JPH0226499A - Manufacture of piezoelectric diaphragm - Google Patents

Abstract

PURPOSE:To easily adhere a piezoelectric ceramic component and a metal plate even when the piezoelectric ceramic component is thinned by putting the hold metal plate on the piezoelectric ceramic component and making an adhesive penetrate between the metal plate and the piezoelectric ceramic component with adding the adhesive to the hole. CONSTITUTION:One or plural small holes 121 are holed on a metal plate 12, and it is put on a piezoelectric ceramic component 6 on a fixing tool 16 with positioning by sucking it with a vacuum chuck, for instance. Moreover, with a pressure tool 18, the both metal plate 12 and the piezoelectric ceramic component 6 are made adhered as much as possible with pressurizing between the metal plate 12 and the piezoelectric ceramic component 6. Then, when an adhesive 14 is added to the hole 121 of the metal plate 12, the adhesive 14 penetrates the gap between the metal plate 12 and the piezoelectric ceramic component 6 by the osmic pressure. After that, when the adhesive 14 is cured, since a purposing piezoelectric diaphragm is obtained, it is fetched from the fixing tool 16. Thus, even when the piezoelectric ceramic component 6 is thinned, the metal plate 12 can be adhered easily.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a piezoelectric diaphragm used for, for example, piezoelectric buzzers, piezoelectric speakers, and the like.

[Conventional technology]

Conventionally, this type of piezoelectric diaphragm is manufactured by applying an adhesive 4 to a predetermined area on a metal plate 2 larger than the piezoelectric ceramic element 6 by screen printing or the like, as shown in FIG. 2, for example.
The piezoelectric ceramic element 6 which has been suctioned and picked up by a vacuum chuck 8 is placed on top of the piezoelectric ceramic element 6, and the two are bonded together. Incidentally, the piezoelectric ceramic element 6 has electrodes 62 and 63 formed on both sides of a piezoelectric ceramic plate 61.

[Problems to be Solved by the Invention] However, the piezoelectric ceramic plate 6 of the piezoelectric ceramic element 6
The thickness of 1 used to be about 100 μm, but in recent years there has been a trend toward thinning, for example to 50 μm or less.
For this reason, the piezoelectric ceramic element 6 is easily broken and difficult to handle, and it has become difficult to suction the piezoelectric ceramic element 6 with the vacuum chunk 8 as described above, and new measures are required.

Therefore, an object of the present invention is to provide a method for manufacturing a piezoelectric diaphragm that solves these problems.

[Means to solve the problem]

In order to achieve the above object, the manufacturing method of the present invention includes, when manufacturing a piezoelectric diaphragm by bonding a metal plate and a plate-shaped piezoelectric ceramic element, placing a metal plate with holes on the piezoelectric ceramic element; The method is characterized in that an adhesive is applied to this hole and allowed to penetrate between the metal plate and the piezoelectric ceramic element.

[Effect]

When an adhesive is applied to the hole in the metal plate, the adhesive spreads the gap between the metal plate and the piezoelectric ceramic element due to its osmotic pressure, thereby bonding the two over a wide range.

Moreover, with this method, the metal plate that is easier to handle is placed on top of the piezoelectric ceramic element, so there is no need to apply force to the piezoelectric ceramic element using a vacuum chuck, etc. Therefore, even if the piezoelectric ceramic element becomes thinner, it is easier to handle the metal plate. can be easily glued.

〔Example〕

FIG. 1 is a diagram for explaining an example of a method for manufacturing a piezoelectric diaphragm according to the present invention.

In this embodiment, a fixing jig 16 is used, and the piezoelectric ceramic element 6 as described above is first conveyed and placed on it by, for example, a conveyor belt (not shown). put.

On the other hand, one or several holes 121 with a small diameter (for example, about 1.0 mmφ) are drilled in advance in the metal plate 12, and the holes 121 are suctioned with a vacuum chuck, etc., and then fixed with a fixing jig as shown in the illustrated example. It is positioned and placed on the piezoelectric ceramic element 6 on the piezoelectric ceramic element 16.

Furthermore, in this example, a pressure jig 18 is used to apply pressure between the metal plate 12 and the piezoelectric ceramic element 6 so that they are brought into close contact with each other as much as possible. The reason will be explained later.

Then, the adhesive 14 is applied to the hole 121 of the metal plate 12. As a result, the adhesive 14 spreads through the gap between the metal plate 12 and the piezoelectric ceramic element 6 due to its osmotic pressure.

In this case, in order to spread the adhesive 14 uniformly over a wide range, it is preferable to use a low viscosity adhesive (for example, about 50 to 250 cp) such as a liquid acrylic adhesive.

Further, it is preferable to apply pressure between the metal plate 12 and the piezoelectric ceramic element 6 as described above because it reduces the gap between the two and makes it easier for the adhesive 14 to spread uniformly.

Then, once the adhesive 14 has hardened, the desired piezoelectric diaphragm is obtained, so it is only necessary to take it out from the fixing jig 16.

As described above, in this method, contrary to the conventional case, the metal plate 12, which is easier to handle, is used as the piezoelectric ceramic element 6.
Since the piezoelectric ceramic element 6 is placed on top of the metal plate 12, there is no need to apply force to the piezoelectric ceramic element 6 using a vacuum chuck or the like. Therefore, even if the piezoelectric ceramic element 6 becomes thin, it is easy to separate it from the metal plate 12, that is, the piezoelectric ceramic element 6 can be easily broken. It can be bonded without causing any problems.

Note that the means for placing the piezoelectric ceramic element 6 on the fixing jig 16 is not necessarily limited to the conveyor belt as described above. Furthermore, although it is preferable to use the fixing jig 16 and the pressing jig 18 as described above for handling and adhering the piezoelectric ceramic element 6, they are not always required.

〔Effect of the invention〕

As described above, according to the present invention, the metal plate, which is easier to handle, is placed on top of the piezoelectric ceramic element and the two are bonded together, so there is no need to apply force to the piezoelectric ceramic element using a vacuum chuck, etc. Therefore, even if the piezoelectric ceramic element becomes thinner, it can be easily bonded to the metal plate.

[Brief explanation of the drawing]

FIG. 1 is a diagram for explaining an example of a method for manufacturing a piezoelectric diaphragm according to the present invention. FIG. 2 is a diagram for explaining an example of a conventional method for manufacturing a piezoelectric diaphragm. 6... Piezoelectric ceramic element, 12... Metal plate, 12
1...hole, 14...adhesive.

Claims (1)

[Claims] (1) When manufacturing a piezoelectric diaphragm by bonding a metal plate and a plate-shaped piezoelectric ceramic element, a metal plate with holes is placed on top of the piezoelectric ceramic element, and adhesive is applied to the holes. A method for manufacturing a piezoelectric diaphragm, characterized by infiltration between a metal plate and a piezoelectric ceramic element.