JPH0227267A - Measuring probe - Google Patents

Abstract

PURPOSE:To suppress the damage of an object to be measured or the deterioration of the characteristic thereof by using a shape memory alloy having the same transformation temp. as arbitrary measuring temp. as the material of a probe. CONSTITUTION:An electrode pad 3 is formed on the upper surface of the object 2 to be measured such as the semiconductor integrated circuit placed on a measuring table 1 and a probe 3 is made of a shape memory alloy having the same transformation temp. as arbitrary measuring temp. Therefore, the probe 4 is bent upwardly at room temp. and the leading end part thereof is separated from the object 2 to be measured. When the temp. of the probe 4 reaches certain measuring temp., the probe 4 generates transformation to be deformed gently as shown by an arrow A and is brought into contact with the pad 3 to be electrically connected thereto to perform measurement. Next, when the probe 4 is returned to a room temp. state, the leading end part of the probe 4 is separated from the pad 3 to finish measurement. As a result, the damage of the object 2 to be measured or the deterioration of the characteristic thereof is not generated by the load generated when the probe 4 is brought into contact with the pad 3 and the up-and-down moving mechanism of a measuring arm having the probe 4 mounted thereon becomes unnecessary.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a measurement probe used in various measuring instruments.

(Prior Art) Measuring probes have been indispensable in the field of measuring instruments and the like. This type of conventional measurement probe will be explained with reference to FIGS. 3(a) and 3(b). In the figure, measurement using a conventional measurement probe involves placing an object 2 on a measurement table 1, and attaching a needle-shaped measurement probe 4 to an electrode pad 3 formed on the upper surface of the object 2. This was done by lowering the measuring arm 5 attached to it in the direction of arrow A so that it was in contact with the electrical connection.

(Problem to be Solved by the Invention) However, the conventional measurement probe 4
There is a problem in that the load applied when contacting the upper electrode pad 3 may damage the object to be measured, resulting in deterioration of its characteristics, or in severe cases, destruction. Furthermore, there is also the problem that the object to be measured may be destroyed due to excessive current during measurement.

The present invention solves the above problems, and does not damage or deteriorate the characteristics of the measured object, does not destroy it even when an excessive current flows, does not require vertical movement of the measuring arm, and can be measured at any temperature. The present invention provides a measurement probe.

(Means for Solving the Problems) In order to solve the above problems, the present invention uses a shape memory alloy having the same transformation temperature as an arbitrary measurement temperature, or a shape memory alloy having the same transformation temperature as an arbitrary measurement temperature, as a material for a measurement probe. A combination of two or more types of shape memory alloys and shape memory alloys having different transformation temperatures is used. (Function) According to the above configuration, the measurement probe material does not come into contact with the object to be measured at room temperature; By using a shape memory alloy that undergoes transformation at a given measurement temperature and gently deforms as it comes into contact with the measured object, the measured object will not be damaged by the load when the measurement probe contacts the electrode pad. .

In addition, the characteristics do not deteriorate, much less break down, and a mechanism for moving the measuring arm up and down is not required when the measuring probe is attached. In addition, by combining several shape memory alloys of two or more types with different transformation temperatures and using a measurement probe that uses a shape memory alloy with a transformation temperature slightly higher than the arbitrary measurement temperature at the tip of the probe, it is possible to When a current flows, the tip portion deforms due to heat generation so as to separate from the electrode pad on the object to be measured, thereby preventing destruction of the object to be measured.

(Example) The first and second examples according to the present invention are
This will be explained with reference to the drawings and FIG. Note that the same parts as in the conventional example shown in FIG. 3 are given the same reference numerals and the explanation will be continued.

First, from FIGS. 1(a) and (b), the first
An example will be described. (a) In the figure.

An object to be measured 2 such as a semiconductor integrated circuit placed on a measurement table 1 has electrode pads 3 formed on its upper surface.

The measurement probe 4 is made of a shape memory alloy that has the same transformation temperature as the arbitrary measurement temperature, so it bends upward at room temperature, and the tip of the probe 4 is bent upward from the object 2 placed on the measurement table 1. is seperated. When the measured temperature reaches
(b) As shown in the figure, the measurement probe 4 undergoes metamorphosis.

As shown by arrow A, it gently deforms and comes into contact with the electrode pad 3, electrically connected, and measured. 6 Next, when the temperature is returned to room temperature, the tip of the measurement probe 4 separates from the electrode pad 3 and the measurement is performed. ends. Therefore.

The load applied when the measuring probe contacts the electrode pad 3 does not cause damage to the measured object 2 or deterioration of its characteristics, and there is no need for a vertical movement mechanism for the measuring arm 45 to which the measuring probe 4 is attached. Improved yield.

Automation can be promoted.

Next, according to FIG. 2(a) to c), the second embodiment of the present invention
An example will be described.

In the figure (a), an object to be measured 2 such as a semiconductor integrated circuit placed on a measurement table 1 has electrode pads 3 on its surface.
is formed. The measurement probe 6 is made of a combination of first and second shape memory alloy parts 6a and 6b, each having a transformation temperature T that is the same as an arbitrary measurement temperature, and a transformation temperature T that is slightly higher than the arbitrary measurement temperature. At room temperature, the first and second shape memory alloy parts 6a and 6b are bent, respectively, and are sufficiently separated from the electrode pad 3.

Next, the measurement temperature T at which the object to be measured 2 and the measurement probe 6 become
, as shown in Figure (b), the first
The shape memory alloy portion 6a is deformed as shown by the arrow B, and the measurement probe 6 and the electrode pad 3 are electrically connected and measured. (C) As shown in the figure, when an excessive current flows through the measurement probe 6 and the second shape memory alloy part 6b exceeds the transformation temperature T, the tip of the second shape memory alloy part 6b moves as shown by arrow C. It deforms away from the electrode pad 3.

Therefore, according to the second embodiment, in addition to the effects of the first embodiment, even if an excessive current flows during measurement, the electrical connection is broken due to heat generation, thereby preventing the object to be measured from being destroyed. It can be prevented.

Although this example used a measurement probe that combines shape memory alloys with two types of transformation temperatures, it is also possible to measure multiple measurement temperatures by combining shape memory alloys with three or more types of transformation temperatures. A measurement probe can also be produced.

(Effects of the Invention) As explained above, according to the present invention, the measurement probe can be brought into gentle contact with the electrode pad on the object to be measured at any measurement temperature and electrically connected. It does not damage the object to be measured or cause deterioration of its characteristics, and it also eliminates the need for a vertical movement mechanism for the measurement arm to which the measurement probe is attached, improving yield and promoting measurement automation. can do.

Also,? lI! A measuring probe that does not destroy the object to be measured even if an excessive current flows during measurement can be obtained.

[Brief explanation of the drawing]

FIGS. 1(a) and 1(b) are side views illustrating the operation of a measurement probe according to a first embodiment of the present invention. 2(a) to 2(c) are side views explaining the operation of the measurement probe of the second embodiment of the present invention, and FIG. 3(a)
) and (b) are side views showing a measurement process using a conventional needle-like measurement probe. 1...Measurement table, 2...Object to be measured, 3...
・Electrode pad, 4, 6...Measurement probe. Measuring arm, 6a... First shape memory alloy part,
6b...Second shape memory alloy part. Patent applicant: Matsushita Electric Rail Industry Co., Ltd. Figure (b)

Claims (2)

[Claims] (1) A measurement probe made of a shape memory alloy that does not make contact with the object to be measured at room temperature, but deforms so as to come into contact with the object to be measured at the same transformation temperature as the arbitrary measurement temperature. (2) The measuring probe according to claim (1), comprising a combination of two or more shape memory alloys having different transformation temperatures.