JPH02265706A - Ceramic substrate manufacturing method - Google Patents

Abstract

PURPOSE:To enable it to print to substrate patterns by providing identification tags for optical divisional groove position identification at the same time respectively upon performing divisional groove molding in X, Y directions on a ceramic substrate as being an electric element material. CONSTITUTION:Two through hole-shaped identification tags 5, 5' for confirming divisional grooves 6 of an X direction and the position to the Y direction of the divisional grooves 6 are die-worked by means of pins and the like together simultaneously with divisional grooves 6 on the pattern peripheral margin for the purpose of substrate crack prevention. And, two through hole-shaped identification tags 8, 8' for confirming divisional grooves 9 in Y direction and the position to the X direction thereof are die-worked together simultaneously with the divisional grooves 9 on the pattern peripheral margin for the purpose of substrate crack prevention. The position of the substrate patterns 11 enclosed with divisional grooves in both X, Y directions can be detected by confirming optionally the positions of these for identification tags 5, 5' and 8, 8'.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is particularly useful for printing and molding thick-film elements for a plurality of unit electronic components at once, and for example, when printing and molding thick-film elements for a plurality of unit electronic components at once, the present invention can be applied with extremely high accuracy in each area for unit electronic elements on a substrate. The present invention relates to a method of manufacturing a ceramic substrate in which thick film elements can be printed at certain positions.

Conventional technology Conventionally, thick film stamps using recognition marks for optical position confirmation.

BACKGROUND ART Board positioning techniques such as printing have been put into practical use, especially for large printed circuit boards, with the aim of achieving high precision. For example, as shown in FIG. 6, there is a method in which two recognition marks 2, 2 are added on the substrate 1, the positions of which are recognized optically, and the position of the substrate is controlled in the X, Y, and θ directions. Even in ceramic substrates,
Larger substrates and printed patterns! ! As ceramic substrates become thinner and more precise, the printing quality caused by the variation in shrinkage during firing, which is unique to ceramic substrates, is having a major impact on both yield and commercial value. Therefore, similar to the printed circuit board, it was considered to mold two perforated recognition marks 3, 3 into the local margin of the pattern for the purpose of preventing cracking of the board 1, as shown in FIG.

Problems that the invention aims to solve Such conventional methods have the following problems.

In other words, for ceramic substrates, the X direction and! The dividing grooves in the X direction cannot be molded at the same time, and there will be some degree of positional variation between the two processes.If the recognition mark is machined at the same time as the dividing groove in the X direction, the position of the dividing groove in the If the inner dividing groove is machined at the same time, the position of the X direction dividing groove cannot be guaranteed.

The present invention solves these problems, and devises a recognition mark to be applied to the substrate in order to absorb as much as possible the molding variations of the dividing grooves and the shrinkage variations during substrate firing, and to optically position the substrate. This is what I did.

Means for Solving the Problem In order to solve this problem, the present invention takes the following measures. In other words, when attempting to print multiple thick films at the same time by inserting V-shaped dividing grooves at equal intervals in the X and Y directions on a plate-shaped ceramic substrate, the ceramic substrate material placed in a semi-dry state is K at the same time as the dividing grooves in the X and Y directions to be molded, and G for optically confirming the position of the dividing grooves.
The markers are molded in positions that are close to each other.

The positions of the four recognition marks, which were molded twice in X and Y times, are molded at the same time as the dividing grooves for X and Y, so the positional relationship is fixed. Also, the positional relationship between the dividing groove and the recognition mark almost corresponds, so
By optically recognizing and positioning the above recognition mark,
It becomes possible to perform positioning while taking into account variations in shrinkage of each substrate and variations in the positional relationship of the dividing grooves in the X and Y directions, and the problem of recognizing the positional relationship of the dividing grooves in both the X and Y directions is solved.

EXAMPLE Hereinafter, an example of the present invention will be explained using a ceramic substrate which is a material of a chip resistor. FIG. 3 shows the substrate material 4
The dividing groove 6 in the X direction and the dividing groove 6! Two through-hole recognition marks 6 and 6' for confirming the position in the direction are molded with pins or the like at the same time as the dividing grooves 6 in the pattern local margins for the purpose of preventing board cracking. . Fig. 4 shows a dividing groove 9 in the Y direction in the substrate material 7 and two perforated recognition marks 8,8' for confirming the position of the dividing groove e in one direction for the purpose of preventing substrate cracking. The dividing groove 9 was formed simultaneously with the molding process on the peripheral margin of the pattern. Originally, Figures 3 and 4 were processed sequentially on the same substrate, and the one processed on the other side was the first one.
It is a diagram. By optically confirming the positions of these four recognition marks 6.5.8.8', the position of the substrate pattern 11 surrounded by the dividing grooves in both the pX and Y directions can be detected.

For example, there are the following position detection methods. That is, the recognition mark 5.5' is inserted into the X direction dividing groove 6 as shown in FIG.
The recognition marks 8 and 8' are inserted at the midpoint between the two end dividing grooves 6K and 6b, and the recognition marks 8 and 8' are placed at points equidistant from the two end dividing grooves 91L and eb of the Y direction dividing groove 9, respectively, as shown in FIG. put in. The centroid of the substrate pattern 11 is determined from these four recognition marks 5.5' and 8.8'. First, recognition mark 6,
6', and the centroid of the substrate pattern 110 is located on a straight line connecting the centers. Next, find the center of each of the recognition marks 8.8, and from the center of the line segment connecting them, the intersection of the line segment 6°d and a straight line drawn perpendicularly to that line segment is the intersection point of the line segment 6°d. It is the heart. Board pattern 11
The centroid of the print mask pattern 120 corresponding to the print mask pattern 120 can also be determined by inserting recognition marks 13, 13' when creating the print pattern as shown in FIG. Board pattern 1
Align the 10th centroid and the 120th centroid of the printed pattern, recognition mark 6
．． The substrate pattern 11 can be aligned with the printed pattern 12 by matching the inclination of the straight line connecting the centers of the marks 6' and the straight line connecting the centers of the recognition marks 13 and 13'. In addition, the ways to match the patterns are X, Y,
A θ table or the like is used.

Effects of the Invention As described above, according to this embodiment, when forming dividing grooves in the X and Y directions on a ceramic substrate, which is an electronic device material, a recognition mark for optically confirming the position of the dividing grooves can be provided at the same time. Therefore, it is possible to accurately print the substrate pattern, and it is also possible to minimize printing deviations caused by variations in the convergence rings of each ceramic substrate during firing. In addition, since each recognition mark is processed to a position that approaches each other, the positions of two recognition marks of the uR mark can be confirmed with an optical device at a time, so that the recognition time can be shortened.

[Brief explanation of drawings]

FIG. 1 is a plan view showing dividing grooves in both the X and Y directions and a recognition mark formed at the same time as the grooves in an embodiment of the present invention. FIG. 2 is a plan view of a pattern mask for thick film printing. The figure is a plan view showing the dividing grooves in one direction on the ceramic substrate material and the recognition marks formed at the same time as the grooves, and Figure 4 is the same! A plan view showing a direction dividing groove and a recognition mark formed at the same time as the groove, No. 6
FIG. 6 is an explanatory diagram of a conventional example. 4.7.10... Ceramic substrate material, a, a'
. 8.8'... Recognition mark, 6,9.11...
・Division groove, 12...Print pattern, 13.13
...Printed pattern recognition mark. Name of agent: Patent attorney Shigetaka Awano and 16 others

Claims (1)

[Claims] When trying to print multiple thick films at the same time by inserting V-shaped dividing grooves at equal intervals in the X and Y directions on a plate-shaped ceramic substrate, it was found that the ceramic substrate material that was placed in a semi-dry state was molded separately. A method for manufacturing a ceramic substrate, characterized in that, at the same time as the dividing grooves in the X and Y directions, recognition marks for optically confirming the positions of the dividing grooves are formed at positions close to each other.