JPH0229545U - - Google Patents
Info
- Publication number
- JPH0229545U JPH0229545U JP1988108654U JP10865488U JPH0229545U JP H0229545 U JPH0229545 U JP H0229545U JP 1988108654 U JP1988108654 U JP 1988108654U JP 10865488 U JP10865488 U JP 10865488U JP H0229545 U JPH0229545 U JP H0229545U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting chip
- emitting diode
- recess
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
第１図Ａはこの考案の一実施例による発光ダイ
オードのチツプ付近の平面図、第１図Ｂは第１図
Ａの線Ｂ―Ｂにおける断面図、第２図Ａはこ
の考案の一実施例による発光ダイオードの平面図
、第２図Ｂは第２図Ａの線Ｂ―Ｂにおける断
面図、第３図Ａ・第３図Ｂ・第３図Ｃは従来の発
光ダイオードの構成を示す断面図である。
１６…ベース電極、１６ａ…凹部、２０…発光
チツプ、３８…Ｐ電極、３８ａ…射出口、４０…
ポリイミド。
Figure 1A is a plan view of the vicinity of the chip of a light emitting diode according to an embodiment of this invention, Figure 1B is a sectional view taken along line BB in Figure 1A, and Figure 2A is an embodiment of this invention. FIG. 2B is a cross-sectional view taken along line BB in FIG. 2A, and FIG. 3A, FIG. 3B, and FIG. 3C are cross-sectional views showing the structure of a conventional light-emitting diode. It is. 16...Base electrode, 16a...Concave portion, 20...Light emitting chip, 38...P electrode, 38a...Ejection port, 40...
Polyimide.
Claims (1)
電極、 を備えた発光ダイオードにおいて、 ベース導体に凹部を形成し、該凹部底面に発光
チツプを固定し、発光チツプの側面部を不透明樹
脂で覆つたことを特徴とする発光ダイオード。 (2) 請求項１の発光ダイオードにおいて、不透
明樹脂がポリイミドであることを特徴とするもの
。[Claims for Utility Model Registration] (1) A light emitting diode comprising a base conductor, a light emitting chip fixed on the base conductor, and an electrode covering the top surface of the light emitting chip leaving a light emitting part, A light emitting diode characterized in that a recess is formed, a light emitting chip is fixed to the bottom of the recess, and a side surface of the light emitting chip is covered with an opaque resin. (2) The light emitting diode according to claim 1, wherein the opaque resin is polyimide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988108654U JPH0229545U (en) | 1988-08-18 | 1988-08-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988108654U JPH0229545U (en) | 1988-08-18 | 1988-08-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0229545U true JPH0229545U (en) | 1990-02-26 |
Family
ID=31344192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988108654U Pending JPH0229545U (en) | 1988-08-18 | 1988-08-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229545U (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4913916A (en) * | 1972-05-18 | 1974-02-06 | ||
| JPS5230846U (en) * | 1975-08-13 | 1977-03-04 | ||
| JPS59112668A (en) * | 1982-12-20 | 1984-06-29 | Fujitsu Ltd | Light emitting diode |
| JPS62174980A (en) * | 1986-01-28 | 1987-07-31 | Mitsubishi Cable Ind Ltd | Light emitting device for optical fiber communication |
| JPS6323377A (en) * | 1986-07-02 | 1988-01-30 | Mitsutoyo Corp | Light emitting diode |
-
1988
- 1988-08-18 JP JP1988108654U patent/JPH0229545U/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4913916A (en) * | 1972-05-18 | 1974-02-06 | ||
| JPS5230846U (en) * | 1975-08-13 | 1977-03-04 | ||
| JPS59112668A (en) * | 1982-12-20 | 1984-06-29 | Fujitsu Ltd | Light emitting diode |
| JPS62174980A (en) * | 1986-01-28 | 1987-07-31 | Mitsubishi Cable Ind Ltd | Light emitting device for optical fiber communication |
| JPS6323377A (en) * | 1986-07-02 | 1988-01-30 | Mitsutoyo Corp | Light emitting diode |