JPH0227572Y2 - - Google Patents
Info
- Publication number
- JPH0227572Y2 JPH0227572Y2 JP7418584U JP7418584U JPH0227572Y2 JP H0227572 Y2 JPH0227572 Y2 JP H0227572Y2 JP 7418584 U JP7418584 U JP 7418584U JP 7418584 U JP7418584 U JP 7418584U JP H0227572 Y2 JPH0227572 Y2 JP H0227572Y2
- Authority
- JP
- Japan
- Prior art keywords
- reinforcing
- foil
- wiring board
- reinforcing foil
- fpc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011888 foil Substances 0.000 claims description 31
- 230000003014 reinforcing effect Effects 0.000 claims description 31
- 230000007423 decrease Effects 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000002985 plastic film Substances 0.000 claims 1
- 229920006255 plastic film Polymers 0.000 claims 1
- 239000010408 film Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
この考案は、機械的強度の向上を図つたフレキ
シブルプリント配線板(以下、FPCという)に
関する。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a flexible printed wiring board (hereinafter referred to as FPC) with improved mechanical strength.
周知のとおり、FPCはポリイミドフイルム、
ポリエステルフイルムなど絶縁性と可撓性を併せ
持つ薄いベースフイルムの表面に、導電性の材料
(現状では主として銅箔)で配線パターンを固着
して形成したもので、実装スペースの節約や信頼
性の向上に役立ち、コンピユータ関連機器、オー
デイオ製品、通信機器等に広く利用されている。 As is well known, FPC is a polyimide film,
A wiring pattern is formed by fixing a conductive material (currently mainly copper foil) onto the surface of a thin base film such as polyester film that is both insulating and flexible, saving mounting space and improving reliability. It is widely used in computer-related equipment, audio products, communication equipment, etc.
FPCは、その本質的な材料構成上薄いベース
フイルムを使用しているため、機械的な外力に対
して弱く、特にポリイミドフイルムを使用した場
合には裂け易いという欠点がある。また、FPC
はその使用される目的から非常に複雑な形状にな
り、これにかかる外力も多様なものとなる。特に
第1図イ,ロに示すような、平面L字状またはU
字状のFPCにおいては、一部に応力が集中し易
く裂け易い。すなわち、第1図イは平面L字状、
同図ロは平面U字状のベースフイルム1上に配線
パターン2を形成したFPCであるが、これらの
コーナ部3には応力が集中し、裂け易くなる。
Because FPC uses a thin base film due to its essential material composition, it is vulnerable to external mechanical forces and has the disadvantage of being easily torn, especially when polyimide film is used. Also, FPC
Because of the purpose for which it is used, it has a very complex shape, and the external forces that are applied to it vary. In particular, L-shaped or U-shaped planes as shown in Figure 1 A and B
In a letter-shaped FPC, stress tends to concentrate in one part, making it easy to tear. In other words, Fig. 1A is L-shaped in plan,
FIG. 4B shows an FPC in which a wiring pattern 2 is formed on a base film 1 having a planar U-shape. Stress is concentrated in these corner portions 3, making them easy to tear.
このような裂け易い部分を保護する従来の方法
として、第2図イ,ロに示すようにコーナ部3に
補強箔4を残しておく方法がある。すなわち、コ
ーナ部3の内周縁部上に、形状略L字状またはU
字状で一定の幅を有する補強箔を形成し、これに
よつてコーナ部3の亀裂を防止しようとするもの
である。 As a conventional method for protecting such easily tearable parts, there is a method of leaving reinforcing foil 4 on the corner part 3, as shown in FIG. 2A and B. That is, on the inner peripheral edge of the corner part 3, there is a substantially L-shaped or U-shaped shape.
The purpose is to form a reinforcing foil having a letter shape and a constant width, thereby preventing cracks in the corner portions 3.
このような方法によれば、コーナ部3の強度は
大幅に向上するものの、補強箔4の両端部4a,
4a近傍に応力が集中し易く、第1図イ,ロに破
線で示すような亀裂5が発生し易くなる欠点があ
つた。 According to such a method, although the strength of the corner portion 3 is greatly improved, both ends 4a of the reinforcing foil 4,
There was a drawback that stress tends to concentrate near 4a, and cracks 5 as shown by broken lines in FIG. 1A and B are likely to occur.
この考案は、上記の事情に鑑み、コーナ部の亀
裂発生を防止し、全体の機械的強度の向上を図つ
たFPCを提供することを目的とする。
In view of the above-mentioned circumstances, the purpose of this invention is to provide an FPC that prevents cracks from occurring at the corners and improves the overall mechanical strength.
前記目的を達成するために、本考案は、補強箔
の形状を変え、その両端に向うに従つて幅が漸減
する構造としたことを要旨とする。
In order to achieve the above object, the gist of the present invention is to change the shape of the reinforcing foil and create a structure in which the width gradually decreases toward both ends.
以下、図面に基づいて本考案の実施例を説明す
る。
Embodiments of the present invention will be described below based on the drawings.
第3図は、本考案の一実施例の要部の構成を示
す平面図で、同図イ,ロは、各々第2図イ,ロに
対応するものである。第3図に示す本実施例が、
第2図に示す従来のFPCと異なる点は、補強箔
の形状である。すなわち、第3図イの補強箔6、
同図ロの補強箔7は、各々両端部6a,6a,7
a,7aに向うに従つて幅が漸減し、この結果、
補強箔6は先細りのV字状形、補強箔7は先細り
のU字状形の構造になつている。 FIG. 3 is a plan view showing the configuration of essential parts of an embodiment of the present invention, and A and B in the same figure correspond to A and B in FIG. 2, respectively. The present embodiment shown in FIG.
The difference from the conventional FPC shown in FIG. 2 is the shape of the reinforcing foil. That is, the reinforcing foil 6 in FIG. 3A,
The reinforcing foil 7 shown in FIG.
The width gradually decreases toward a and 7a, and as a result,
The reinforcing foil 6 has a tapered V-shaped structure, and the reinforcing foil 7 has a tapered U-shaped structure.
このような構造によれば、コーナ部3の補強が
十分に行われるとともに、両端部6a,7aに応
力の集中することがなく、これらの箇所で亀裂が
生じるのを防止することができる。 According to such a structure, the corner portion 3 is sufficiently reinforced, stress is not concentrated on both end portions 6a and 7a, and cracks can be prevented from occurring at these locations.
次に、第4図は両面FPCに本考案を適用した
場合の実施例であり、同図イ,ロは表補強箔8
a,9aと裏補強箔8b,9bとの形状を別異と
した場合、同図ハ,ニは表補強箔10a,11a
と裏補強箔10b,11bとの形成位置をずらし
た場合の実施例である。 Next, Fig. 4 shows an example in which the present invention is applied to a double-sided FPC, and Fig. 4 shows an example in which the present invention is applied to a double-sided FPC.
When the shapes of a and 9a and the back reinforcing foils 8b and 9b are different, C and D in the figure are the front reinforcing foils 10a and 11a.
This is an example in which the formation positions of the back reinforcing foils 10b and 11b are shifted.
すなわち、同図イにおいては、裏補強箔8bが
表補強箔8aより一回り大きいV字状形の銅箔か
らなり、同図ロにおいては、裏補強箔9bが表補
強箔9aより幅広の銅箔からなつている。一方、
同図ハ,ニにおいては、非対称の形状の補強箔1
0aと10b,11aと11bを相互にずらして
表裏両面に形成してある。 That is, in the figure A, the back reinforcing foil 8b is made of a V-shaped copper foil that is one size larger than the front reinforcing foil 8a, and in the same figure B, the back reinforcing foil 9b is made of copper foil that is wider than the front reinforcing foil 9a. Made of foil. on the other hand,
In C and D of the same figure, an asymmetrical reinforcing foil 1 is shown.
0a and 10b, and 11a and 11b are formed on both the front and back surfaces so as to be offset from each other.
このような構成によれば、補強箔が両面に形成
されるのでコーナ部3の強度がさらに強化される
とともに、補強の強さがコーナ部3から遠ざかる
に従つて漸減するので、コーナ部3にかかる応力
が分散され、亀裂を防止することができる。 According to such a configuration, since the reinforcing foil is formed on both sides, the strength of the corner portion 3 is further strengthened, and the reinforcement strength gradually decreases as the distance from the corner portion 3 increases. Such stress is dispersed and cracks can be prevented.
なお、上記各実施例において、補強箔6,7,
8a,8b,9a,9b,10a,10b,11
a,11bをカバーレイフイルムで覆うことも可
能である。これによつて、補強度と応力の分散と
をより一層推し進めることができ、亀裂防止の効
果をさらに高めることができる。 In addition, in each of the above embodiments, the reinforcing foils 6, 7,
8a, 8b, 9a, 9b, 10a, 10b, 11
It is also possible to cover a and 11b with a coverlay film. Thereby, the degree of reinforcement and stress distribution can be further improved, and the effect of preventing cracks can be further enhanced.
また、前記補強箔6〜11bの代りに、同様の
形状の薄い絶縁フイルムをコーナ部3に貼着する
ことによつても同様の作用効果を得ることができ
る。すなわち、ポリエステルフイルム、ポリイミ
ドフイルム、ポリエチレンフイルム、ポリプロピ
レンフイルム、ポリ塩化ビニルフイルム、紙など
を前記補強箔6〜11bと同様の形状に切断し、
これらを適当な接着剤あるいは粘着剤によつてコ
ーナ部3に貼着する。このような構成は、FPC
上の回路密度が高く、補強箔を設ける余裕のない
ときに特に有効である。なぜならば、これら絶縁
フイルムによる補強膜は、配線パターンの上に貼
着することができるからである。 Moreover, the same effect can be obtained by attaching a thin insulating film having a similar shape to the corner portion 3 instead of the reinforcing foils 6 to 11b. That is, polyester film, polyimide film, polyethylene film, polypropylene film, polyvinyl chloride film, paper, etc. are cut into the same shape as the reinforcing foils 6 to 11b,
These are adhered to the corner portion 3 using a suitable adhesive or adhesive. Such a configuration is an FPC
This is particularly effective when the circuit density is high and there is no room for reinforcing foil. This is because the reinforcing film made of these insulating films can be adhered onto the wiring pattern.
以上説明したように、この考案は、両端部に向
うに従つて幅の漸減する補強箔または補強膜を、
FPCのコーナ部表面に形成したので、コーナ部
の特定箇所に応力が集中するのを避けることがで
き、これによつてコーナ部の亀裂を防止すること
ができる。
As explained above, this invention uses reinforcing foil or reinforcing membrane whose width gradually decreases toward both ends.
Since it is formed on the surface of the corner part of the FPC, it is possible to avoid concentration of stress on a specific part of the corner part, thereby preventing cracks in the corner part.
第1図はコーナ部を有するFPCの一従来例を
示す平面図、第2図はコーナ部に設けられた補強
箔の従来例を示す平面図、第3図イ,ロおよび第
4図イ〜ニは本考案の一実施例の要部の構成を示
す平面図である。
3……コーナ部、6,7,8a,8b,9a,
9b,10a,10b,11a,11b……補強
箔。
Fig. 1 is a plan view showing a conventional example of an FPC having a corner portion, Fig. 2 is a plan view showing a conventional example of reinforcing foil provided at the corner portion, Fig. 3 A, B, and Fig. 4 I-- D is a plan view showing the configuration of essential parts of an embodiment of the present invention. 3... Corner part, 6, 7, 8a, 8b, 9a,
9b, 10a, 10b, 11a, 11b...Reinforcement foil.
Claims (1)
プリント配線板において、前記補強箔は両端部
に向うに従つて幅が漸減する形状を有すること
を特徴とするフレキシブルプリント配線板。 (2) 前記形状の補強箔が表裏両面に形成されたこ
とを特徴とする実用新案登録請求の範囲第1項
記載のフレキシブルプリント配線板。 (3) 前記表裏両面に形成された補強箔の形状が別
異であるか、および/または形成位置が相互に
ずれていることを特徴とする実用新案登録請求
の範囲第2項記載のフレキシブルプリント配線
板。 (4) 前記補強箔に代えて同形状のプラスチツクフ
イルムまたは紙を用いたことを特徴とする実用
新案登録請求の範囲第1項ないし第3項いずれ
かの項記載のフレキシブルプリント配線板。[Claims for Utility Model Registration] (1) A flexible printed wiring board having a reinforcing foil on the surface of a corner portion, wherein the reinforcing foil has a shape whose width gradually decreases toward both ends. wiring board. (2) The flexible printed wiring board according to claim 1, wherein the reinforcing foil having the shape described above is formed on both the front and back surfaces. (3) The flexible print according to claim 2 of the utility model registration claim, characterized in that the shapes of the reinforcing foils formed on both the front and back surfaces are different and/or the formation positions are shifted from each other. wiring board. (4) The flexible printed wiring board according to any one of claims 1 to 3 of the claims registered as a utility model, characterized in that a plastic film or paper of the same shape is used in place of the reinforcing foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7418584U JPS60187551U (en) | 1984-05-21 | 1984-05-21 | flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7418584U JPS60187551U (en) | 1984-05-21 | 1984-05-21 | flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60187551U JPS60187551U (en) | 1985-12-12 |
| JPH0227572Y2 true JPH0227572Y2 (en) | 1990-07-25 |
Family
ID=30614245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7418584U Granted JPS60187551U (en) | 1984-05-21 | 1984-05-21 | flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60187551U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016006829A (en) * | 2014-06-20 | 2016-01-14 | 株式会社村田製作所 | Resin multilayer substrate |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000315840A (en) * | 1999-05-06 | 2000-11-14 | Sigma Corp | Flexible printed circuit board |
| WO2014045862A1 (en) * | 2012-09-24 | 2014-03-27 | 株式会社村田製作所 | Flexible multilayer substrate |
| WO2018128082A1 (en) * | 2017-01-05 | 2018-07-12 | 住友電工プリントサーキット株式会社 | Flexible printed wiring board |
-
1984
- 1984-05-21 JP JP7418584U patent/JPS60187551U/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016006829A (en) * | 2014-06-20 | 2016-01-14 | 株式会社村田製作所 | Resin multilayer substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60187551U (en) | 1985-12-12 |
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