JPH0226636Y2 - - Google Patents

Description

[Detailed description of the invention] Industrial application field This invention relates to a substrate with a cutting pattern.
In particular, it relates to improvements in the cutting pattern.

2. Description of the Related Art In general, as shown in FIG. 4, cutting lines are formed vertically and horizontally on a substrate 1 for electronic components to be cut at predetermined positions, which serves as a mark for positioning the aiming line of a microscope provided in a cutting machine. ing. This cutting line is straight and is formed at the same time as the electrode is formed on the substrate. FIG. 5 is an enlarged view of part A of the cutting line. The width d of cutting line 2 is usually 0.2
It is technically difficult to make it smaller than this, on the order of mm.

Therefore, the alignment between the aiming line 3 of the microscope provided in the cutting machine and the cutting line 2 is such that the aiming line 3 is placed within the width of the cutting line 2.

Problems to be solved by the invention: In alignment work, a sighting line 3 that is even thinner than the above-mentioned cutting line 2 is set within the cutting line 2, but if the width of the cutting line 2 is Since it is approximately 0.2 mm, it cannot be said that true positioning is performed, and there is a drawback that defects in the board shape are likely to occur frequently due to cutting misalignment. Furthermore, conventionally, the only way to align the aiming line 3 with the center position of the cutting line 2 is to rely on the operator's touch, which creates a problem in that the work is extremely difficult.

Therefore, it is an object of this invention to provide a substrate with a cutting pattern that can be cut with high precision and that can simplify the alignment work during cutting.

Means for Solving the Problems Therefore, in this invention, a cutting pattern is formed on a substrate by arranging a plurality of marks each having at least one straight side in a staggered manner so that each straight line side of each mark is aligned in a line.

In other words, in the cutting pattern described above, a cutting line with no width can be obtained by arranging the straight sides of each mark in a row, and the cutting line can be made by arranging the straight sides of each mark in a line, and the difference in shading between the areas with and without marks makes it possible to form a cutting line. can be made clear.

Embodiment Hereinafter, an embodiment of this invention will be described in detail with reference to the drawings. FIG. 1 is an explanatory diagram showing a cutting mark which is an embodiment of this invention.

The illustrated cutting pattern 10 is composed of a plurality of marks 11 made of aluminum, gold, or the like, and is formed, for example, at at least two corners of a substrate (not shown). This mark 11 is
It has a roughly square shape and is set to about 0.2 mm square. The plurality of marks 11 are arranged opposite to each other in an alternating manner so that each side forms a continuous straight line. This straight line becomes the cutting center line 12 and has no width. A set of alternating patterns allows line of sight setting to be performed from above or below the center line 12. On the other hand, although the color of each mark 11 varies depending on the material, it is preferable to use a color that clearly distinguishes it from the substrate. A normal photolithography technique is applied to form the cutting pattern 10.

By the way, this invention is based on a cutting pattern 1 consisting of a combination of marks 11 having at least one straight side.
If it is 0, it is not limited to the cutting mark 10 of the above embodiment, and cutting patterns 10a and 10b as shown in FIGS. 2 and 3 can also be considered, for example. In other words,
FIG. 2 shows a cutting pattern 10a consisting of triangular marks 11a, and FIG. 3 shows a cutting pattern 10b shaped like a substantially sinusoidal curve. Even if these cutting patterns 10a and 10b are used, the same effects as those of the above embodiment can be obtained. By changing the shape of the mark depending on the type of substrate, the type of substrate can be identified during the cutting process. Further, although the above example includes two or more sets of marks, it may be one set of marks arranged alternately.

Effects of the invention As explained in detail above, according to this invention, the center of the cutting pattern, that is, the cutting line, has no width and the center is made clear by each mark, making it easy to visually align the center with the aiming line of the cutting machine. The work becomes easier and the accuracy of alignment can be improved. As a result, the number of defective products due to cutting misalignment is significantly reduced compared to the conventional method.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing one embodiment of the cutting pattern according to this invention, FIG. 2 is an explanatory diagram showing another embodiment of the cutting pattern, and FIG. 3 is an explanatory diagram showing yet another embodiment of the cutting pattern. 4 is a plan view of a conventional substrate with a cutting pattern, and FIG. 5 is an enlarged view of portion A in FIG. 4. 10... Cutting pattern, 11... Mark, 12
...The center line of the cut.

Claims (1)

[Scope of utility model registration request] 1. A substrate with a cutting pattern, characterized in that the substrate is provided with a cutting pattern in which a plurality of marks, each of which has at least one straight side, are alternately arranged opposite each other so that each straight side is lined up in a row.