JPH079846Y2 - Guide rail mounting structure for transport mechanism - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a guide rail mounting structure in a transfer mechanism, and particularly to a reflow soldering method or the like applied as a surface mounting method for a component to a printed wiring board. The present invention relates to a guide rail mounting structure in a transport mechanism that can be preferably used in a heated atmosphere.

[Prior Art] The reflow soldering method is performed by previously supplying solder to a soldering portion and then welding the solder by using a heat source.

By the way, in recent years, the demand for miniaturization of electronic devices has become more prominent, and in response to such a tendency, chip parts have been used instead of leaded parts. Moreover, in order to increase the mounting density, a planar mounting method has been introduced as a chip mounting method, so that minute soldering points can be joined accurately and efficiently. As a result, the reflow soldering method has been adopted for soldering components to a printed wiring board.

By the way, in the case of soldering by the reflow soldering method, solder plating or cream solder is previously supplied to the soldering points on the printed wiring circuit conductor, and the chip parts are fixed and heated.

In this case, the chip parts are very small,
Since it is very difficult to mount this accurately and requires a high level of technology, a fixing method using the viscosity of cream solder is often used.

Such a reflow soldering method is usually carried in a furnace in which a printed wiring board having chip parts fixed by the above method is carried into a furnace in a heating atmosphere called a reflow furnace, and heated by a heat source provided in the furnace. It is performed by welding and carrying it out of the furnace.

FIG. 6 shows a conventional example of a guide rail structure which is arranged in the reflow furnace and which supports an endless conveying means such as a chain conveyor or a belt conveyor for loading and unloading a printed wiring board.

According to this guide rail structure, since the pair of guide rails 101, 102 arranged in parallel needs to be adjustable in width, one end of the guide rail 102 is provided with the movable plate 103 at the start end and the rear end thereof. The guide rail 101 on the other side is fixed to the fixed plate 104 by being supported and fixed via the guide rail 101.

A pair of guide rails supported and fixed in this way
Each of 101 and 102 is provided with an endless conveying means such as a chain belt or a belt conveyor (not shown), and along with the movement of the endless conveying means, the printed wiring board placed on the endless conveying means is carried into the furnace, and the predetermined It is designed to be carried out after the soldering work is completed.

[Problems to be Solved by the Invention] By the way, it is of course possible to convey a printed wiring board by the guide rail structure as the conventional example.

However, the temperature atmosphere in the furnace needs to be raised to a temperature sufficient to melt the solder, and the temperature at that time is usually required to be about 230 ° C. at the highest. Therefore, the guide rails 101, 102 made of stainless steel or the like are expanded by being heated, and moreover, because they are fixed, it is not possible to absorb the thermal expansion in the length direction, and the guide rails 101, 102 are left-right direction or Distortion occurs such that it becomes wavy in the vertical direction.

Such distortion results in variations in the width dimension between the endless conveying means interposed in the guide rails 101 and 102.

Therefore, a printed wiring board that must be smoothly transported through the endless transport means may be dropped from the endless transport means and scorched, or may be caught and damaged in the middle, or smooth transport may not be obtained. I had no choice but to face such a situation.

Further, among such inconveniences, there is also a device which copes with the dropout by additionally attaching a collecting means such as a belt conveyor under the endless conveying means. However, in this case, even if it can be recovered, the components mounted on the printed wiring board may be displaced or separated due to the impact when dropped, and it takes time to repair them or the device itself is structurally damaged. However, the new inconvenience was caused by the increase in complexity and cost increase.

The present invention has been made in view of the above-mentioned inconveniences of conventional guide rail structures, and an object of the present invention is to provide a guide that enables reliable and smooth conveyance of a conveyed object such as a printed wiring board while hot. To provide a rail structure.

[Means for Solving the Problems] The present invention has been made to solve the above problems, and will be described with reference to the drawings. The object to be conveyed with respect to the heating space formed in the apparatus main body 1 is as follows. A pair of guide rails 2, 2 arranged in parallel to support the endless transport means 25 for loading / unloading 26 are divided into a main guide part 3 and an auxiliary guide part 11, respectively, and connected with a gap t. The one end of the main guide portion 3 and the auxiliary guide portion 11 are
Side is allowed to move in the lengthwise direction through the long hole 18 provided in the connecting piece 15, and the side of the auxiliary guide portion 11 is fixedly fixed so that the connecting piece 15 connects with each other. ,
In addition, the structure is such that the other end of the main guide portion 3 is immovably fixedly supported on the device body 1 side via the connecting piece 15 and is fixedly supported on the device body 1 side. It has the above characteristics. Further, in this case, the connection side of the main guide portion 3 and the auxiliary guide portion 11 forming the guide rail 2 is the carry-out side of the object to be transported 26, and the other end side of the main guide portion 3 is the carry-in side. It is preferable to position them and to install them, and in each of the outer side portions of the main guide portion 3 constituting the guide rail 2, a vertical hole portion 7 and a horizontal hole portion 8 which are in a substantially inverted T shape and communicate with each other. It is desirable to provide a plurality of through holes 6 composed of and, and further to provide supporting projections 9 on the lower bottom surface of each for preventing bending.

[Operation] Therefore, according to the present invention, the pair of guide rails 2, 2
Is formed by one end of the main guide portion 3 and the auxiliary guide portion 11 which are connected with each other with a gap t, and the main guide portion 3 side is provided with a long hole 18 provided in the connecting piece 15 Since they are connected so that they can move in the length direction, even if the pair of guide rails 2 and 2 are thermally expanded, the connecting piece 15
On the other hand, the deformation can be absorbed by allowing the main guide portion 3 to move with the gap t as a limit. Therefore, the pair of guide rails 2, 2 can always maintain a constant parallel pitch, and the object 26 to be conveyed can be smoothly and smoothly via the endless conveying means 25 supported by these guide rails 2. It can be reliably transported.

Further, when the pair of guide rails 2 and 2 are provided with through holes 6 each having a vertical hole portion 7 and a horizontal hole portion 8 which are substantially T-shaped and communicate with each other, the heat radiation effect is further improved. In addition, when the supporting projection 9 is provided on the lower bottom surface, the downward bending of the guide rail 2 can be effectively prevented.

[Embodiment] An embodiment of the present invention will be described below in detail with reference to the drawings.

FIG. 1 and FIG. 2 show the outline of the entire structure as one embodiment when the guide rail mounting structure in the transport mechanism according to the present invention is applied to a reflow device for a printed wiring board. .

That is, the apparatus main body 1 which constitutes this reflow apparatus,
It has an operation panel P in which various switches S for operation are arranged on its front surface, and covers an object to be transferred 26, for example, a printed wiring board placed on a pair of endless transfer means 25, 25 such as a chain conveyor. It is formed so that it can be carried into the heating space defined by the section 30 and can be carried out after a predetermined soldering process is completed. The endless conveying means 25 is supported by a pair of guide rails 2, 2 arranged in the length direction of the apparatus main body 1, and the guide rail 2 on one side is operated by a handle 31. The distance between the fixed guide rail 2 and the fixed guide rail 2 on the other side can be changed and attached. In this case, the heating space formed in the apparatus main body 1 can be formed by only the heat source by far infrared rays or only by the heat source by hot air, but more preferably, the heat source by far infrared rays is used. It is preferable that a heat source of hot air is arranged above the transported object 26 and below the transported object 26 to form a combination.

FIG. 3 shows an example of a specific structure of the pair of guide rails 2, 2 incorporated in the apparatus body 1.

According to this, each of the pair of guide rails 2, 2 is
A main guide portion 3 having a required length, for example, made of an aluminum material, and an auxiliary guide portion having a length shorter than the main guide portion 3, for example, made of a stainless steel material. It is divided into 11 and 2.
Further, inside the main guide portion 3 and the auxiliary guide portion 11, a groove portion 5 for guiding the endless conveying means 25 such as a chain conveyor via bent portions 4 and 12 bent in an L shape. ,
13 are formed respectively.

Also, the main guide portion 3 and the auxiliary guide portion 11 forming the pair of guide rails 2 and 2 are separated from each other by a predetermined gap t, and the connecting piece 15 is positioned on the upper side thereof. They are screwed to each other via the holding portion 16 and are connected to each other.

In this case, the structure in which the connecting piece 15 is screwed to the end portion on one side of the main guide portion 3 has a structure in which the holding portion 16 of the connecting piece 15 is provided.
A screw 24 having an appropriate interposition material 21 such as a collar 22 and a washer 23 is provided on one side of the main guide portion 3 through one or more long holes 18 which are long in the horizontal direction. Screw hole
It is fixed so that it can move freely by tightening it with 10 screws.

Further, the screwing structure of the connecting piece 15 to the auxiliary guide portion 11 has a through hole formed in the holding portion 16 of the connecting piece 15.
A screw having an interposed material such as a washer (not shown) is tightened and screwed into a screw hole 14 provided on the side of the main guide portion 3 via 19 so as to be immovable and integrated. Fixed.

Further, below the connecting piece 15, there is provided a mounting portion 17 for tightening and screwing to a fixing member (not shown) of the apparatus body 1.

On the other hand, a fixing piece 27 is tightened by a screw 28 at the other end of the main guide portion 3, and a fixing member (not shown) of the apparatus main body 1 is inserted through the fixing piece 27. It is possible to integrally fix it under the immobile condition.

In addition, at an appropriate position on the outer side of the main guide portion 3,
As shown in FIG. 4, it is possible to provide a plurality of through-holes 6 each having a vertical hole portion 7 and a horizontal hole portion 8 and formed in a substantially inverted T shape for promoting heat dissipation. Providing the supporting protrusion 9 in advance at an appropriate position on the lower bottom surface of the main guide portion 3,
It is desirable to be able to prevent downward deflection.

The illustrated example shows the case where the auxiliary guide portion 11 is positioned on the carry-out side of the transported object 26 such as a printed wiring board, but if necessary, it may be positioned on the carry-in side. You can also do it.

Further, in the above-mentioned embodiment of the present invention, the case where the invention is applied to the carrying mechanism having the endless carrying means in the reflow soldering apparatus for the printed wiring board is explained as an example, but the carrying is carried through the endless carrying means. The transported object 26 is not limited to the printed wiring board described above, and may be applied to any type as long as it needs to be transported hot.

According to the present invention, the pair of guide rails 2, 2 are thus constituted by the main guide portion 3 and the auxiliary guide portion 11 which are connected to each other with a gap t at a predetermined interval. Since the end portion on one side is connected by allowing the free movement in the length direction through the long hole 18 provided in the connecting piece 15, even if it is thermally expanded, it is connected to the connecting piece 15. On the other hand, the deformation can be absorbed by allowing the main guide portion 3 to move with the gap t as a limit.

Therefore, the pair of guide rails 2 and 2 can always maintain a constant parallel pitch even in a heating atmosphere, and the guided rails 2 and 2 can be transported via the endless transport means 25 supported by the guide rails 2. The object 26 can be transported smoothly and reliably.

Further, when the pair of guide rails 2 and 2 are provided with through holes 6 each having a vertical hole portion 7 and a horizontal hole portion 8 which are substantially T-shaped and communicate with each other, the heat radiation effect is further improved. Can be improved and it can contribute to prevention of deformation.

Further, when the required number of supporting projections 9 are provided on the lower bottom surface of the pair of guide rails 2, 2, it is possible to effectively prevent downward deflection of these guide rails 2 due to their own weight, and endless conveyance The means 25 can be supported in a more favorable manner.

[Advantage of the Invention] As described above, according to the present invention, each of the pair of guide rails includes the main guide portion and the auxiliary guide portion that are connected to each other with a gap, and the main guide portion is Since the end portion on one side of the portion can be formed by freely moving in the length direction through a long hole provided in the connecting piece, the end portion on the length direction generated in the heating space can be formed. By absorbing the thermal expansion by the gap, it is possible to support the endless conveying means while always maintaining a constant parallel pitch. Therefore, the object to be conveyed placed and conveyed on the endless conveying means can be smoothly and surely transferred.

Further, when the guide rail is formed with a through hole consisting of a vertical hole portion and a horizontal hole portion which are in a substantially inverted T shape and communicate with each other, the heat radiation effect can be further improved. It is possible to more effectively prevent deformation due to thermal expansion.

Furthermore, when the lower surface of the guide rail is provided with a supporting protrusion, downward bending of the guide rail due to its own weight can be effectively prevented, and a more preferable supporting state of the endless conveying means can be secured. You can

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment when the present invention is applied to a reflow device. FIG. 2 is a front view of the reflow apparatus shown in FIG. FIG. 3 is an overall perspective view showing a configuration example of the guide rail according to the present invention. FIG. 4 is a vertical cross-sectional view of the guide rail shown in FIG. FIG. 5 is an enlarged view of a main part of the guide rail shown in FIG. FIG. 6 is an overall perspective view showing a guide rail as a conventional example. 1 ... Device body, 2 ... Guide rail, 3 ... Main guide part, 4 ... Bent part, 5 ... Groove part, 6 ... Through hole, 7 ... Vertical hole part, 8 ... Horizontal hole part, 9 …… Supporting protrusion, 10 …… Screw hole,
11 …… Auxiliary guide section, 12 …… Bending section, 13 …… Groove section, 14…
… Screw hole, 15 …… connecting piece, 16 …… holding part, 17 …… mounting part, 18 …… long hole, 19 …… through hole, 21 …… interposing material, 22 …… color, 23 …… washer , 24 …… screw, 25 …… endless transport means, 26 …… transported object, 27 …… fixing piece, 28 …… screw

Claims (4)

[Scope of utility model registration request] 1. A pair of guide rails, which are arranged in parallel to support an endless transport means for loading and unloading a transported object to and from a heating space formed in the main body of the apparatus, have a main guide portion and an auxiliary guide portion, respectively. The one end of the main guide portion and the auxiliary guide portion, which are divided and connected with each other with a gap, are free to move in the length direction on the main guide portion side through the long holes provided in the connecting piece. The side of the auxiliary guide portion is fixedly connected to each other by the connecting piece, and is fixedly supported on the side of the apparatus main body through the connecting piece, and the other side of the main guide portion The guide rail mounting structure in the transport mechanism is characterized in that the ends are fixedly supported on the side of the apparatus main body. 2. The connecting side of the main guide portion and the auxiliary guide portion forming the guide rail is located on the carry-out side of the transported object, and the other end side of the main guide portion is located on the carry-in side. The guide rail mounting structure in the transport mechanism according to claim 1, characterized in that. 3. A plurality of through holes each having a vertical hole portion and a horizontal hole portion, which have a substantially inverted T shape and communicate with each other, are provided on each of the outer side portions of the main guide portion constituting the guide rail. The guide rail mounting structure in the transport mechanism according to claim 1, wherein the guide rail mounting structure is provided. 4. The transport mechanism according to claim 1, wherein the pair of guide rails are provided with supporting projections on their lower bottom surfaces for preventing bending. Guide rail mounting structure.