JPH0760087B2 - IC lead bending inspection device - Google Patents

Description

The present invention relates to an IC lead bending inspection apparatus using a laser displacement meter.

[Conventional technology]

Conventionally, in the IC lead bending inspection, a laser that measures the bending state of the irradiation surface by irradiating the lead surface with laser light at a predetermined incident angle and measuring the amount of light reflected from the lead surface from the reflection angle. It was inspected using a displacement meter.
In addition, in order to increase the inspection speed of this device, various attempts and improvements have been made to peripheral devices and devices.

FIG. 2 is a plan view of an IC lead bending inspection apparatus showing a conventional example. In this IC lead bending inspection apparatus, an IC6 is placed in the center, and a stage 5 that can be indexed in four equal parts, and IC6 is transferred from the supply unit 1 to the stage 5 while being arranged on the left and right of this stage 5. Or a transfer device 4 that transfers the IC 6 from the stage 5 and stores it in the storage box 3, and a laser displacement meter 2 that measures the bending of the leads of the IC 6.
Composed of and.

Next, the operation of this IC lead bending inspection apparatus will be described. First, the IC 6 from the supply unit 1 is placed on the stage 5 by the transfer device 4. Next, the laser displacement meter 2 placed on the IC6
The laser light is applied to the lead surface on one side of the IC 6 to measure the distortion of the lead. Next, the stage 5 is rotated by 90 degrees so that the lead on the other side of the IC 6 is located directly below the laser displacement meter 2. Next, the laser displacement meter 2 inspects the lead for distortion. In this way, the stage 5 is indexed and the leads are inspected so that the leads on each side of the IC 6 are directly under the laser displacement meter 2. When the inspection of the leads on all sides is completed, the IC 6 is transferred by the transfer device 4 and stored in the storage box 3.

[Problems to be Solved by the Invention]

In the conventional IC lead bending inspection apparatus described above, in order to inspect the side surface leads of the IC, each side surface is indexed by a stage with respect to one laser displacement meter and one side of the lead surface is inspected. Therefore, in addition to being inefficient, there is a drawback that the index accuracy of the stage, that is, the indexing accuracy and flatness of the stage are added to the lead surface of the IC, and an accurate inspection cannot be performed.

An object of the present invention is to provide an IC lead bending inspection device that can perform an accurate inspection faster and more accurately.

[Means for Solving the Problems]

The IC lead bending inspection apparatus of the present invention measures the distortion of the lead surface by irradiating the lead surface of the IC having leads protruding from the four side surfaces with laser light and detecting the laser light reflected from the lead surface. Laser displacement meter and the IC
In an IC lead bending inspection apparatus having a stage for mounting and indexing into four equal parts, and a transfer device for transferring the IC to this stage or transferring it to another storage box,
The laser displacement meter is provided at each of the positions facing the lead surface of the IC.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of an IC lead bending inspection apparatus showing an embodiment according to the present invention. This IC lead bending inspection device
That is, the laser displacement meter 2 is arranged at a position facing the lead surface of each of the side surfaces A, B, C, and D of 6. Although not shown in the drawing, a transfer device similar to the conventional example has a stage.
It is arranged between 5a and the supply unit 1 and the storage box 3. Otherwise, it is the same as the conventional example.

By providing the laser displacement gauges 2 individually in this way,
Since the relative position accuracy between the IC6 and the laser displacement meter at the indexed position can be adjusted or corrected individually, the stage
The influence of accuracy and flatness can be neglected for 5a.

Although this embodiment has been described with respect to an apparatus for inspecting several ICs by providing a circular stage, an object of the present invention can also be achieved by an apparatus having a structure in which a horizontal stage is used and the transverse feed is sequentially performed.

〔The invention's effect〕

As described above, according to the present invention, by disposing the laser displacement meter so as to face the lead surfaces protruding from the respective side surfaces of the IC, a plurality of leads can be inspected at the same time and the influence of the flatness of the conventional stage, etc. Since it can be ignored, a more accurate and faster IC lead bending inspection apparatus can be obtained.

[Brief description of drawings]

FIG. 1 is a plan view of an IC lead bending inspection apparatus showing an embodiment according to the present invention, and FIG. 2 is a plan view of an IC lead bending inspection apparatus showing an example of the related art. 1 ... Supply unit, 2 ... Laser displacement meter, 3 ... Storage box, 4
…… Transport device, 5 …… Stage, 6 …… IC, 7 …… Stand.

Claims (1)

[Claims] 1. Distortion of the lead surface by irradiating the lead surface of an IC having leads protruding from four side surfaces of A, B, C and D with laser light and detecting the laser light reflected from the lead surface. And a rotation means for rotating the IC every 90 degrees in order to place the IC on the lead surface of each of A, B, C and D faces the laser displacement meter. In an IC lead bending inspection apparatus having a transfer device for transferring the IC to the rotating means or transferring it to another storage box, the IC mounted on the rotating means is
The stage that is arranged every 90 degrees and rotates every 90 degrees, and the IC
An IC lead bending inspection apparatus comprising the laser displacement meter arranged at each of the positions of A, B, C and D facing the lead surface.