JPH02242539A - Device package structure of circuit block - Google Patents

Device package structure of circuit block

Info

Publication number
JPH02242539A
JPH02242539A JP6314589A JP6314589A JPH02242539A JP H02242539 A JPH02242539 A JP H02242539A JP 6314589 A JP6314589 A JP 6314589A JP 6314589 A JP6314589 A JP 6314589A JP H02242539 A JPH02242539 A JP H02242539A
Authority
JP
Japan
Prior art keywords
protrusions
circuit
protrusion
molded substrate
circuit elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6314589A
Other languages
Japanese (ja)
Inventor
Yoshiro Koga
古賀 義朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP6314589A priority Critical patent/JPH02242539A/en
Publication of JPH02242539A publication Critical patent/JPH02242539A/en
Pending legal-status Critical Current

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  • Switch Cases, Indication, And Locking (AREA)

Abstract

PURPOSE:To make it certain to easily assemble and hold circuit element between protrusions even if the diameters of the circuit devices are different by making the distance between protrusions a little larger than the maximum tolerance of widths of the circuit elements and deforming the tip of each protrusion by heat. CONSTITUTION:Protrusions 26 to support and fix a resistance device 17 is formed in molding process of a molded substrate 21 in the opposite side to a hole 18. Also, two protrusions 26 are formed on one side of an installation position of a resistance device 17 to be used and one protrusion 26 is formed on the other side and the distance W in width direction of the resistance element 17 between the protrusions 26 are made a little larger than the maximum tolerance of width D of the resistance element 17 and the tip part of each protrusion 26 gradually tapers off. After formation of the protrusions 26, a resistance element 17 is inserted among the protrusions 26 and the tip parts of the protrusions are deformed by heating and the resistance element 17 is nipped and held by the deformed parts 26a and the molded substrate 21. By this way, even if sizes of the circuit elements vary, without cracking and dropping off of circuit elements at the time of assembly, the circuit elements are certainly held in place.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明はオフ時にネオン管のような表示素子を点灯させ
て暗闇でスイッチの場所を表示するスイッチに内蔵させ
る回路ブロックの素子実装構造に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an element mounting structure of a circuit block built into a switch that lights up a display element such as a neon tube when it is off to display the switch location in the dark. It is.

[従来の技術] 第6図は所謂はたる型スイッチの断面図を示しており、
このスイッチは器体1の底部に配置された導電金具2の
支持突起3にて可動接触体4を揺動自在に支持させ操作
ハンドル5の中央リブ5a部分に設けた穴6に上半分を
挿着したコイルスプリング7の下半分を可動接触体4に
嵌着し、操作ハンドル5の反転動作に応じてコイルスプ
リング7を屈曲反転させ可動接触体4を支持突起3を中
心として左、右に回動させるようになっており、この左
、右の回動によって可動接触体4の上部側面に設けであ
る可動接点8は固定端子板9に設けである固定接点10
に対して接触、開離してオン、オフ動作するのである。
[Prior Art] Fig. 6 shows a cross-sectional view of a so-called barrel switch.
In this switch, a movable contact body 4 is swingably supported by a support protrusion 3 of a conductive metal fitting 2 arranged at the bottom of a device body 1, and the upper half is inserted into a hole 6 provided in a central rib 5a of an operation handle 5. The lower half of the attached coil spring 7 is fitted onto the movable contact body 4, and the coil spring 7 is bent and reversed in response to the reversal operation of the operating handle 5, and the movable contact body 4 is rotated left and right around the support protrusion 3. By this left and right rotation, the movable contact 8 provided on the upper side surface of the movable contact body 4 is moved to the fixed contact 10 provided on the fixed terminal plate 9.
It operates on and off by contacting and separating from the surface.

速結端子用鎖錠金具11又は12は固定端子板9又は前
記導電金具2の端子板部2aとで速結端子13又は14
を構成する。
The fast connection terminal locking fitting 11 or 12 can be connected to the fixed terminal plate 9 or the terminal plate portion 2a of the conductive metal fitting 2 to connect the quick connection terminal 13 or 14.
Configure.

而して図において可動接点8と固定接点10とが接触し
た状態で再連結端子13.14間が通電され、スイッチ
としてオン状態となっているわけである。
In the figure, when the movable contact 8 and the fixed contact 10 are in contact with each other, the reconnection terminals 13 and 14 are energized, and the switch is turned on.

ところでこの種のスイッチはスイッチのオフ時にスイッ
チの位置を表示するだめのネオン管のような表示素子1
5を設けて、透光材からなる操作ハンドル5のランプカ
バーを介して照光させるようになっているわけであるが
、従来のスイッチに内蔵する表示回路ブロックは第7図
(a)<1))に示ずようにプリン1〜基板16に表示
素子15と限流用抵抗素子17とを半田付け(・こよっ
て直列に取り付は配線して予めブロック化し、このブロ
ック化した部材を、プリント基板16に設けである孔1
8に操作ハンドル5の中央リブ5aを挿着することによ
って操作ハンドルらに取イ」けている。
By the way, this type of switch has a display element 1 like a neon tube that displays the switch position when the switch is turned off.
5 is provided, and the light is illuminated through the lamp cover of the operating handle 5 made of a transparent material. However, the display circuit block built into the conventional switch is as shown in Fig. 7(a)<1). ) As shown in FIG. Hole 1 provided in 16
By inserting the central rib 5a of the operating handle 5 into the opening 8, the operating handle 5 can be attached.

そして抵抗素子17の一方のリード線20の一端を前記
コイルスプリンタ7の上端に電気的に接続し、表示素子
]5の一端に接続された接点部]9をプリント基板]6
の端部下面に設け、操作ハンドル5をオフ側に投入する
と、接点部1つが固定端子板9の上面に接触し、連結端
子14、導電金具2、可動接触体4、コイルスプリング
7、抵抗素子17、表示素子15、固定端子板9、連結
端子13の通電回路か形成され、表示素子〕5か発光点
灯するようになっている。
Then, one end of one lead wire 20 of the resistance element 17 is electrically connected to the upper end of the coil splinter 7, and the contact part]9 connected to one end of the display element]5 is connected to the printed circuit board]6.
When the operation handle 5 is turned to the OFF side, one contact portion contacts the upper surface of the fixed terminal plate 9, and the connection terminal 14, the conductive metal fitting 2, the movable contact body 4, the coil spring 7, and the resistance element 17, an energizing circuit is formed for the display element 15, the fixed terminal plate 9, and the connecting terminal 13, so that the display element 5 lights up to emit light.

[発明が解決しようとする課題1 このようなスイッチは表示回路ブロックを組み込むこと
によって暗闇のスイッチの存在場所が表示てきて使用者
に大変便利なものであるが、従来の表示回路ブロックは
」−述のようにプリント基板16上で抵抗素子17と表
示素子15とを直列に半田付けにより接続して、しかも
各部品はとりわけ抵抗素子17はプリン1へ基板]6上
で直立させる構造であったため、安定性がなく、操作ハ
ンドル5のオン、オフ操作によって振動が伝わり断線す
るという問題があり、また組み立ても大変面倒であった
[Problem to be Solved by the Invention 1] Such a switch incorporates a display circuit block to display the location of the switch in the dark, which is very convenient for the user, but the conventional display circuit block does not. As mentioned above, the resistive element 17 and the display element 15 were connected in series on the printed circuit board 16 by soldering, and each component, especially the resistive element 17, was constructed to stand upright on the printed circuit board 6. However, there was a problem in that it was unstable, vibration was transmitted when the operating handle 5 was turned on and off, and the wire was broken, and assembly was also very troublesome.

そこで電路を埋め込んだき成樹脂製の成形基板を用い、
この成形基板上に突設した突起間に抵抗素子を挟持させ
て保持し、この保持状態で抵抗素子のリード線を成形基
板に突設した端子に半田付けして内部電路に接続する構
造のものが提案されているが、突起間の寸法より抵抗素
子の直径か小さい場合には保持かてきず、逆に突起間の
寸法より抵抗素子の直径が大きい場合には突起間に無理
やりに抵抗素子が挿入される状態となって抵抗素子が割
れて損傷が生しるという問題があった。
Therefore, we used a molded resin board with embedded electrical circuits.
The resistor element is held between the protrusions protruding from the molded board, and the lead wire of the resistor element is soldered to the terminal protruding from the molded board to connect it to the internal circuit. has been proposed, but if the diameter of the resistor element is smaller than the dimension between the protrusions, it cannot be held, and conversely, if the diameter of the resistor element is larger than the dimension between the protrusions, the resistor element is forced between the protrusions. There was a problem in that the resistance element cracked and was damaged when it was inserted.

本発明は上述の問題点に鑑みて為されたもので、その目
的とするところは回路素子の寸法のばらつきがあっても
組み込み時に回路素子に割れか生しなたり、脱落が生じ
ず、確実に回路素子を保持することができる回路ブロッ
クの素子実装構造を提供するにある。
The present invention has been made in view of the above-mentioned problems, and its purpose is to ensure that even if there are variations in the dimensions of the circuit elements, the circuit elements will not crack, deform, or fall off during assembly. An object of the present invention is to provide an element mounting structure of a circuit block that can hold circuit elements.

[課題を解決するための手段] 本発明は内部に金属板の打ち抜きによって形成された電
路を埋め込んな合成樹脂製の成形基板に抵抗素子等の回
路素子を配設して上記電路に接続されて成形基板より突
出させた端子に回路素子を接続する回路ブロックの素子
実装構造において、成形基板に配設される上記回路素子
の両側に柱状で先端が細くした突起を突設するとともに
、回路素子の両側幅方向に突起間圧M−j法を回路素子
の幅寸法の公差の最大値よりやや大きくし、各突起先端
を加熱変形させた変形部と成形基板との間で突起間の回
路素子を保持したものである。
[Means for Solving the Problems] The present invention provides a molded substrate made of synthetic resin in which an electric circuit formed by punching a metal plate is embedded, and a circuit element such as a resistor element is disposed therein and connected to the electric circuit. In an element mounting structure of a circuit block in which circuit elements are connected to terminals protruding from a molded board, columnar protrusions with tapered tips are provided on both sides of the circuit elements disposed on the molded board, and The pressure between the protrusions M-j in the width direction on both sides is made slightly larger than the maximum value of the tolerance of the width dimension of the circuit element, and the circuit element between the protrusions is placed between the deformed part where the tip of each protrusion is heated and deformed and the molded substrate. It was retained.

[作用] 而して本発明の回路ブロックの素子実装構造によれば突
起間に回路素子を組み込む際、回路素子の幅寸法がばら
ついても、回路素子を突起間に容易に組み込むことがで
き、回路素子の割れなどのトラブル発生がなく、しかも
回路素子は突起先端の加熱変形部と成形基板との間で保
持されるため、保持が確実となり、振動などが加わって
も保持が外れる事がなく、回路素子のリード線のかしめ
固定や半田1寸は等の固定作業も容易となる。
[Function] According to the element mounting structure of the circuit block of the present invention, when the circuit element is assembled between the protrusions, even if the width dimension of the circuit element varies, the circuit element can be easily assembled between the protrusions. There are no problems such as cracking of the circuit elements, and since the circuit elements are held between the heated deformation part at the tip of the protrusion and the molded substrate, they are held securely and will not come off even when subjected to vibrations, etc. This also facilitates fixing work such as caulking and fixing the lead wires of circuit elements, and applying one inch of solder.

[実施例] 以下本発明を実施例図により説明する。本発明実施例て
は第1図に示すように合成樹脂製の成形基板21内部に
は金属板の打ち抜きによって形成された電路がインサー
トされており、成形基板21の一側部には抵抗素子]7
のリード線20″をかしめ固定したり或は半田付けする
ための端子22と、ネオン管のような表示素子15のリ
ード線23.23を夫々かしめ固定する端子22a、2
21)とか夫17突設形成されている。
[Example] The present invention will be explained below with reference to Example drawings. In an embodiment of the present invention, as shown in FIG. 1, an electric circuit formed by punching a metal plate is inserted inside a molded substrate 21 made of synthetic resin, and a resistance element is provided on one side of the molded substrate 21. 7
Terminals 22 for caulking or soldering the lead wires 20'' of the display element 15 such as neon tubes, and terminals 22a, 2 for caulking and fixing the lead wires 23 and 23 of the display element 15 such as a neon tube, respectively.
21) or 17 protrusions are formed.

また成形基板2]−の上面中央には上述の操作ハンドル
5の中央リブ5aを挿着する孔18を穿設しており、こ
の孔〕8の一側方の成形基台21の上面には表示素子1
5を載置するための載置台25を一体に設け、また孔1
8の他側方には抵抗素子17を成形基板21の成形工程
て保持固定するための突起26か一体に突設している。
In addition, a hole 18 into which the center rib 5a of the operating handle 5 described above is inserted is bored in the center of the upper surface of the molded substrate 2]-, and the upper surface of the molded base 21 on one side of this hole Display element 1
A mounting table 25 for mounting the hole 1 is integrally provided, and the hole 1
A protrusion 26 for holding and fixing the resistor element 17 during the molding process of the molded substrate 21 is integrally provided on the other side of the molded substrate 8 .

更にこの突起26を設4−)である側の成形基板2]の
端部より上面が成形材によって覆われた接点部27が突
設せられている。この接点部27は従来の接点部1つに
対応するものである。
Further, a contact portion 27 whose upper surface is covered with a molding material is provided to protrude from the end of the molded substrate 2 on the side where the protrusion 26 is provided. This contact portion 27 corresponds to one conventional contact portion.

第4図(2])〜(C)は長尺金属板28の電路形成工
程を示しており、フープ状に巻き取られた0、2mrn
厚の長尺金属板28を打ち抜き機Uて、電路部分を中央
に抜き形成するようになっており、第4図(I])に示
すように電路としては第1の端子22 aを形成すると
ともに他端に接点部27を形成した第1の電路p、と、
両端に第2.第3の他紙22,22bを形成する第2の
電路12とを形成し、上述したように端子22a、22
bに表示素子15のリード線23.23を夫々がしめ固
定し、端子22に抵抗素子17のリード線20′をかし
め固定(或は半田付け>t、y:場合、抵抗素子17、
表示素子15、接点部27の直列回路が各電路p。
4(2) to (C) show the process of forming an electric circuit on the long metal plate 28, in which the long metal plate 28 is wound into a hoop shape.
A thick elongated metal plate 28 is punched out using a punching machine U to form an electric circuit portion in the center, and as shown in FIG. 4(I), the first terminal 22a is formed as an electric circuit. and a first electric path p having a contact portion 27 formed at the other end thereof;
2nd on both ends. The second electric path 12 forming the third other paper 22, 22b is formed, and the terminals 22a, 22 are formed as described above.
The lead wires 23 and 23 of the display element 15 are respectively tightened and fixed to b, and the lead wire 20' of the resistance element 17 is fixed to the terminal 22 by caulking (or if soldering > t, y: the resistance element 17,
A series circuit of the display element 15 and the contact portion 27 constitutes each electric circuit p.

p2を介して形成されるのである。It is formed via p2.

第5図(a)〜(c)は上述のように電路!。Figures 5 (a) to (c) are electrical circuits as described above! .

12を形成した後に巻き取られたフープ状の金属板28
の各電路p1,42部分を成形基板21て被覆するよう
に成形機Vてインサート成形時に突起26を同時に成形
するのである。ここで第2図(a)に示すように使用抵
抗素子]7の配設位置の片側には2つの突起26を、他
方の側に1つの突起26を夫々突設しており、第2図(
b)に示す抵抗素子17の幅方向の突起26間寸法Wは
使用抵抗素子17の直径りの公差の最大値よりやや大き
な寸法とし、また夫々の突起2Gの先端部を先細りの形
としである。
Hoop-shaped metal plate 28 rolled up after forming 12
During insert molding, the projections 26 are simultaneously molded by the molding machine V so that the molded substrate 21 covers each of the electric circuits p1 and 42. Here, as shown in FIG. 2(a), two protrusions 26 are protruded from one side of the arrangement position of the resistor element used] 7, and one protrusion 26 is protruded from the other side. (
The dimension W between the protrusions 26 in the width direction of the resistor element 17 shown in b) is slightly larger than the maximum diameter tolerance of the resistor element 17 used, and the tip of each protrusion 2G is tapered. .

而して突起26の成形後、第2図(a)、(b)に示す
ように抵抗素子17を突起26間に挿入した後に第2図
(c)に示すように超音波ウェルター24により突起2
6の先端部を加熱変形させ、この変形部26aと成形基
板21とて抵抗素子]7を挟持して保持するのである。
After forming the protrusions 26, the resistor element 17 is inserted between the protrusions 26 as shown in FIGS. 2
6 is heated and deformed, and the resistive element 7 is held between the deformed portion 26a and the molded substrate 21.

このようにして成形基板21を成形し、抵抗素子]7を
保持してフープ状に予め巻き取った金属板28を順次送
り出して、各端子22.22a22bのフォーミング工
程の終了後抵抗素子]7の一方のリード線20”と端子
22とのかし7め固定(或は半田付け)し、他方のリー
ド線20″を直角に折り曲げ、更にその中間部分を抵抗
素子]7に対して約45度となるようにして水平に臨ま
せるのである。つまりこのリート線20′”の先端か操
作ハフ1−ル5の中央リブ5aの穴6内に、中央リブ5
aに設けたスリット(図示せず)を介して挿入され、ス
イッチの組み立て時に六6内に上半分か挿着されるコイ
ルスプリング7の上端に接続されるのである。
In this way, the molded substrate 21 is molded, and the metal plate 28 which has been wound up into a hoop shape while holding the resistive element]7 is sequentially sent out, and after the forming process of each terminal 22.22a22b is completed, the resistive element]7 is Fix (or solder) one lead wire 20'' to the terminal 22 at the terminal 7, bend the other lead wire 20'' at a right angle, and then bend the middle part at an angle of about 45 degrees to the resistor element]7. In this way, it can be viewed horizontally. In other words, the tip of this wire 20''' is inserted into the hole 6 of the central rib 5a of the operating huff 1-rule 5.
The coil spring 7 is inserted through a slit (not shown) provided in the switch A, and is connected to the upper end of the coil spring 7 whose upper half is inserted into the nozzle 6 when the switch is assembled.

さて一方表示素子15は抵抗素子17のリード線20″
の折り曲げ工程終了後両方のリード線23.23が端子
22a、22bに夫々かしめ固定され、しかる後にリー
ド線23.23が折り曲けられて載置台25上に横倒載
置されるのである。
Now, on the other hand, the display element 15 is connected to the lead wire 20'' of the resistance element 17.
After the bending process is completed, both lead wires 23.23 are caulked and fixed to the terminals 22a, 22b, respectively, and then the lead wires 23.23 are bent and placed horizontally on the mounting table 25.

この表示素子15の組み込み終了後に各成形基板21部
分を金属板28より分断して所望の表示回路ブロックを
得るのである。この分断と同時に実際においては操作ハ
ンドル5への表示回路ブロックの組み込みか行われる。
After the display element 15 has been assembled, each molded substrate 21 portion is separated from the metal plate 28 to obtain a desired display circuit block. At the same time as this separation, the display circuit block is actually assembled into the operating handle 5.

つまり表示回路ブロックはフープ材の状態から操作ハン
ドル5への組み込みまでの一貫した連続組み立て工程に
よって完成され且つ組み込まれるのである。
In other words, the display circuit block is completed and assembled through a consistent and continuous assembly process from the state of the hoop material to its assembly into the operating handle 5.

さて上述のように成形基板21をフープ状の金属リート
板28より分断して表示回路ブロックを得ると同時に操
作ハンドル5内に表示回路ブロックを組み込むために分
断前に一旦抵抗素子17、表示素子15か下側となるよ
うに反転させる方法かとられるのであるか、この際、抵
抗体17の脱落が突起26による一体成形によって防止
され、一方のリード線20′のみの端子22へのかしめ
固定或は半田付けたけても十分に抵抗素子17を成形基
板21上に固持てきるのである。
Now, as mentioned above, in order to obtain a display circuit block by cutting the molded substrate 21 from the hoop-shaped metal sheet board 28 and at the same time incorporating the display circuit block into the operation handle 5, the resistive element 17 and the display element 15 are temporarily inserted before cutting. In this case, the resistor 17 is prevented from falling off by integral molding with the protrusion 26, and only one lead wire 20' is fixed to the terminal 22 by caulking or The resistive element 17 can be firmly held on the molded substrate 21 even after soldering.

次いで表示回路ブロックを組み込んだ操作ハンドル5は
第3図に示すようにスイッチの器体1内に装着するわけ
であるが、従来と同様にコイルスプリング7の上半分が
中央リブ5aの六6内に挿着され、六6内に挿入されて
いる抵抗素子]7のリード線20″と電気的に接続され
、また成形基板2]の接点部27は操作ハンドル5の周
縁下面に配置され、操作ハンドル5の操作に応して固定
端子板9と接触、開離することができるようになる。
Next, the operating handle 5 incorporating the display circuit block is installed in the switch body 1 as shown in FIG. and is electrically connected to the lead wire 20'' of the resistive element [7] inserted into the 66, and the contact portion 27 of the molded substrate 2] is disposed on the lower surface of the periphery of the operating handle 5, and is electrically connected to the lead wire 20'' of the resistor The handle 5 can be brought into contact with and separated from the fixed terminal plate 9 in accordance with the operation of the handle 5.

[発明の効果コ 本発明は成形基板に配設される上記回路素子の両側に柱
状て先端を細くした突起を突設するとともに、回路素子
の両側幅方向に突起間距離寸法を回路素子の幅寸法の公
差の最大値よりやや大きくし、各突起先端を加熱変形さ
ぜな変形部位と成形基板との間で突起間の回路素子を保
持しであるので、突起間に回路素子を組み込む際、回路
素子の直径寸法がばらついても突起間に容易に組み込む
ことができ、回路素子の割れなとのトラブル発生がなく
、しかも回路素子は突起先端の加熱変形部と成形基板と
の間で保持されるため、保持が確実に行え、振動などが
加わっても回路素子が脱落することがなく、結果回路素
子の半田付けやかしめ固定等の作業も容易となり、また
工程移動中における回路素子の脱落もなくなるという効
果がある。
[Effects of the Invention] The present invention provides pillar-shaped protrusions with tapered tips on both sides of the circuit element disposed on a molded substrate, and the distance between the protrusions in the width direction of both sides of the circuit element is adjusted to the width of the circuit element. The dimensional tolerance is slightly larger than the maximum value, and the tip of each protrusion is heated and deformed to hold the circuit element between the protrusions between the slightly deformed part and the molded substrate, so when incorporating the circuit element between the protrusions, Even if the diameter of the circuit element varies, it can be easily assembled between the protrusions, and troubles such as cracking of the circuit element do not occur, and the circuit element is held between the heated deformed part at the tip of the protrusion and the molded substrate. As a result, the circuit elements can be held securely and will not fall off even when subjected to vibrations, etc., making work such as soldering and caulking the circuit elements easier, and also prevents the circuit elements from falling off during process movement. It has the effect of disappearing.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の斜視図、第2図(a)(b)(C)は
同上の一部省略した上面図、一部省略した正面図、一部
省略した側面図、第3図は実施例を用いたスイッチの断
面図、第4図(a>、(b)(c)及び第5図(a、)
、(b)、(c)は同上の製造工程説明図、第6図は従
来例を使用したスイッチの断面図、第7図<a)、(b
)は同上の正面図、側面図である。 17は抵抗素子、21は成形基板、26は突起、26a
は変形部である。 代理人 弁理士 石 1)長 七 26は突起 26aは変形部 第3 図 (G) 第2図 (b)
1 is a perspective view of the present invention, FIGS. 2(a), 2(b), and 2(C) are a partially omitted top view, a partially omitted front view, and a partially omitted side view of the same as above, and FIG. 3 is a partially omitted side view. Cross-sectional views of the switch using the embodiment, FIG. 4 (a>, (b), (c) and FIG. 5 (a,)
, (b) and (c) are explanatory diagrams of the same manufacturing process as above, FIG. 6 is a sectional view of a switch using a conventional example, and FIG. 7<a), (b)
) are a front view and a side view of the same as above. 17 is a resistance element, 21 is a molded substrate, 26 is a projection, 26a
is the deformed part. Agent Patent Attorney Ishi 1) Length 726 is the protrusion 26a is the deformed part Fig. 3 (G) Fig. 2 (b)

Claims (1)

【特許請求の範囲】[Claims] (1)内部に金属板の打ち抜きによって形成された電路
を埋め込んだ合成樹脂製の成形基板に抵抗素子等の回路
素子を配設して上記電路に接続されて成形基板より突出
させた端子に回路素子を接続する回路ブロックの素子実
装構造において、成形基板に配設される上記回路素子の
両側に柱状で先端を細くした突起を突設するとともに、
回路素子の両側幅方向に突起間距離寸法を回路素子の幅
寸法の公差の最大値よりやや大きくし、各突起先端を加
熱変形させた変形部と成形基板との間で突起間の回路素
子を保持して成ることを特徴とする回路ブロックの素子
実装構造。
(1) Circuit elements such as resistive elements are arranged on a synthetic resin molded board with an electrical circuit formed by punching a metal plate embedded inside, and a circuit is connected to the terminal connected to the electrical circuit and protruded from the molded board. In an element mounting structure of a circuit block that connects elements, columnar protrusions with tapered tips are provided protrudingly on both sides of the circuit elements arranged on the molded substrate, and
The distance between the protrusions in the width direction on both sides of the circuit element is made slightly larger than the maximum tolerance of the width dimension of the circuit element, and the circuit element between the protrusions is placed between the deformed part where the tip of each protrusion is heated and deformed and the molded substrate. An element mounting structure of a circuit block characterized by holding.
JP6314589A 1989-03-15 1989-03-15 Device package structure of circuit block Pending JPH02242539A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6314589A JPH02242539A (en) 1989-03-15 1989-03-15 Device package structure of circuit block

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6314589A JPH02242539A (en) 1989-03-15 1989-03-15 Device package structure of circuit block

Publications (1)

Publication Number Publication Date
JPH02242539A true JPH02242539A (en) 1990-09-26

Family

ID=13220788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6314589A Pending JPH02242539A (en) 1989-03-15 1989-03-15 Device package structure of circuit block

Country Status (1)

Country Link
JP (1) JPH02242539A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014186919A (en) * 2013-03-25 2014-10-02 Panasonic Corp Switch with pilot lamp using led and circuit block mounted with appropriate electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014186919A (en) * 2013-03-25 2014-10-02 Panasonic Corp Switch with pilot lamp using led and circuit block mounted with appropriate electronic component

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