JPH0229545U - - Google Patents

Info

Publication number
JPH0229545U
JPH0229545U JP1988108654U JP10865488U JPH0229545U JP H0229545 U JPH0229545 U JP H0229545U JP 1988108654 U JP1988108654 U JP 1988108654U JP 10865488 U JP10865488 U JP 10865488U JP H0229545 U JPH0229545 U JP H0229545U
Authority
JP
Japan
Prior art keywords
light emitting
emitting chip
emitting diode
recess
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988108654U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988108654U priority Critical patent/JPH0229545U/ja
Publication of JPH0229545U publication Critical patent/JPH0229545U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】
第１図Ａはこの考案の一実施例による発光ダイ
オードのチツプ付近の平面図、第１図Ｂは第１図
Ａの線Ｂ―Ｂにおける断面図、第２図Ａはこ
の考案の一実施例による発光ダイオードの平面図
、第２図Ｂは第２図Ａの線Ｂ―Ｂにおける断
面図、第３図Ａ・第３図Ｂ・第３図Ｃは従来の発
光ダイオードの構成を示す断面図である。 １６…ベース電極、１６ａ…凹部、２０…発光
チツプ、３８…Ｐ電極、３８ａ…射出口、４０…
ポリイミド。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) ベース導体、 ベース導体上に固定された発光チツプ、 光の射出部を残して、発光チツプの上面を覆う
    電極、 を備えた発光ダイオードにおいて、 ベース導体に凹部を形成し、該凹部底面に発光
    チツプを固定し、発光チツプの側面部を不透明樹
    脂で覆つたことを特徴とする発光ダイオード。 (2) 請求項１の発光ダイオードにおいて、不透
    明樹脂がポリイミドであることを特徴とするもの
    。
JP1988108654U 1988-08-18 1988-08-18 Pending JPH0229545U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988108654U JPH0229545U (ja) 1988-08-18 1988-08-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988108654U JPH0229545U (ja) 1988-08-18 1988-08-18

Publications (1)

Publication Number Publication Date
JPH0229545U true JPH0229545U (ja) 1990-02-26

Family

ID=31344192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988108654U Pending JPH0229545U (ja) 1988-08-18 1988-08-18

Country Status (1)

Country Link
JP (1) JPH0229545U (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4913916A (ja) * 1972-05-18 1974-02-06
JPS5230846U (ja) * 1975-08-13 1977-03-04
JPS59112668A (ja) * 1982-12-20 1984-06-29 Fujitsu Ltd 発光ダイオ−ド装置
JPS62174980A (ja) * 1986-01-28 1987-07-31 Mitsubishi Cable Ind Ltd 光フアイバ通信用発光装置
JPS6323377A (ja) * 1986-07-02 1988-01-30 Mitsutoyo Corp 発光ダイオ−ド

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4913916A (ja) * 1972-05-18 1974-02-06
JPS5230846U (ja) * 1975-08-13 1977-03-04
JPS59112668A (ja) * 1982-12-20 1984-06-29 Fujitsu Ltd 発光ダイオ−ド装置
JPS62174980A (ja) * 1986-01-28 1987-07-31 Mitsubishi Cable Ind Ltd 光フアイバ通信用発光装置
JPS6323377A (ja) * 1986-07-02 1988-01-30 Mitsutoyo Corp 発光ダイオ−ド

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