JPH02265221A - Manufacturing method of metal film resistor - Google Patents
Manufacturing method of metal film resistorInfo
- Publication number
- JPH02265221A JPH02265221A JP1086276A JP8627689A JPH02265221A JP H02265221 A JPH02265221 A JP H02265221A JP 1086276 A JP1086276 A JP 1086276A JP 8627689 A JP8627689 A JP 8627689A JP H02265221 A JPH02265221 A JP H02265221A
- Authority
- JP
- Japan
- Prior art keywords
- metal film
- resistor
- film resistor
- manufacturing
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は金属皮膜抵抗器の製造方法に関するものである
。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing metal film resistors.
（に来の技術
以下に従来の皮膜抵抗器の構成について説明する。第２
図は従来の金属皮膜抵抗器の断面図であり、１はアルミ
ナ基板、３はＮｉ−Ｃｒ層、４はＳｉＯ２のオーバーコ
ート層、５は絶縁膜、６は金属電極である。(The structure of a conventional film resistor will be explained below.
The figure is a cross-sectional view of a conventional metal film resistor, in which 1 is an alumina substrate, 3 is a Ni-Cr layer, 4 is an SiO2 overcoat layer, 5 is an insulating film, and 6 is a metal electrode.
発明が解決しようとする課題
しかしながら上記従来の（１４成では、温度、湿度等の
ストレスにλｊじ十分でな（、使用中に抵抗器としての
特性が劣化するこ七より高精度、高信頼性抵抗器の製造
が非常に困難である。Problems to be Solved by the Invention However, the above conventional (14-structure) is not sufficiently resistant to stress such as temperature and humidity, and its characteristics as a resistor deteriorate during use. Resistors are very difficult to manufacture.
本発明は上記従来の問題点を解決するもので、非常に高
精度で特性の劣化の著しく小さい高信頼性金属皮膜抵抗
器の製造方法を提供することを目的とする。The present invention solves the above-mentioned conventional problems, and aims to provide a method for manufacturing a highly reliable metal film resistor with very high precision and significantly less deterioration of characteristics.
課題を解決するための手段
この目的を達するために本発明の金属皮膜抵抗器は、抵
抗皮膜層を蒸着・スパッタリング等で形成したアルミナ
層により挟み込み、両面より抵抗皮膜層を保護すること
から構成されている。Means for Solving the Problems To achieve this object, the metal film resistor of the present invention is constructed by sandwiching a resistive film layer between alumina layers formed by vapor deposition, sputtering, etc., and protecting the resistive film layer from both sides. ing.
作用
この構成によって、特性の劣化が著しく小さい高精度、
高信頼性金属皮膜抵抗器を製造することができる。Function: This configuration provides high precision and extremely low deterioration of characteristics.
Highly reliable metal film resistors can be manufactured.
実施例
以下本発明の一実施例について、図面を参照しながら説
明する。EXAMPLE An example of the present invention will be described below with reference to the drawings.
Ｙ％１図は本発明の一実施例におＩＪる金属皮膜抵抗器
の断面図である。第１図において、■はアルミナ基板、
２は高周波スパッタリング方式により形成したアルミナ
の下層保護膜、３はスパッタリング方式により形成した
Ｎ ｉ −Ｃｒ抵抗体、４はスパッタリング方式により
形成したアルミナの上層保護膜、５は塗料による絶縁保
護膜、６は金属電極である。Figure Y%1 is a sectional view of a metal film resistor according to an embodiment of the present invention. In Figure 1, ■ is an alumina substrate,
2 is an alumina lower protective film formed by a high frequency sputtering method, 3 is a Ni-Cr resistor formed by a sputtering method, 4 is an alumina upper protective film formed by a sputtering method, 5 is an insulating protective film made of paint, 6 is a metal electrode.
以上の構成より成る本実施例の金属皮膜抵抗器と従来例
の構成より成る金属皮膜抵抗器を比較試験した結果を第
３図、第４図、第５図に示す。The results of a comparative test between the metal film resistor of this embodiment having the above structure and the metal film resistor having the conventional structure are shown in FIGS. 3, 4, and 5.
第３図は耐湿負荷寿命試験、第４図は負荷寿命試勢、第
５図は温度ザイクル試験である。ここでは、この３試験
についてしか述べないが、抵抗器に関する種１７の試験
についても格段の違いが見られた。Figure 3 shows the humidity resistance load life test, Figure 4 shows the load life test, and Figure 5 shows the temperature cycle test. Although I will only discuss these three tests here, there were also significant differences in the Class 17 tests related to resistors.
以りのように本実施例によれば、金属皮膜抵抗体をｊ′
ルミナの保護吸層で挟み込むことにより、抵抗体の特性
劣化が著しく小さい、高精度、高信頼性の金属皮Ｉｔ！
２抵抗器の製造を行なうことかできる。As described above, according to this embodiment, the metal film resistor is
By sandwiching it between Lumina's protective absorbing layers, the deterioration of the resistor's characteristics is extremely small, making it a highly accurate and highly reliable metal skin.
It is possible to manufacture two resistors.
なお、本実施例では、榎型抵抗器について述へたが、円
筒型抵抗器についても同様な効果が確認できた。In addition, in this example, although the Enoki type resistor was described, the same effect was confirmed also for the cylindrical type resistor.
発明の効果
本発明によれば、抵抗体の特性劣化か著シ、＜小さく、
高精度、高信頼性の金属皮膜抵抗器の製造を行なうこと
かできる。Effects of the Invention According to the present invention, the characteristic deterioration of the resistor is significantly reduced.
It is possible to manufacture metal film resistors with high precision and high reliability.
第１図は本発明の一実施例を示す断面図、第２図は従来
の皮膜抵抗器の断面図、第３図、第４図及び第５図は本
発明と従来例の抵抗器の特性を比較して示す特性図であ
る。
■・・・・・アルミナ基板、２・・・・・・下層保ｌψ
膜層、３・・・・Ｎｉ−Ｃｒ抵抗体層、４・・・・・上
行保護膜層、５・・・・・絶縁膜層、６・・・・・金属
電極。
代理人の氏名 弁理士 粟野重孝 はか１名第４図
講
図
恋 ２ 図
第５図
時頑
窮 ３ 図
１１請
サイ７ルFIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a sectional view of a conventional film resistor, and FIGS. 3, 4, and 5 are characteristics of resistors of the present invention and conventional examples. FIG. ■・・・Alumina substrate, 2・・・Lower layer protection lψ
Film layer, 3...Ni-Cr resistor layer, 4...Upper protection film layer, 5...Insulating film layer, 6...Metal electrode. Name of agent: Patent attorney Shigetaka Awano (1 person) Figure 4: Kozukoi 2 Figure 5: Jigonkyoku 3: Figure 11: 7
Claims (1)
皮膜層を形成し、さらにその抵抗皮膜層上に再度アルミ
ナ層を形成し、さらにアルミナ層上に両端電極部以外に
絶縁膜を形成し、さらに抵抗皮膜両端部に電極を形成す
ることを特徴とする金属皮膜抵抗器の製造方法。Form an alumina layer on the base material, form a resistive film layer on the alumina layer, form an alumina layer again on the resistive film layer, and then form an insulating film on the alumina layer other than the electrodes at both ends. A method for manufacturing a metal film resistor, further comprising forming electrodes at both ends of the resistance film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1086276A JPH02265221A (en) | 1989-04-05 | 1989-04-05 | Manufacturing method of metal film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1086276A JPH02265221A (en) | 1989-04-05 | 1989-04-05 | Manufacturing method of metal film resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02265221A true JPH02265221A (en) | 1990-10-30 |
Family
ID=13882304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1086276A Pending JPH02265221A (en) | 1989-04-05 | 1989-04-05 | Manufacturing method of metal film resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02265221A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017063126A (en) * | 2015-09-25 | 2017-03-30 | 三菱マテリアル株式会社 | Manufacturing method for resistor, and resistor |
| JP2022145501A (en) * | 2021-03-19 | 2022-10-04 | 禾伸堂企業股▲ふん▼有限公司 | High power resistor and manufacturing method thereof |
-
1989
- 1989-04-05 JP JP1086276A patent/JPH02265221A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017063126A (en) * | 2015-09-25 | 2017-03-30 | 三菱マテリアル株式会社 | Manufacturing method for resistor, and resistor |
| JP2022145501A (en) * | 2021-03-19 | 2022-10-04 | 禾伸堂企業股▲ふん▼有限公司 | High power resistor and manufacturing method thereof |
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