JPH022535Y2 - - Google Patents
Info
- Publication number
- JPH022535Y2 JPH022535Y2 JP12068184U JP12068184U JPH022535Y2 JP H022535 Y2 JPH022535 Y2 JP H022535Y2 JP 12068184 U JP12068184 U JP 12068184U JP 12068184 U JP12068184 U JP 12068184U JP H022535 Y2 JPH022535 Y2 JP H022535Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- support
- solder reflow
- reflow apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案はプリント基板上の半田ペーストを加熱
溶融させて該プリント基板上にフリツプ状の部品
を電気的・機械的に接続する半田リフロー装置の
改良に関し、特に同装置におけるプリント基板の
支持部の改良に関する。[Detailed description of the invention] [Industrial application field] The present invention is a solder reflow device that heats and melts solder paste on a printed circuit board to electrically and mechanically connect flip-shaped components onto the printed circuit board. The present invention relates to improvements, particularly to improvements to the support portion of the printed circuit board in the device.
第４図ａ，ｂに従来の半田リフロー装置におけ
る、プリント基板の支持部の構造の一例を示す。
同図において、１ａ，１ｂは平行駆動される一対
のチエーンコンベアであつて、これらは逆Ｌ字形
の金具からなる複数の支持板２a1，２a2，２a3…
…，２b1，２b2，２b3…が取り付けてある。３は
その両端を前記支持板２a1，２a2，２a3……，２
b1，２b2，２b3……に載置したプリント基板、４
ａ，４ｂ，４ｃ……はチエーンコンベア１ａ，１
ｂの上方に設置した赤外線ヒーターである。この
装置は、上記のような状態に支持したプリント基
板３の適所に抵抗体、コンデンサー、IC，LSI等
のチツプ状の部品を配置したうえ、チエーンコン
ベア１ａ，１ｂを駆動させながら赤外線ヒーター
４ａ，４ｂ，４ｃ……によりプリント基板３上の
半田ペーストを加熱溶融させて同プリント基板３
上にチツプ状の部品を電気的・機械的に接続する
のである。
FIGS. 4a and 4b show an example of the structure of a support portion of a printed circuit board in a conventional solder reflow apparatus.
In the figure, 1a and 1b are a pair of chain conveyors that are driven in parallel, and these support plates 2a 1 , 2a 2 , 2a 3 , . . . are made of inverted L-shaped metal fittings.
..., 2b 1 , 2b 2 , 2b 3 ... are attached. 3 connects both ends to the support plates 2a 1 , 2a 2 , 2a 3 ..., 2
b 1 , 2b 2 , 2b 3 ... printed circuit board placed on 4
a, 4b, 4c... are chain conveyors 1a, 1
This is an infrared heater installed above b. In this device, chip-shaped parts such as resistors, capacitors, ICs, and LSIs are arranged at appropriate locations on a printed circuit board 3 supported in the above state, and infrared heaters 4a, 4b, 4c... heat and melt the solder paste on the printed circuit board 3.
Chip-shaped parts are electrically and mechanically connected to the top.
ところが、前記のような装置では、チエーンコ
ンベア１ａ，１ｂに取り付けて支持板２a1，２
a2，２a3……，２b1，２b2，２b3……にプリント
基板３を直接載置する構造であるため、次のよう
な欠点があつた。すなわち、プリント基板上の半
田ペーストを加熱した際に、プリント基板のうち
支持板に接触している部分の熱が支持板を伝つて
チエーンコンベアに逃げてしまい、支持板に接触
していない部分との温度差が約20℃近くとなり、
支持板に接触している部分又はその周囲の半田ペ
ーストが十分に溶融しない場合がある。そこで、
支持板に接触している部分の温度を十分に高くす
るために加熱温度を高めると、支持板に接触して
いない部分の温度が高くなりすぎ、チツプ状の部
品の特性不良や早期劣化をもたらす結果となる。
このため、第５図に示すように、支持板に接触す
るプリント基板３の端部に適数の透孔５ａ，５
ｂ，５ｃ……を設けてプリント基板３の端部と中
央部との温度差を小さくすることも行われてい
る。しかし、このようにすると、プリント基板３
の材料どりが極めて不経済になるだけでなく、プ
リント配線の範囲も制約されることとなり不都合
であつた。 However, in the above-mentioned device, the support plates 2a 1 and 2 are attached to the chain conveyors 1a and 1b.
Since the structure is such that the printed circuit board 3 is placed directly on a 2 , 2a 3 . . . , 2b 1 , 2b 2 , 2b 3 . In other words, when the solder paste on the printed circuit board is heated, the heat from the part of the printed circuit board that is in contact with the support plate is transmitted through the support plate and escapes to the chain conveyor, causing heat to be lost to the part of the printed circuit board that is not in contact with the support plate. The temperature difference is nearly 20℃,
The solder paste in or around the part that is in contact with the support plate may not be sufficiently melted. Therefore,
If the heating temperature is increased to raise the temperature of the part that is in contact with the support plate high enough, the temperature of the part that is not in contact with the support plate will become too high, leading to poor characteristics and early deterioration of chip-shaped parts. result.
For this reason, as shown in FIG.
b, 5c, . . . are also provided to reduce the temperature difference between the ends and the center of the printed circuit board 3. However, if you do this, the printed circuit board 3
This is not only extremely uneconomical in terms of materials, but also limits the range of printed wiring, which is disadvantageous.
本考案は、前記のような欠点を除去したプリン
ト基板支持部を備えた半田リフロー装置を提供す
ることを目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide a solder reflow apparatus having a printed circuit board support part that eliminates the above-mentioned drawbacks.
第１図乃至第３図に本考案に係る半田リフロー
装置におけるプリント基板支持部の一例を示す。
FIGS. 1 to 3 show an example of a printed circuit board support part in a solder reflow apparatus according to the present invention.
第１図ａ，ｂにおいて、１ａ，１ｂは平行駆動
される一対のチエーンコンベアである。このチエ
ーンコンベア１ａ，１ｂにはそれぞれ複数の支持
板２a1，２a2，２a3……，２b1，２b2，２b3…が
取り付けてある。そして、この支持板２a1，２
a2，２a3……，２b1，２b2，２b3…には適当な長
さの支持腕３a1，３a2，３a3……，３b1，３b2，
３b3……が取り付けてある。さらに、前記支持腕
３a1，３a2，３a3……，３b1，３b2，３b3……の
先端部には熱伝導性が悪く、かつ熱吸収性の良い
材料で構成した支持片４a1，４a2，４a3……，４
b1，４b2，４b3……が固定してある。５はその両
端を前記支持片４a1，４a2，４a3……，４b1，４
b2，４b3……の部分に載置したプリント基板、６
ａ，６ｂ，６ｃ……はチエーンコンベア１ａ，１
ｂの上方に設置した赤外線ヒーターを示す。前記
支持片４a1，４a2，４a3……，４b1，４b2，４b3
……を構成する、熱伝導性が悪くかつ熱吸収性の
良い材料としては、ガラス繊維にフツ素樹脂又は
カーボン入りフツ素樹脂を含浸させたもの等が最
適である。かかる支持片４a1，４a2，４a3……，
４b1，４b2，４b3……を用いることにより、プリ
ント基板５の端部からの熱の逸散を最少限度に抑
えるとともに、適当な長さの支持腕３a1，３a2，
３a3……，３b1，３b2，３b3……との組み合せに
よりプリント基板５に対するチエーンコンベア１
ａ，１ｂの位置を遠ざけることができる。第２図
は支持腕３ａの先端に補助腕７ａを介して支持片
４ａを取り付けた例を示すもので、プリント基板
５の大きさに応じて支持片４ａの位置を変えたい
場合に好都合である。第３図は支持腕３ａの先端
に補助腕７ａを介して針金状の支持片４ａと位置
決め片８ａを設けた例を示すもので、プリント基
板５の位置を正確に規制する場合に好都合であ
る。 In FIGS. 1a and 1b, 1a and 1b are a pair of chain conveyors driven in parallel. A plurality of support plates 2a 1 , 2a 2 , 2a 3 . . . , 2b 1 , 2b 2 , 2b 3 . . . are attached to the chain conveyors 1a and 1b, respectively. And this support plate 2a 1 , 2
For a 2 , 2a 3 ..., 2b 1 , 2b 2 , 2b 3 ..., support arms 3a 1 , 3a 2 , 3a 3 ..., 3b 1 , 3b 2 ,
3b 3 ... is attached. Further, at the tips of the support arms 3a 1 , 3a 2 , 3a 3 . . . , 3b 1 , 3b 2 , 3b 3 . 1 , 4a 2 , 4a 3 ..., 4
b 1 , 4b 2 , 4b 3 ... are fixed. 5 connects both ends to the support pieces 4a 1 , 4a 2 , 4a 3 ..., 4b 1 , 4
b 2 , 4b 3 ... printed circuit board placed on the part, 6
a, 6b, 6c... are chain conveyors 1a, 1
The infrared heater installed above b is shown. The support pieces 4a 1 , 4a 2 , 4a 3 ..., 4b 1 , 4b 2 , 4b 3
As the material constituting the material, which has poor thermal conductivity and good heat absorption properties, the most suitable material is glass fiber impregnated with fluororesin or carbon-containing fluororesin. Such support pieces 4a 1 , 4a 2 , 4a 3 ...,
By using 4b 1 , 4b 2 , 4b 3 . . . , the dissipation of heat from the ends of the printed circuit board 5 is minimized, and the supporting arms 3a 1 , 3a 2 , of appropriate lengths are used.
Chain conveyor 1 for printed circuit board 5 in combination with 3a 3 ..., 3b 1 , 3b 2 , 3b 3 ...
The positions of a and 1b can be moved apart. FIG. 2 shows an example in which the support piece 4a is attached to the tip of the support arm 3a via the auxiliary arm 7a, which is convenient when it is desired to change the position of the support piece 4a depending on the size of the printed circuit board 5. . FIG. 3 shows an example in which a wire-like support piece 4a and a positioning piece 8a are provided at the tip of the support arm 3a via an auxiliary arm 7a, which is convenient for precisely regulating the position of the printed circuit board 5. .
本考案に係る半田リフロー装置は、以上説明し
たごとき構成なので次のような利点がある。
Since the solder reflow apparatus according to the present invention has the configuration as described above, it has the following advantages.
プリント基板端部からの熱の逸散を最少限度
に抑えることができるので、プリント基板全体
の加熱温度分布を均一化することが可能であ
る。このことは、プリント基板の正確な加熱制
御により、チツプ状部品の特性不良や早期劣化
をもたらすことなく、品質の安定した製品が得
られることを意味する。又、プリント基板の端
部に透孔を設ける必要がなく、広い範囲にわた
つてプリント配線をすることができるので、極
めて経済的である。 Since the dissipation of heat from the ends of the printed circuit board can be suppressed to a minimum, it is possible to make the heating temperature distribution of the entire printed circuit board uniform. This means that by accurately controlling the heating of printed circuit boards, products with stable quality can be obtained without causing characteristic defects or early deterioration of chip-shaped parts. Furthermore, there is no need to provide through holes at the ends of the printed circuit board, and printed wiring can be carried out over a wide range, making it extremely economical.
プリント基板の支持片と支持腕の組み合せに
より、プリント基板に対するチエーンコンベア
１ａ，１ｂの位置を遠ざけることができる。即
ちチエーンコンベア１ａ，１ｂの間隔を広げる
ことができるので、プリント基板の下方にも赤
外線ヒーター等を配置することが可能である。
このことは、プリント基板の上下両面にチツプ
状部品を配置しておき同時に加熱固着できるこ
とを意味する。これは作業の自動化等に極めて
有利な点である。 The combination of the printed circuit board support piece and the support arm allows the chain conveyors 1a, 1b to be moved away from the printed circuit board. That is, since the interval between the chain conveyors 1a and 1b can be widened, it is possible to arrange an infrared heater or the like also below the printed circuit board.
This means that chip-like components can be placed on both the upper and lower surfaces of the printed circuit board and fixed by heating at the same time. This is extremely advantageous for work automation.
第１図ａ，ｂ、乃至第３図は本考案に係る半田
リフロー装置の実施例図、第４図及び第５図は従
来の半田リフロー装置の実施例図である。
第１図ａ，ｂ乃至第３図において、１ａ，１ｂ
……チエーンコンベア、２a1，２a2，２a3……，
２b1，２b2，２b3……支持板、３a1，３a2，３a3
……，３b1，３b2，３b3……支持腕、４a1，４
a2，４a3……，４b1，４b2，４b3……支持片、５
……プリント基板、７ａ……補助腕。
1A and 1B to FIG. 3 are embodiments of a solder reflow apparatus according to the present invention, and FIGS. 4 and 5 are embodiments of a conventional solder reflow apparatus. In Figures 1a, b to 3, 1a, 1b
...Chain conveyor, 2a 1 , 2a 2 , 2a 3 ...,
2b 1 , 2b 2 , 2b 3 ... support plate, 3a 1 , 3a 2 , 3a 3
..., 3b 1 , 3b 2 , 3b 3 ... support arm, 4a 1 , 4
a 2 , 4a 3 ..., 4b 1 , 4b 2 , 4b 3 ... support piece, 5
...Printed circuit board, 7a...Auxiliary arm.
Claims (1)
り付けられた複数の支持板にプリント基板の両
端を載置して、該プリント基板上の半田ペース
トを加熱溶融させてチツプ状部品をプリント基
板上の電気回路に接続させる装置において、前
記支持板にそれぞれ所定の長さの支持腕３a1，
３a2，３a3……，３b1，３b2，３b3……を取り
付け、該支持腕３a1，３a2，３a3……，３b1，
３b2，３b3……の先端に補助腕７ａを介して又
は介さずに熱電導性が悪くかつ熱吸収性の良い
材料で構成した支持片４a1，４a2，４a3……，
４b1，４b2，４b3……を固定して、該支持片４
a1，４a2，４a3……，４b1，４b2，４b3……の
部分にプリント基板５の両端を載置するように
構成したことを特徴とする半田リフロー装置。 (2) 補助腕７ａ及び支持片４a1，４a2，４a3…
…，４b1，４b2，４b3……が、ガラス繊維にフ
ツ素樹脂又はカーボン入りフツ素樹脂を含浸さ
せた材料をもつて構成されていることを特徴と
する実用新案登録請求の範囲第１項記載の半田
リフロー装置。[Claims for Utility Model Registration] (1) Both ends of a printed circuit board are placed on a plurality of support plates attached to a pair of parallel-driven chain conveyors, and the solder paste on the printed circuit board is heated and melted. In a device for connecting a chip-shaped component to an electric circuit on a printed circuit board, support arms 3a 1 , each having a predetermined length are provided on the support plate.
3a 2 , 3a 3 ..., 3b 1 , 3b 2 , 3b 3 ... are attached, and the supporting arms 3a 1 , 3a 2 , 3a 3 ..., 3b 1 ,
Support pieces 4a 1 , 4a 2 , 4a 3 , which are made of a material with poor thermal conductivity and good heat absorption properties, with or without an auxiliary arm 7a at the tips of 3b 2 , 3b 3 , .
4b 1 , 4b 2 , 4b 3 ... are fixed, and the support piece 4
A solder reflow apparatus characterized in that both ends of a printed circuit board 5 are placed on the portions a 1 , 4a 2 , 4a 3 . . . , 4b 1 , 4b 2 , 4b 3 . (2) Auxiliary arm 7a and support pieces 4a 1 , 4a 2 , 4a 3 ...
..., 4b 1 , 4b 2 , 4b 3 ... is made of a material in which glass fiber is impregnated with fluororesin or carbon-containing fluororesin. The solder reflow apparatus according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12068184U JPS6136365U (en) | 1984-08-07 | 1984-08-07 | Solder reflow equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12068184U JPS6136365U (en) | 1984-08-07 | 1984-08-07 | Solder reflow equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6136365U JPS6136365U (en) | 1986-03-06 |
| JPH022535Y2 true JPH022535Y2 (en) | 1990-01-22 |
Family
ID=30679495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12068184U Granted JPS6136365U (en) | 1984-08-07 | 1984-08-07 | Solder reflow equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6136365U (en) |
-
1984
- 1984-08-07 JP JP12068184U patent/JPS6136365U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6136365U (en) | 1986-03-06 |
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