JPH02253111A - Ic lead curvature checking device - Google Patents

Abstract

PURPOSE:To more quickly and accurately check the lead curvature by arranging a laser displacement meter to face the lead face projected from each side face of an IC. CONSTITUTION:A laser displacement meter 2 is arranged to face each face of an IC 6 having leads projected from four side faces A to D. An IC 6 is supplied from a supply part 1 to a stage 5a, and the distortion of the side face A is measured by the laser displacement meter 2. The stage 5a is rotated to measure the distortion of the side face B, and another IC 6 is supplied and this operation is repeated, and ICs are finally stored in a storage box 3. Since plural leads are simultaneously measured and the relative position of the displacement meter 2 to the IC 6 in a divided position is individually adjusted, influences of the dividing accuracy and the flatness of the stage 5a can be ignored to accurately check the lead curvature.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC lead bending inspection device using a laser displacement meter.

[Conventional technology]

Conventionally, IC lead surface inspection involves irradiating a laser beam onto the lead surface at a predetermined incident angle and measuring the amount of light reflected from the lead surface based on the reflection angle to measure the curvature of the irradiated surface. It was inspected using a laser displacement meter. Furthermore, in order to speed up the inspection speed of this device, various efforts and improvements have been made regarding peripheral devices and devices.

FIG. 2 is a plan view of a conventional IC lead bending inspection device. This IC lead bending inspection device has an I
Stage 5 where C6 can be placed and indexed into quarters
are placed on the left and right of this stage 5, and I
A transfer device 4 that transfers the C6 from the supply section 1 to the stage 5, or transfers the IC6 from the stage 5 and stores it in the storage box 3, and a displacement meter 2 that measures the bending of the lead of the IC6. It consists of

Next, the operation of this IC lead bending inspection device will be explained.

First, the IC 6 is placed on the stage 5 from the supply section 1 by the transport device 4. Next, the laser displacement meter 2 placed on the IC 6 irradiates a laser beam onto the REET surface on one side of the IC 6 to measure the distortion of the REET. Next, stage 5 is 9
Rotate it 0 degrees so that the other side of the IC 6 -1 is directly below the laser displacement meter 2. Next, the laser displacement meter 2 is used to inspect the distortion of the beam. In this way, the stage 5 is indexed so that it is located directly below the laser displacement meter 2 at each side surface of the IC 6, and the leads are inspected. When the inspection of the leads on all sides is completed, the IC6 is transferred by the transport device 4.
is transferred and stored in storage box 3.

[Invention or problem to be solved]

In a conventional dual IC lead bending inspection device, each side is indexed by a stage with respect to one laser displacement meter to inspect the side reams of the IC. Therefore, not only is efficiency low, but also the stage index accuracy, that is, the stage indexing accuracy and flatness are taken into consideration with the IC lead surface, making it impossible to perform accurate inspection.

An object of the present invention is to provide an IC lead bending inspection device that can perform faster and more accurate inspection.

[Means to solve the problem]

The IC lead bending inspection device of the present invention irradiates a laser beam onto the above-mentioned surfaces 1 to 1 of an IC having leads protruding from four side surfaces, and detects the laser beam reflected from the lead surface to detect the distortion of the lead surface. A laser displacement meter that measures
In an IC lead bending inspection device that includes a stage on which the IC is placed and divided into four equal parts, and a transfer device that transfers the IC to this stage or transfers it to another storage box, The device includes the laser displacement gauges arranged at respective positions facing the lead surface.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a plan view of an IC lead bending inspection device showing one embodiment of the present invention. This IC lead bending inspection device has a laser displacement meter 2 arranged at a position facing the lead surface of each side A, B, C, and D of the IC 6. Further, although not shown in the drawings, a conveyance device similar to that of the conventional example is arranged between the stage 5a, the supply section 1, and the storage box 3.

Other than that, it is the same as the conventional example.

By providing individual laser displacement meters 2 in this way,
Since the relative position accuracy between the IC 6 and the laser displacement meter at the indexed position can be individually adjusted or corrected, the influence of the index accuracy and flatness of the stage 5a can be ignored.

Note that in this embodiment, a circular stage is provided and several ICs are mounted.
The object of the present invention can also be achieved with an apparatus having a horizontal stage and a structure in which the stage is sequentially moved horizontally for inspection.

〔Effect of the invention〕

As explained above, the present invention allows multiple REETs to be inspected simultaneously by arranging laser displacement gauges protruding from each side surface of the IC and facing each other, and also improves the flatness of the conventional stage. This has the effect that a more accurate and faster IC lead bending inspection device can be obtained since the effects such as these can be ignored.

[Brief explanation of drawings]

FIG. 1 is a plan view of an IC lead bending inspection device showing an embodiment of the present invention, and FIG. 2 is a plan view of an IC lead bending testing device showing a conventional example.

Claims (1)

[Claims] A laser displacement meter that measures distortion of the lead surface by irradiating a laser beam onto the lead surface of an IC having leads protruding from four sides and detecting the laser beam reflected from the lead surface, and mounting the IC. In an IC lead bending inspection device that includes a stage that divides the IC into four equal parts, and a transfer device that transfers the IC to this stage or transfers it to another storage box, An IC lead bending inspection device comprising the laser displacement gauges arranged at respective positions.