口しである。ここで素子
配置部30は両端部と上面開口が開口しており、底部下
方には保持片23bの基部が配置され、上記開口部3]
には夫々支持片23aの端部が配置されるとともに開口
部31の内周面より支持片23aの端部が成形器体21
内にインサートされている。
FIGS. 4(a) to 4(c) show half of the display circuit block after insert molding, in which the pair of retaining springs 23 described above are shown.
The element placement portion 30 is placed on the molded substrate 2 so as to correspond to the center portion of the molded substrate 2.
1, and openings 31 are provided in the molded substrate 28 on both sides of the element placement portion 30, and openings are provided along the respective holding pieces 23b. Here, the element placement section 30 has both ends and a top opening open, and the base of the holding piece 23b is arranged below the bottom, and the opening 3]
The end portions of the support pieces 23a are arranged at the inner circumferential surface of the opening 31, and the ends of the support pieces 23a are placed closer to the molding device body 21.
inserted inside.

次に抵抗素子17及び表示素子15を組み込む直前の過
程で、第5図(a)<1))に示すように保持ばね23
の不要連結箇所の分離と折り曲げ加工を行うとともに、
端子25a、25bの不要連結箇所の分離と折り曲げ加
工を行う。ここで支持片23aの折曲加工を行う際には
開口部31を利用してパンチダイを開口部31の上下開
口面より入れ、支持片23a両端近傍を下向けに折り曲
げて支持片23aを立てる。この支持片23aの折り曲
げによって保持片23bも垂立することになる。この垂
立した相対向する保持片23bを更に屈曲凸部が相対向
するようにしてく字状に折曲加工するのである。
Next, in the process immediately before assembling the resistance element 17 and the display element 15, as shown in FIG.
In addition to separating and bending unnecessary connection points,
The unnecessary connection parts of the terminals 25a and 25b are separated and bent. When bending the supporting piece 23a, a punch die is inserted into the upper and lower opening surfaces of the opening 31 using the opening 31, and the vicinity of both ends of the supporting piece 23a are bent downward to stand the supporting piece 23a. By bending the support piece 23a, the holding piece 23b also stands vertically. The vertical holding pieces 23b facing each other are further bent into a dogleg shape so that the bent convex portions face each other.

一方端子25a、25bは並行形成されるとともに夫々
の基部を上方に折り曲げて斜め上方に向け、またその先
端両側縁にはかしめ片が一体形成される。
On the other hand, the terminals 25a and 25b are formed parallel to each other, and their respective bases are bent upward to face obliquely upward, and caulking pieces are integrally formed on both side edges of their tips.

しかしてこのようにした折曲加二「後に抵抗素子17及
び表示素子15を組み込むのである。 第6図< a、
 >は円柱状て両端に電極17aを設けた抵抗素子17
を素子配置部30に納装した状態を示しており、抵抗素
子17は素子配置部30の両側に立設した立壁30a間
に納装するのであるか、この場合抵抗素子17を保持片
231つ間にばね力に抗して圧入して保持片23 bの
ばね力で保持片23bに電極17aを弾接させ、抵抗素
子17を電気的に接続するとともに機械的に保持するの
である。ここで保持ばね23は支持片23aの基端より
保持片23までの長さを長くすることができるため、限
られたスペースにおいて保持ばね23のたわみ量に余裕
を持なぜることかでき、結果優れたばね特性、加工性を
得ることができるのである。
However, the resistive element 17 and the display element 15 are later incorporated into the folded joint made in this way.
> is a resistive element 17 having a cylindrical shape and having electrodes 17a at both ends.
The resistor element 17 is shown mounted in the element arrangement section 30, and the resistance element 17 is mounted between the vertical walls 30a erected on both sides of the element arrangement section 30. The electrode 17a is press-fitted against the spring force between the electrodes 17b and 23b, and the electrode 17a is brought into elastic contact with the holding piece 23b by the spring force of the holding piece 23b, thereby electrically connecting the resistor element 17 and mechanically holding it. Here, since the length of the holding spring 23 from the base end of the supporting piece 23a to the holding piece 23 can be made longer, the amount of deflection of the holding spring 23 can be increased in a limited space. Excellent spring properties and workability can be obtained.

表示素子15はリード線24が端子22a、25bのか
しめ片によってかしめ固定されるとともにリード線24
が折り曲げられて素子配置部30の立壁30a上に第6
図(b)に示すように載承される。
In the display element 15, the lead wires 24 are caulked and fixed by the caulking pieces of the terminals 22a and 25b, and the lead wires 24
is bent and placed on the vertical wall 30a of the element placement section 30.
It is mounted as shown in Figure (b).

第7図は抵抗素子17を組み込んな状態の斜視図を示し
ている。
FIG. 7 shows a perspective view of a state in which the resistive element 17 is not incorporated.

このようにして成形基板28を成形し、抵抗素子17、
表示素子]5を保持固定したフープ状金属板2]を順次
送り出して、各表示回路ブロックをフープ状金属板28
より分断する。
In this way, the molded substrate 28 is molded, and the resistance element 17,
The hoop-shaped metal plate 2 holding and fixing the display element] 5 is sent out in sequence, and each display circuit block is attached to the hoop-shaped metal plate 28.
More divided.

この分断と同時に実際においては操作ハンドル5への表
示回路ブロックの組み込みか行われるのである。
At the same time as this separation, the display circuit block is actually assembled into the operating handle 5.

つまり表示回路ブロックはフープ材の状態から操作ハン
ドル5への組み込みまでの一貫した連続組み立て工程に
よって完成され且つ組み込まれるのである。
In other words, the display circuit block is completed and assembled through a consistent and continuous assembly process from the state of the hoop material to its assembly into the operating handle 5.

尚上記実施例の保持ばね18はE状に形成したものであ
るが、第8図(a)〜(C)に示すようにU状に、ある
いはL状に、更にはT状であっても良く、第8図(a)
(b)のように支持片23aか片持の場合には素子配置
部の片側外方の成形基板1に折曲加工時に使用する開口
部31を設ければよい。
Although the retaining spring 18 in the above embodiment is formed in an E shape, it may also be formed in a U shape, an L shape, or even a T shape as shown in FIGS. 8(a) to (C). Good, Figure 8(a)
In the case where the support piece 23a is cantilevered as shown in FIG. 3B, an opening 31 for use in bending may be provided in the molded substrate 1 on one side outside the element placement portion.

[発明の効果] 本発明は上述のように、フープ状金属板を打ち抜いて電
路を形成するとともにこの形成された電路をインザート
成形により埋設した合成樹脂製の成形基板を形成して該
成形基板に抵抗素子等の回路素子を配設した回路ブロッ
クにおいて、成形基板に形成される上面と両端部とか開
口した素子配置部の両端外方及び少なくとも片側外方の
成形基板に上下貫通の開口部を設け、素子配置部の少な
くとも片側外方の成形基板に設けた開口部の開口部内周
面より一端が突出して延長先端を素子配置部の下方に延
長した支持片と、その支持片先端かへ更に素子配置部の
両端を結ぶ延長線」二で素子配置部とは反対方向に延長
し、素子配置部の端部外方に設けた開口部下方に臨ませ
た保持片とからなる保持ばねを一対、素子配置部の両端
部に設けるともに各保持片を素子配置部の両端部側で夫
々垂立させ、素子配置部に回路素子を紹み込んだ該回路
素子両端の電極に保持片を弾接させて回路素子を保持す
るとともに電気的に接続したので、成形基板に設けた開
口部の存在によって回路素子の組み込み直前て保持ばね
の折曲加工を行うことができ、従って保持片、支持片の
曲げ部位の品質が安定し、しかも回路素子の保持と、接
続とを保持ばねの保持片て行うため、半田付は工程か必
要なくなり、そのため半田付けのための設備も不要で生
産コストの低減が図れ、特に支持片の基端かあ保持片ま
ての長さを長く取ることができ、結果保持ばねのたわみ
量に余裕ができて優れた保持ばねのばね特性と、加工性
を得ることができ、また素子の保持に対する高い信頼性
も得られるという効果がある。
[Effects of the Invention] As described above, the present invention punches out a hoop-shaped metal plate to form an electric path, forms a synthetic resin molded substrate in which the formed electric path is embedded by insert molding, and inserts the formed electric path into the molded substrate. In a circuit block in which circuit elements such as resistive elements are arranged, an opening that passes through the upper and lower sides of the molded board is provided on the upper surface and both ends of the molded board, and on both ends of the open element arrangement part and at least on one side of the molded board. , a support piece having one end protruding from the inner circumferential surface of the opening provided in the molded substrate on at least one side of the outer side of the element placement part and having an extended tip extending below the element placement part; A pair of retaining springs each consisting of a retaining piece extending in the opposite direction to the element arranging part at an extension line connecting both ends of the arranging part and facing below an opening provided outside the end of the element arranging part; Each holding piece is provided at both ends of the element arrangement part, and each holding piece is made to stand vertically at both ends of the element arrangement part, and the holding pieces are brought into elastic contact with the electrodes at both ends of the circuit element introduced into the element arrangement part. Since the circuit elements are held and electrically connected to each other, the openings provided in the molded substrate make it possible to bend the holding springs immediately before assembling the circuit elements. The quality of the parts is stable, and since the circuit elements are held and connected using the holding pieces of the holding spring, there is no need for soldering in the process.Therefore, no equipment for soldering is required, reducing production costs. In particular, the length between the base end of the support piece and the holding piece can be made longer, and as a result, there is more leeway in the amount of deflection of the holding spring, and excellent spring characteristics and workability can be obtained. Moreover, there is an effect that high reliability in holding the element can be obtained.

【図面の簡単な説明】[Brief explanation of drawings]

第1図(a)〜(C)は本発明の実施例の金属板の打ち
抜き工程の説明図、第2図は同上の金属板の打ち抜き加
工した一部省略した拡大上面図、第3図(a)〜(C)
は同−Lの成形基板の成形加工工程の説明図、第4図(
a)は同上の成形基板の成形加工後の一部省略した拡大
上面図、第4図(b)は同上の成形基板の成形加工後の
一部省略目 した拡大側断面。、第4図(C)は同上の成形基板の成
形加工後の一部省略した拡大横断面図、第5図(a)は
同」二の保持ばね及び端子の折り曲は加工後の一部省略
した拡大上面図、第5図(1))は同上の保持はね及び
端子の折り曲げ加工後の一部省略した拡大側断面図、第
6図(a)は同上の抵抗素子組み込み状態の要部の拡大
側断面図、第6図(b)は同上の表示素子の組み込み状
態の要部の拡大側断面図、第7図は同上の要部の斜視図
、第8図(a)(b)(C)は本発明の別の実施例の保
持ばねの構成説明図、第9図は従来例を使用したスイッ
チの断面図、第10図(a)、(1))は同上の正面図
、側面図、第1−1図は別の従来例の斜視図、第12図
は同上を使用したスイッチの断面図である。 17は抵抗素子、21は成形基板、2Bは保持ばね、2
3aは支持片、23bは保持片、31は開口部である。 代理人 弁理士 石 1)長 七 第6 (G) (b) 第7図 7は抵抗素子 1は成形基板 3は保持はね 3aは支持片 3bは保持片 1は開口部 ■
FIGS. 1(a) to (C) are explanatory diagrams of the punching process of a metal plate according to an embodiment of the present invention, FIG. a) ~ (C)
Figure 4 is an explanatory diagram of the molding process of the molded substrate of same-L.
4(a) is an enlarged top view, partially omitted, of the molded substrate same as above after the molding process, and FIG. , Fig. 4(C) is an enlarged cross-sectional view of the above molded board after the molding process, and Fig. 5(a) is a partially omitted enlarged cross-sectional view of the same molded board after the molding process. The omitted enlarged top view, Fig. 5 (1)) is a partially omitted enlarged side cross-sectional view after bending the retaining spring and terminal, and Fig. 6 (a) shows the elements of the above with the resistor element installed. FIG. 6(b) is an enlarged side sectional view of the main part of the same display element in an assembled state, FIG. 7 is a perspective view of the main part of the same as above, and FIGS. 8(a)(b) )(C) is an explanatory diagram of the configuration of a retaining spring according to another embodiment of the present invention, FIG. 9 is a sectional view of a switch using a conventional example, and FIGS. 10(a) and (1)) are front views of the same as above. , a side view, FIG. 1-1 is a perspective view of another conventional example, and FIG. 12 is a sectional view of a switch using the same. 17 is a resistance element, 21 is a molded substrate, 2B is a holding spring, 2
3a is a support piece, 23b is a holding piece, and 31 is an opening. Agent Patent Attorney Ishi 1) Long 7th 6th (G) (b) Figure 7 In Figure 7, the resistance element 1 is the molded substrate 3, the holding spring 3a is the support piece 3b, the holding piece 1 is the opening ■

Claims (5)

【特許請求の範囲】[Claims] (1)フープ状金属板を打ち抜いて電路を形成するとと
もにこの形成された電路をインサート成形により埋設し
た合成樹脂製の成形基板を形成して該成形基板に抵抗素
子等の回路素子を配設した回路ブロックにおいて、成形
基板に形成される上面と両端部とが開口した素子配置部
の両端外方及び少なくとも片側外方の成形基板に上下貫
通の開口部を設け、素子配置部の少なくとも片側外方の
成形基板に設けた開口部の開口部内周面より一端が突出
して延長先端を素子配置部の下方に延長した支持片と、
その支持片先端から更に素子配置部の両端を結ぶ延長線
上で素子配置部とは反対方向に延長し、素子配置部の端
部外方に設けた開口部下方に臨ませた保持片とからなる
保持ばねを一対、素子配置部の両端部に設けるともに各
保持片を素子配置部の両端部側で夫々垂立させ、素子配
置部に回路素子を組み込んだ該回路素子両端の電極に保
持片を弾接させて回路素子を保持するとともに電気的に
接続して成ることを特徴とする回路ブロックの構造。
(1) A hoop-shaped metal plate is punched out to form an electric path, and the formed electric path is embedded by insert molding to form a synthetic resin molded substrate, and circuit elements such as resistive elements are arranged on the molded substrate. In the circuit block, an opening that passes vertically is provided in the molded substrate at both ends and at least on one side of the element placement section, which is formed in the molded substrate and has an open top surface and both ends. a support piece having one end protruding from the inner circumferential surface of the opening provided in the molded substrate and having an extended tip extending below the element placement portion;
It consists of a holding piece that extends from the tip of the supporting piece in the opposite direction to the element arranging part on an extension line connecting both ends of the element arranging part, and faces below the opening provided outside the end of the element arranging part. A pair of holding springs are provided at both ends of the element placement section, and each holding piece is made to stand vertically at both ends of the element placement section, and the holding pieces are attached to the electrodes at both ends of the circuit element in which the circuit element is incorporated in the element placement section. A structure of a circuit block characterized by holding circuit elements in elastic contact and electrically connecting them.
(2)保持ばねをE形状に形成して中足片を保持片とす
るとともに両側足片と、両側足片及び中足片を連結する
連結片とで支持片とし、支持片の両側足片に対応するよ
うに素子配置部の両側外方の成形基板に開口部を設けて
成ることを特徴とする請求項1記載の回路ブロックの構
造。
(2) The holding spring is formed into an E shape, and the middle leg piece is used as a holding piece, and the leg pieces on both sides and the connecting piece that connects the leg pieces on both sides and the middle leg piece are used as supporting pieces, and the legs on both sides of the supporting piece are 2. The structure of a circuit block according to claim 1, wherein openings are provided in the molded substrate on both sides of the element placement section so as to correspond to the openings.
(3)保持ばねをU形状に形成してそのL部を支持片と
するとともにこのL部先端に一体連結された片を保持片
とし、L部の支持片に対応するように素子配置部の片側
外方の成形基板に開口部を設けて成ることを特徴とする
請求項1記載の回路ブロックの構造。
(3) The holding spring is formed into a U shape, and the L part thereof is used as a support piece, and the piece integrally connected to the tip of this L part is used as a holding piece, and the element placement part is arranged so as to correspond to the support piece of the L part. 2. The structure of a circuit block according to claim 1, wherein an opening is provided in the molded substrate on one outer side.
(4)支持片と保持片とを直角に連設して保持ばねをL
形状に形成し、支持片に対応するように素子配置部の片
側外方の成形基板に開口部を設けて成ることを特徴とす
る請求項1記載の回路ブロックの構造。
(4) The support piece and the holding piece are connected at right angles to hold the holding spring L.
2. The structure of a circuit block according to claim 1, wherein the circuit block is formed into a shape and an opening is provided in the molded substrate on one side outside the element placement portion so as to correspond to the support piece.
(5)保持ばねをT形状に形成して横片を支持片とする
とともに縦片を保持片とし、支持片の両端部に対応する
ように素子配置部の片側外方の成形基板に開口部を設け
て成ることを特徴とする請求項1記載の回路ブロックの
構造。
(5) The holding spring is formed into a T-shape, the horizontal piece is used as a supporting piece, the vertical piece is used as a holding piece, and an opening is formed in the molded substrate on one side outside of the element placement area so as to correspond to both ends of the supporting piece. 2. The circuit block structure according to claim 1, further comprising a circuit block.
JP6314489A 1989-03-15 1989-03-15 Structure of circuit block Pending JPH02242538A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6314489A JPH02242538A (en) 1989-03-15 1989-03-15 Structure of circuit block

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6314489A JPH02242538A (en) 1989-03-15 1989-03-15 Structure of circuit block

Publications (1)

Publication Number Publication Date
JPH02242538A true JPH02242538A (en) 1990-09-26

Family

ID=13220761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6314489A Pending JPH02242538A (en) 1989-03-15 1989-03-15 Structure of circuit block

Country Status (1)

Country Link
JP (1) JPH02242538A (en)

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