JPS6362343A - Probe card - Google Patents

Probe card

Info

Publication number
JPS6362343A
JPS6362343A JP20817386A JP20817386A JPS6362343A JP S6362343 A JPS6362343 A JP S6362343A JP 20817386 A JP20817386 A JP 20817386A JP 20817386 A JP20817386 A JP 20817386A JP S6362343 A JPS6362343 A JP S6362343A
Authority
JP
Japan
Prior art keywords
fixed
arm
tip part
probe card
shaped arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20817386A
Other languages
Japanese (ja)
Inventor
Hiroshi Nakao
浩士 中尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP20817386A priority Critical patent/JPS6362343A/en
Publication of JPS6362343A publication Critical patent/JPS6362343A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

PURPOSE:To prevent displacement of a contact point, by providing a probing needle which comprises a fixed part mounted securely on a printed board, an L-shaped arm having one end connected securely to the fixing point, and a tip part connected securely to the other end of the arm and protruding downward. CONSTITUTION:A probing needle 10 is composed of the following parts: a fixed part 3, which is fixed to a printed board 1 and connected to a conductor wire by way of through hole and the like; an L-shaped arm, whose one end is fixed to the fixing part 3; and a tip part 5, which is fixed to the other end of the arm and protrudes downward. When the tip part 5 is brought into contact with the electrode of a semiconductor element at a specified needle pressure, the pressure applied on the tip part 5 is absorbed mainly by the elasticity of the L-shaped arm 4. Therefore, the tip part 5 may moved vertically, but will not deviate horizontally. This allows the electrodes on a semiconductor element to be made small.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はプローブ・カードに関し、特にプローブ・カー
ドのプロービング針に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a probe card, and more particularly to a probing needle of a probe card.

〔従来の技術〕[Conventional technology]

従来、半導体ウェーハに複数個の半導体素子を形成した
後、半導体素子を個々に分離する半導体装置の製造工程
において、半導体素子の電気的特性は半導体ウェーハの
状態のままで測定するのが一般的である。このとき、半
導体素子の電気的特性の測定にプローブ・カードを接続
したテスタが用いられている。
Conventionally, in the manufacturing process of semiconductor devices in which multiple semiconductor elements are formed on a semiconductor wafer and then separated into individual semiconductor elements, it is common to measure the electrical characteristics of the semiconductor elements in the semiconductor wafer state. be. At this time, a tester to which a probe card is connected is used to measure the electrical characteristics of the semiconductor element.

このプローブ・カードは第2図に示すように、プリント
板1のほぼ中央部に形成された開口部2と、この開口部
の周辺部に一端が固定され、他端が中央部に向う複数本
のプロービング針10Aと、このプロービング針に接続
しプリント板に形成された導線(図示せず)等から構成
されている。そして、上記のプローブ・カードをその片
面が半導体ウェーハの表面に対応している状態で半導体
ウェーハに近接させ、半導体ウェーハ内の一個の半導体
素子上に形成された各電極に複数本のプロービング針を
適当な圧力をもって接触させ、半導体装置の電気的特性
の測定をおこなう。
As shown in FIG. 2, this probe card has an opening 2 formed almost in the center of a printed board 1, and a plurality of probes with one end fixed around the opening and the other end facing the center. The probing needle 10A is composed of a conductive wire (not shown) connected to the probing needle and formed on a printed board. Then, the probe card is brought close to the semiconductor wafer with one side corresponding to the surface of the semiconductor wafer, and a plurality of probing needles are applied to each electrode formed on one semiconductor element within the semiconductor wafer. The electrical characteristics of the semiconductor device are measured by making contact with appropriate pressure.

従来のプローブ・カードに固定されたプロービング針1
0Aは、第2図に示したように、プリント板1に接続さ
れる固定部3Aからアーム4Aは中央の下方向にまっす
ぐのび、そ″の先端に半導体素子の電極に接触する先端
部5Aが固定された構成となっていた。
Probing needle 1 fixed on a conventional probe card
0A, as shown in FIG. 2, an arm 4A extends straight down the center from a fixed part 3A connected to the printed circuit board 1, and has a tip 5A at its tip that contacts the electrode of the semiconductor element. It had a fixed configuration.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来のプローブ・カードでは、プロービング針
10Aが半導体素子6の電極に対し適当な圧力が加わる
ようにプローブ・カードと半導体素子の間隔を狭めた場
合、プロービング針10Aは第2図に点線で示したよう
に、圧力がかかる以前の位置に対して距離Wだけ位置が
ずれる。
In the conventional probe card described above, when the distance between the probe card and the semiconductor element is narrowed so that the probing needle 10A applies an appropriate pressure to the electrode of the semiconductor element 6, the probing needle 10A becomes as shown by the dotted line in FIG. As shown, the position is shifted by a distance W from the position before the pressure was applied.

このため、従来のプローブ・カードを用いて電気的特性
を測定する半導体装置では電極面積を、この位置ずれを
みこんで大きくしなければならず、このため半導体装置
自身の面積も大きくなるという問題点がある。
For this reason, in semiconductor devices whose electrical characteristics are measured using conventional probe cards, the area of the electrodes must be increased to account for this positional shift, which poses the problem of increasing the area of the semiconductor device itself. There is.

本発明の目的は、電極に接触させた場合プロービング針
の接触点の位置ずれを生じることのないプローブ・カー
ドを提供することにある。
An object of the present invention is to provide a probe card that does not cause displacement of the contact point of a probing needle when brought into contact with an electrode.

〔問題点を解決するための手段〕[Means for solving problems]

本発明のプローブ・カードは、プリント基板に設けられ
た開口部と、この開口部の周辺部に一端が固定され他端
が開口部中央の下方向に延在する複数のプロービング針
とを有するプローブ・カードであって、前記プロービン
グ針は、前記プリント基板に固定される固定部と、この
固定部に一端が固定されたL字状のアームとこのアーム
の他端に固定され下側に突出した先端部とから構成され
ているものである。
The probe card of the present invention has an opening provided in a printed circuit board, and a plurality of probing needles having one end fixed to the periphery of the opening and the other end extending downward from the center of the opening. - The probing needle is a card, and the probing needle includes a fixed part fixed to the printed circuit board, an L-shaped arm having one end fixed to the fixed part, and fixed to the other end of the arm and protruding downward. It consists of a tip.

〔実施例〕〔Example〕

次に、本発明の実施例について図面を用いて説明する。 Next, embodiments of the present invention will be described using the drawings.

第1図は本発明の一実施例の断面図である。FIG. 1 is a sectional view of an embodiment of the present invention.

第1図において、導線(図示せず)が形成されたプリン
ト基板1には開口部2が設けられており、この開口部2
の周辺には、開口部の周辺に一端がはんだ等により固定
され、他端が開口部2の中央下方に延在するタングステ
ン等からなる複数のプロービング針が設けられている。
In FIG. 1, an opening 2 is provided in a printed circuit board 1 on which conductive wires (not shown) are formed.
A plurality of probing needles made of tungsten or the like are provided around the opening 2, with one end fixed by solder or the like around the opening and the other end extending below the center of the opening 2.

そしてこのプロービング針10は、プリント基板1に固
され、導線とスルーホール等により接続される固定部3
と、この固定部3に一端が固定されたL字状のアーム4
と、このアーム4の他端に固定され下側に突出した先端
部5とから構成されている。
This probing needle 10 is fixed to the printed circuit board 1 and connected to a fixed part 3 by a conductor and a through hole.
and an L-shaped arm 4 whose one end is fixed to this fixed part 3.
and a tip portion 5 fixed to the other end of the arm 4 and protruding downward.

このように構成された本実施例においては、先端部5が
半導体素子の電極に所定の針圧で接触した場合、先端部
5に加わる圧力は、主にL字状のアーム4における弾性
により吸収される為、先端部5は単に上下方向にのみ移
動するだけであり、第2図に示した従来のプロービング
針の場合のように、横方向への位置ずれを起すことはな
くなる。
In this embodiment configured in this manner, when the tip 5 contacts the electrode of the semiconductor element with a predetermined stylus pressure, the pressure applied to the tip 5 is mainly absorbed by the elasticity of the L-shaped arm 4. Therefore, the tip 5 only moves in the vertical direction, and does not shift in the lateral direction as in the case of the conventional probing needle shown in FIG.

従って、半導体素子に形成する電極の面積を小さくする
ことができる。
Therefore, the area of the electrode formed on the semiconductor element can be reduced.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、プロービング針を、プリ
ント基板に固定される固定部と、この固定部に一端が固
定されたL字状のアームと、このアームの他端に固定さ
れ下側に突出した先端部とから構成することにより、プ
ロービング針を半導体素子の電極に接触させた場合、接
触点の位置ずれが生じないという効果がある。
As explained above, the present invention includes a probing needle that includes a fixed part fixed to a printed circuit board, an L-shaped arm fixed at one end to the fixed part, and a lower end fixed to the other end of the arm. By having a protruding tip, when the probing needle is brought into contact with an electrode of a semiconductor element, there is an effect that the position of the contact point does not shift.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例の断面図、第2図は従来のプ
ローブ・カードの断面図である。
FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is a sectional view of a conventional probe card.

Claims (1)

【特許請求の範囲】[Claims] プリント基板に設けられた開口部と、該開口部の周辺部
に一端が固定され他端が開口部中央の下方向に延在する
複数のプロービング針とを有するプローブ・カードにお
いて、前記プロービング針は前記プリント基板に固定さ
れる固定部と、該固定部に一端が固定されたL字状のア
ームと、該アームの他端に固定され下側に突出した先端
部とから構成されていることを特徴とするプローブ・カ
ード。
In a probe card having an opening provided in a printed circuit board and a plurality of probing needles having one end fixed to the periphery of the opening and the other end extending downward from the center of the opening, the probing needles include: It is composed of a fixing part fixed to the printed circuit board, an L-shaped arm having one end fixed to the fixing part, and a tip part fixed to the other end of the arm and protruding downward. Features a probe card.
JP20817386A 1986-09-03 1986-09-03 Probe card Pending JPS6362343A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20817386A JPS6362343A (en) 1986-09-03 1986-09-03 Probe card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20817386A JPS6362343A (en) 1986-09-03 1986-09-03 Probe card

Publications (1)

Publication Number Publication Date
JPS6362343A true JPS6362343A (en) 1988-03-18

Family

ID=16551868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20817386A Pending JPS6362343A (en) 1986-09-03 1986-09-03 Probe card

Country Status (1)

Country Link
JP (1) JPS6362343A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0470746U (en) * 1990-10-30 1992-06-23
US6475822B2 (en) 1993-11-16 2002-11-05 Formfactor, Inc. Method of making microelectronic contact structures
US7063541B2 (en) 1997-03-17 2006-06-20 Formfactor, Inc. Composite microelectronic spring structure and method for making same
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US7189077B1 (en) 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours
US7714235B1 (en) 1997-05-06 2010-05-11 Formfactor, Inc. Lithographically defined microelectronic contact structures

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0470746U (en) * 1990-10-30 1992-06-23
US6475822B2 (en) 1993-11-16 2002-11-05 Formfactor, Inc. Method of making microelectronic contact structures
US6482013B2 (en) 1993-11-16 2002-11-19 Formfactor, Inc. Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US7063541B2 (en) 1997-03-17 2006-06-20 Formfactor, Inc. Composite microelectronic spring structure and method for making same
US7714235B1 (en) 1997-05-06 2010-05-11 Formfactor, Inc. Lithographically defined microelectronic contact structures
US7189077B1 (en) 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours
US7524194B2 (en) 1999-07-30 2009-04-28 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours

Similar Documents

Publication Publication Date Title
JP2519737B2 (en) Probe card
JPH0529406A (en) Semiconductor inspection equipment
JPS6362343A (en) Probe card
JPS612338A (en) Inspection equipment
JP4486248B2 (en) Probe card and manufacturing method thereof
JPS58197835A (en) Prober
JPS6080772A (en) Probe needle
JPS6043664B2 (en) semiconductor equipment
JPH06163655A (en) Probe card
JP2635054B2 (en) Probing card
JPH06308163A (en) Probe device
JPS63128264A (en) Probe card
JPH03191543A (en) Probe card
JPS62276846A (en) probe device
JPH0523537U (en) Probe card
JP3172305B2 (en) Method for manufacturing semiconductor device
JPS6225433A (en) Semiconductor element characteristic measuring device
JPH0547866A (en) Probe card for IC chip test
JPH03108350A (en) Measuring jig
JPH0621025Y2 (en) Probe card that measures two adjacent chips simultaneously
JPH10185955A (en) Inspection head
JPH04266042A (en) Probe card
JPS6228783Y2 (en)
JPH08250624A (en) Semiconductor device and manufacturing method thereof
JPH0618559A (en) Probe card