JPH0227574Y2 - - Google Patents
Info
- Publication number
- JPH0227574Y2 JPH0227574Y2 JP3405883U JP3405883U JPH0227574Y2 JP H0227574 Y2 JPH0227574 Y2 JP H0227574Y2 JP 3405883 U JP3405883 U JP 3405883U JP 3405883 U JP3405883 U JP 3405883U JP H0227574 Y2 JPH0227574 Y2 JP H0227574Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- substrate
- board
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000005606 hygroscopic expansion Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 24
- 239000000919 ceramic Substances 0.000 description 14
- 238000005476 soldering Methods 0.000 description 13
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、アルミニウム又はセラミツク等を基
板とする印刷配線基板と、銅貼り樹脂積層印刷配
線基板とのハンダ付接続に用いる回路基板接続装
置に関するものである。[Detailed description of the invention] (Field of industrial application) The present invention relates to a circuit board connecting device used for soldering connection between a printed wiring board whose substrate is aluminum or ceramic, and a copper-coated resin laminated printed wiring board. It is something.
（従来例の構成とその問題点）
従来、セラミツク又は金属を基板とする印刷配
線基板と樹脂積層板を基板とする印刷配線基板と
をハンダ付けで接続する場合、その熱膨張係数の
差によるハンダ付部への応力の集中を避ける為、
一般には第１図に示す方法が採られていた。(Conventional structure and its problems) Conventionally, when connecting a printed wiring board made of ceramic or metal and a printed wiring board made of a resin laminate by soldering, soldering occurs due to the difference in their thermal expansion coefficients. To avoid concentration of stress on the attached parts,
Generally, the method shown in Figure 1 was adopted.
第１図ａは従来方法の斜視図、ｂは従来方法の
断面図である。 FIG. 1a is a perspective view of the conventional method, and FIG. 1b is a sectional view of the conventional method.
セラミツク又は金属を基板とする印刷配線基板
１と樹脂積層板を基板とする印刷配線基板２とを
一方の基板１を他方の基板２に垂直になるように
ハンダ付けで接続する場合、一方の基板例えば基
板１にリードフレーム端子３を設け、これらのフ
レーム端子３を他方の基板２に設けた孔にそれぞ
れ挿入し、ハンダ付けにより接続していた。 When a printed wiring board 1 made of ceramic or metal and a printed wiring board 2 made of a resin laminate are connected by soldering so that one board 1 is perpendicular to the other board 2, one board For example, lead frame terminals 3 are provided on a substrate 1, and these frame terminals 3 are inserted into holes provided in the other substrate 2 and connected by soldering.
なお、図中４は基板１の印刷配線電極部、５は
基板２の印刷配線電極部、６はハンダ付部であ
る。 In the figure, 4 is a printed wiring electrode portion of the substrate 1, 5 is a printed wiring electrode portion of the substrate 2, and 6 is a soldering portion.
これは、上記基板１及び２をハンダ付けで直接
接続すると、基板周囲の温度及び湿度の変化によ
り、各々の基板に寸法変化を生じ、その変化量に
相当する歪応力がハンダ付部に加わり、その変化
が繰り返されることによりハンダ付部にクラツク
を生じるなどの問題があつた。また、基板２にリ
ードフレーム端子３を挿入するための孔を設ける
必要があるとともに、孔とリードフレーム端子の
位置合せを行なう必要があり、生産性が低いとい
う問題があつた。 This is because when the boards 1 and 2 are directly connected by soldering, dimensional changes occur in each board due to changes in the temperature and humidity around the boards, and strain stress corresponding to the amount of change is applied to the soldered part. Repeated changes caused problems such as cracks in the soldered parts. Further, it is necessary to provide a hole in the substrate 2 for inserting the lead frame terminal 3, and it is also necessary to align the hole and the lead frame terminal, resulting in a problem of low productivity.
（考案の目的）
本考案は、このような従来の欠点を除去し、熱
膨張係数又は吸湿膨張係数の異なる印刷配線基板
どうしを直接ハンダ付けすることのできる回路基
板接続装置を提供するものである。(Purpose of the invention) The present invention is to provide a circuit board connecting device that can eliminate such conventional drawbacks and directly solder printed wiring boards with different thermal expansion coefficients or hygroscopic expansion coefficients. .
（考案の構成）
本考案は、セラミツク又は金属を基板とする印
刷配線基板（以下セラミツク基板という）と、樹
脂積層板を基板とする印刷配線基板とを互いに垂
直になるように取付けるために、可撓性を有する
印刷配線基板を一方の印刷配線基板に接着固定
し、この一体に固定した２つの印刷配線基板を他
方の印刷配線基板に設けた一つの孔に嵌挿し、可
撓性印刷配線基板の他方の電極と他方の印刷配線
基板の裏面に設けた電極とをハンダ付けすること
により、前記吸湿又は熱膨張係数差からくるハン
ダ付部への歪応力を可撓性印刷配線基板層で緩和
するとともに生産性を向上させるようにしたもの
である。(Structure of the invention) The present invention is a flexible method for mounting a printed wiring board made of ceramic or metal (hereinafter referred to as a ceramic board) and a printed wiring board made of a resin laminate so that they are perpendicular to each other. A flexible printed wiring board is adhesively fixed to one printed wiring board, and the two printed wiring boards fixed together are inserted into a hole provided in the other printed wiring board to form a flexible printed wiring board. By soldering the other electrode and the electrode provided on the back side of the other printed wiring board, the strain stress on the soldered part caused by the moisture absorption or difference in thermal expansion coefficient can be alleviated by the flexible printed wiring board layer. At the same time, it is designed to improve productivity.
（実施例の説明）
第２図は、本考案の一実施例の構造を示すもの
で、ａは斜視図、ｂは断面図、ｃはセラミツク基
板に可撓性印刷配線基板を貼付けた斜視図であ
る。(Description of Embodiment) Fig. 2 shows the structure of an embodiment of the present invention, in which a is a perspective view, b is a sectional view, and c is a perspective view of a flexible printed circuit board attached to a ceramic substrate. It is.
図中、第１図と同一部分には同一符号を付して
あり、また、７は可撓性印刷配線基板、８はセラ
ミツク基板１の印刷配線電極部４と可撓性印刷配
線基板７との間のハンダ付部、９は可撓性印刷配
線基板７と樹脂積層板を基板とする印刷配線基板
２の印刷配線電極部５との間のハンダ付部を示
す。 In the figure, the same parts as in FIG. Reference numeral 9 indicates a soldering portion between the flexible printed wiring board 7 and the printed wiring electrode portion 5 of the printed wiring board 2 whose substrate is a resin laminate.
まず、セラミツク基板１の片面又は両面に厚膜
回路を形成し、同時に基板端部にはハンダ付接続
部となる電極部４を形成する。 First, a thick film circuit is formed on one or both sides of a ceramic substrate 1, and at the same time, an electrode portion 4 that will serve as a soldered connection portion is formed at the end of the substrate.
一方、樹脂積層板を基板とする印刷配線基板２
にはセラミツク基板１が嵌合する一つのスリツト
孔を設け、セラミツク基板１の電極部４に対応す
る間隔でスリツト孔の片側又は両側に電極部を配
置させ、セラミツク基板の電極部４と樹脂積層板
を基板とする印刷配線基板２の電極部５とをハン
ダ付け接続するために、セラミツク基板１の電極
部４に可撓性を有する印刷配線基板の両端の電極
部の片端側８をまずハンダ付けした後、スリツト
孔に垂直になるように嵌合させ、他端側９の電極
部をスリツト孔の片側に設けられた樹脂積層板を
基板とする印刷配線基板の電極部５と基板２の裏
面側でハンダ付け接続するものである。 On the other hand, a printed wiring board 2 whose substrate is a resin laminate
is provided with one slit hole into which the ceramic substrate 1 is fitted, electrode portions are placed on one or both sides of the slit hole at intervals corresponding to the electrode portions 4 of the ceramic substrate 1, and the electrode portions 4 of the ceramic substrate and the resin laminate are arranged. In order to solder and connect the electrode portions 5 of the printed wiring board 2 having a plate as the substrate, one end 8 of the electrode portions at both ends of the flexible printed wiring board is first soldered to the electrode portions 4 of the ceramic substrate 1. After attaching, the electrode part 5 on the other end side 9 is connected to the electrode part 5 of the printed wiring board whose substrate is a resin laminate provided on one side of the slit hole, and the electrode part 9 on the other end side is fitted perpendicularly to the slit hole. It is connected by soldering on the back side.
この場合、第３図に示すように、セラミツク基
板１と可撓性印刷配線基板７とを予め感圧性又は
感熱性の接着剤１０によつて端部を位置合せして
仮に固定した後、前記と同様にハンダ付けするこ
とにより、スリツトへの挿入性や取扱性を改善す
ることが可能である。 In this case, as shown in FIG. 3, after the ceramic substrate 1 and the flexible printed wiring board 7 are temporarily fixed by aligning their ends with a pressure-sensitive or heat-sensitive adhesive 10, By soldering in the same manner as above, it is possible to improve ease of insertion into the slit and ease of handling.
（考案の効果）
以上説明したように、本考案は、熱又は吸湿膨
張係数の異なる印刷配線基板どうしを可撓性を有
する印刷配線基板を介して直接ハンダ付けするこ
とにより容易に歪応力を緩和することができる利
点を有するものである。また、その三つの印刷配
線基板の相互の位置合せ嵌合も容易となり、生産
性も向上させることができる。(Effects of the invention) As explained above, the invention easily relieves strain stress by directly soldering printed wiring boards with different thermal or hygroscopic expansion coefficients through a flexible printed wiring board. It has the advantage of being able to In addition, mutual alignment and fitting of the three printed wiring boards becomes easy, and productivity can also be improved.
第１図は、従来の方法によるセラミツク基板と
樹脂積層板を基板とする印刷配線基板との接続構
造を示す図、第２図は、本考案の一実施例の接続
構造を示す図、第３図は、可撓性印刷配線基板の
取付例の説明図である。
１……セラミツク又は金属を基板とする印刷配
線基板、２……樹脂積層板を基板とする印刷配線
基板、３……リードフレーム端子、４……基板１
の印刷配線電極部、５……基板２の印刷配線電極
部、６，８，９……ハンダ付部、７……可撓性印
刷配線基板、１０……感圧性又は感熱性接着剤。
FIG. 1 is a diagram showing a connection structure between a ceramic substrate and a printed wiring board using a resin laminate as a substrate by a conventional method, FIG. 2 is a diagram showing a connection structure according to an embodiment of the present invention, and FIG. The figure is an explanatory diagram of an example of mounting a flexible printed wiring board. 1...Printed wiring board using ceramic or metal as a substrate, 2...Printed wiring board using resin laminate as a substrate, 3...Lead frame terminal, 4...Substrate 1
5... Printed wiring electrode part of substrate 2, 6, 8, 9... Soldering part, 7... Flexible printed wiring board, 10... Pressure-sensitive or heat-sensitive adhesive.
Claims (1)
第２の印刷配線基板と、この第１及び第２の印刷
配線基板の一方を他方に対して垂直に取付けるた
めの可撓性を有する第３の印刷配線基板とを有す
る回路基板接続装置であつて、 前記第１の印刷配線基板に前記第２、第３の印
刷配線基板を嵌挿するための一つの孔を設け、前
記第３の印刷配線基板を前記第２の印刷配線基板
の端部に重ねるように感熱性又は感圧性の接着剤
によつて仮固定するとともに、前記第３の印刷配
線基板の両端に設けた電極部の一方を前記第２の
印刷配線基板の電極部とハンダ付けし、前記孔の
裏面側周縁に電極を設けた第１の印刷配線基板の
前記孔に前記第２の印刷配線基板と一体に前記第
３の印刷配線基板を嵌挿し、前記第３の印刷配線
基板の他方の電極部と前記第１の印刷配線基板の
電極部とをハンダ付けするように構成したことを
特徴とする回路基板接続装置。[Claims for Utility Model Registration] First and second printed wiring boards having different thermal expansion coefficients or hygroscopic expansion coefficients, and a method for mounting one of the first and second printed wiring boards perpendicularly to the other. A circuit board connecting device having a flexible third printed wiring board, the first printed wiring board having one hole for inserting the second and third printed wiring boards. and temporarily fix the third printed wiring board with a heat-sensitive or pressure-sensitive adhesive so as to overlap the end of the second printed wiring board, and attach the third printed wiring board to both ends of the third printed wiring board. One of the provided electrode parts is soldered to the electrode part of the second printed wiring board, and the second printed wiring board is inserted into the hole of the first printed wiring board in which an electrode is provided on the periphery of the back side of the hole. The third printed wiring board is inserted integrally with the third printed wiring board, and the other electrode part of the third printed wiring board and the electrode part of the first printed wiring board are soldered. Circuit board connection equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3405883U JPS59140466U (en) | 1983-03-11 | 1983-03-11 | circuit board connection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3405883U JPS59140466U (en) | 1983-03-11 | 1983-03-11 | circuit board connection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59140466U JPS59140466U (en) | 1984-09-19 |
| JPH0227574Y2 true JPH0227574Y2 (en) | 1990-07-25 |
Family
ID=30164827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3405883U Granted JPS59140466U (en) | 1983-03-11 | 1983-03-11 | circuit board connection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59140466U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005086658A (en) * | 2003-09-10 | 2005-03-31 | Nippon Dengyo Kosaku Co Ltd | Polarization common use antenna |
| DE102023206591A1 (en) | 2023-07-11 | 2025-01-16 | Robert Bosch Gesellschaft mit beschränkter Haftung | Method for producing an electrically conductive connection |
-
1983
- 1983-03-11 JP JP3405883U patent/JPS59140466U/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005086658A (en) * | 2003-09-10 | 2005-03-31 | Nippon Dengyo Kosaku Co Ltd | Polarization common use antenna |
| DE102023206591A1 (en) | 2023-07-11 | 2025-01-16 | Robert Bosch Gesellschaft mit beschränkter Haftung | Method for producing an electrically conductive connection |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59140466U (en) | 1984-09-19 |
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