JPH0224574U - - Google Patents

Info

Publication number
JPH0224574U
JPH0224574U JP10155888U JP10155888U JPH0224574U JP H0224574 U JPH0224574 U JP H0224574U JP 10155888 U JP10155888 U JP 10155888U JP 10155888 U JP10155888 U JP 10155888U JP H0224574 U JPH0224574 U JP H0224574U
Authority
JP
Japan
Prior art keywords
component mounting
soldering
area
mounting land
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10155888U
Other languages
English (en)
Other versions
JP2527326Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988101558U priority Critical patent/JP2527326Y2/ja
Publication of JPH0224574U publication Critical patent/JPH0224574U/ja
Application granted granted Critical
Publication of JP2527326Y2 publication Critical patent/JP2527326Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図Ａ，Ｂ，Ｃ，Ｄは本考案の実施例に係わ
る混成集積回路の一部を製造工程順に示す平面図
、第２図は第１図Ｄの−線に相当する部分を
示す断面図、第３図は第２の電子部品を搭載した
状態を示す第２図に対応する部分の断面図である
。 １……回路基板、３，４……ランド、７ａ……
第１の電子部品、７ｂ……第２の電子部品、９，
１０……リード端子、１１……樹脂層、１２……
半田。

Claims (1)

  1. 【実用新案登録請求の範囲】 リード端子間ピツチがほぼ同一又は整数倍であ
    るが、幅が異なる複数種の電子部品を半田によつ
    て取付けることができるように部品取付用ランド
    が設けられている回路基板装置において、 前記部品取付用ランドにおける前記電子部の半
    田付け領域を除く領域上に樹脂層を設けたことを
    特徴とする回路基板装置。
JP1988101558U 1988-07-30 1988-07-30 回路基板装置 Expired - Lifetime JP2527326Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988101558U JP2527326Y2 (ja) 1988-07-30 1988-07-30 回路基板装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988101558U JP2527326Y2 (ja) 1988-07-30 1988-07-30 回路基板装置

Publications (2)

Publication Number Publication Date
JPH0224574U true JPH0224574U (ja) 1990-02-19
JP2527326Y2 JP2527326Y2 (ja) 1997-02-26

Family

ID=31330665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988101558U Expired - Lifetime JP2527326Y2 (ja) 1988-07-30 1988-07-30 回路基板装置

Country Status (1)

Country Link
JP (1) JP2527326Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6163876U (ja) * 1984-09-29 1986-04-30
JPS62196376U (ja) * 1986-06-04 1987-12-14

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6163876U (ja) * 1984-09-29 1986-04-30
JPS62196376U (ja) * 1986-06-04 1987-12-14

Also Published As

Publication number Publication date
JP2527326Y2 (ja) 1997-02-26

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