JPH0227743A - Wire clamper for wire bonding device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention is used in a wire bonding device that performs wire bonding on semiconductor devices such as ICs and transistors.
The present invention relates to a wire clamper for a wire bonding device used to hold wires.

[Conventional technology]

A conventional wire clamper for a wire bonding apparatus of this type is constructed as shown in FIG.

FIG. 3 is a side view showing a wire clamper in a conventional wire bonding device. In the same figure, 1 is a bonding wire, and 2a and 2b are supports for clamping the wire 1, which are a side holding piece and a movable side holding piece. The side holding piece 2a is attached to the tip of the plate 3, and the movable side holding piece 2b is attached to the tip of the movable member 4. The support plate 3 is made of a flexible material, and its base is fixed to a support base 5. Further, the movable member 4 is rotatably attached to the support stand 5 via a support bin 6, and -
The rotating end portion is connected to a reciprocating rod 7a of a drive device T mounted on the support base 5. That is, the movable member 4 is rotated about the support bin 6 by driving the drive device 7, and the movable side presser piece 2b is moved to the wire 1 by extending the advancing/retracting rod 7a. The wire 1 is often held in such a manner that the wire 1 is pressed against the side holding piece 2a. In this case, the plate 3 is bent in the direction of arrow A in the figure so that the wire 1 is not deformed.

The receiver 8 is a plate spring for urging the tip of the plate 3 toward the wire side, and the base is fixed to the support base 5, and the tip of the receiver corresponds to the side holding piece 2a. It is attached to the back. That is, the plate 3 applies a force to the plate spring 8 and the receiver to clamp the wire 1. Reference numeral 9 denotes a one-end holding stopper plate for preventing the plate 3 from being pushed out toward the wire 1 by the leaf spring 8. The one-end holding stopper plate 9 has its base fixed to the support base 5, and its tip 9a fixed to the receiving plate. is the wire 1 at the swinging end of the plate 3
It is folded so that it touches the side. Reference numeral 10 denotes a clamping force adjustment bolt for increasing or decreasing the elastic force of the leaf spring 8, which is screwed into a press stopper plate 9 at one end, and its tip is brought into contact with the back surface of the leaf spring 8.

The wire clamper configured in this way
To clamp the movable member 4, the drive device 7 first rotates the movable member 4 in the direction of arrow A about the support pin 6 as a fulcrum. Then, the movable side holding piece 2b receives the wire 1 and the side holding piece 21
When the plate 3 and plate spring a of the receiver are brought into pressure contact with each other, the plate 3 and the plate spring a are bent, and the shear wire 1 is thereby clamped. Next, in order to release the wire 1, the movable member 4 may be rotated in the direction of the arrow B by the driving device 7, and at this time, the receiver is attached to the plate 3.
The plate spring 8 is restored, and the press contact state of the side presser piece 2 and the movable side presser piece 2b against the wire 1 is released.

[Problem to be solved by the invention]

However, in the conventional wire clamper configured as described above, when the wire 1 is released, the plate 3 is held at one end with the contact portion with the stopper plate 9 as a fixed point, as shown in FIG. Since vibration occurs in the vibration mode shown in FIG. 5 in such a way that the approximate center of the plate 3 bends in the opposite direction toward the wire 1, the side holding piece 2a and the movable side holding piece 2b of the receiver come into contact, causing the wire 1 to There is also a problem that the loop of the wire bonding part may become unstable due to the wire being damaged or deformed, and vibrations being transmitted to the wire IK.

The present invention has been made in view of the above points, and an object of the present invention is to provide a wire clamper in which vibration of a wire holding member is suppressed when the wire is released from being clamped.

[Rounding method to solve the problem]

The wire clamper for a wire bonding apparatus according to the present invention is configured to suppress vibration of the first wire holding member by being in contact with a portion of the first wire holding member that is closer to the base side than the wire holding portion and facing the second wire holding member. A stopper is provided.

[Effect]

In the present invention, the photographing suppression stopper contacts the first wire pressing member when the first wire pressing member moves, thereby suppressing vibration of the wire pressing member.

〔Example〕

An embodiment of the present invention will be described in detail below with reference to FIGS. 1 and 2.

Fig. 1 is a side view showing a wire clamper for a wire bonding device according to the present invention, and Fig. 2 is a perspective view showing main parts. , and detailed explanation will be omitted here. In these figures, reference numeral 11 is a first holding member, and the receiver is a stopper for suppressing the vibration of the plate 3. The receiver is a stopper for suppressing the vibration of the plate 3.
A one-end holding stopper plate 9 which is in contact with the side and has a tip 9a for preventing the plate 3 from being pushed out in the direction of arrow B.
The receiver is formed of a vibration-suppressing stopper piece that comes into contact with the surface facing the movable member 4 in the approximately central portion of the plate 3 in the longitudinal direction.

In the wire clamper equipped with the vibration suppressing stopper 11 configured as described above, when the movable member 4 is rotated in the direction of arrow B from the state in which the wire 1 is clamped, the receiver is moved to the plate 3.
is stopped at a predetermined position without being pushed out toward the shear wire 1 when the swinging end comes into contact with the tip 9a of the one-end holding stopper 9. At this time, the substantially central portion of the plate 3 in the longitudinal direction of the receiver is vibrated so as to be bent in the opposite direction toward the movable member 4, but the vibration is suppressed because it comes into contact with the vibration-suppressing stopper piece 11.

In addition, in this embodiment, an example is shown in which the vibration suppressing stopper piece 11 is disposed so as to restrain the approximately central portion of the plate 3 in the longitudinal direction, but the present invention is not limited to such a limitation. ,
The supports may be arranged so as to restrain the parts of the plate 3 that efficiently suppress the vibrations, for example, the parts where the amplitude is maximum, and the number of the supports is also arbitrary.

Further, in this embodiment, the vibration suppressing stopper 11 is shown as a stopper piece formed integrally with the one-end holding stopper plate 9, but it may be directly attached to the support base 5, and its shape may be arbitrary.

Moreover, the same effect can be obtained by using any drive device 7 as long as it has a function of rotating the movable member 4, such as a spring, an lenoid, a linear motor, an electrostrictive element, etc.

Furthermore, in this embodiment, vibrations when the wire holding force is released have been described, but the same effects as in the above embodiments can be achieved with respect to vibrations that occur when a large acceleration is applied to the entire wire clamper.

〔Effect of the invention〕

As explained above, according to the present invention, the vibration suppressing stopper is provided in contact with the part of the first wire holding member that is closer to the base side than the wire holding part and faces the second wire holding member. The vibration of the first wire holding member is suppressed by the contact of the first wire holding member with the vibration suppressing stopper. Therefore, it is possible to obtain a high-quality semiconductor device in which the wire is not damaged or deformed, and the loop of the bonding portion is formed in a constant shape.

[Brief explanation of the drawing]

FIG. 1 is a side view showing a wire clamper for a wire bonding device according to the present invention, FIG. 2 is a perspective view showing the main parts, FIG. 3 is a side view showing a wire clamper in a conventional wire bonding device, and FIG. The receiver in the conventional wire clamper is a side view for explaining the operation of the plate, and FIG. 5 is a diagram showing the vibration mode of the receiver in the conventional wire clamper in a state where the plate is vibrated at about 400 Hz. 1.@e-wire, 3. Fist/fist holder is a plate, 411... Movable member, 8... Leaf spring, 11... Stopper for vibration suppression. Figure 1

Claims (1)

[Claims] A first wire that is provided so as to be able to swing freely relative to the wire while the wire holding portion is biased in the wire direction, and whose swinging toward the wire is regulated by a stopper that abuts the swinging end. A wire for a wire bonding apparatus, comprising: a holding member; and a second wire holding member that is provided so as to be able to come into contact with and separate from the wire, and that presses and holds the wire against the wire holding part of the first wire holding member. The clamper is characterized in that it includes a stopper for suppressing vibration of the first wire holding member that is in contact with a portion of the first wire holding member that is closer to the base side than the wire holding portion and faces the second holding member. Wire clamper for wire bonding equipment.