JPH042045U - - Google Patents

Info

Publication number
JPH042045U
JPH042045U JP1990043180U JP4318090U JPH042045U JP H042045 U JPH042045 U JP H042045U JP 1990043180 U JP1990043180 U JP 1990043180U JP 4318090 U JP4318090 U JP 4318090U JP H042045 U JPH042045 U JP H042045U
Authority
JP
Japan
Prior art keywords
main body
sides
plastic
leads
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990043180U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990043180U priority Critical patent/JPH042045U/ja
Publication of JPH042045U publication Critical patent/JPH042045U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す斜視図、第2
図は第1図の側面図である。 1……IC本体部、1a……IC本体部上面、
2……リード、2a……リード根元部、2b……
リード先端、2c……リード最先端、3……プラ
スチツク突起部、3a……プラスチツク突起部上
面、3b……プラスチツク突起部下面、4……リ
ード基板接触面、5……リード先端部。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a side view of FIG. 1. 1... IC main body part, 1a... IC main body part upper surface,
2...Lead, 2a...Lead base, 2b...
Lead tip, 2c...Lead tip, 3...Plastic protrusion, 3a...Plastic protrusion top surface, 3b...Plastic protrusion bottom surface, 4...Lead substrate contact surface, 5...Lead tip.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ICチツプをプラスチツクにて成形したIC本
体部と、IC本体部の両側から横方向に張り出し
た複数のリードと、IC本体部からリード突出方
向に沿つて張り出し各リードをその両側から覆う
プラスチツク突起部とを有することを特徴とする
スモール・アウトライン・パツケージ。
An IC main body made of an IC chip molded from plastic, a plurality of leads extending laterally from both sides of the IC main body, and a plastic protrusion extending from the IC main body in the direction in which the leads project and covering each lead from both sides. A small outline package characterized by having.
JP1990043180U 1990-04-23 1990-04-23 Pending JPH042045U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990043180U JPH042045U (en) 1990-04-23 1990-04-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990043180U JPH042045U (en) 1990-04-23 1990-04-23

Publications (1)

Publication Number Publication Date
JPH042045U true JPH042045U (en) 1992-01-09

Family

ID=31555377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990043180U Pending JPH042045U (en) 1990-04-23 1990-04-23

Country Status (1)

Country Link
JP (1) JPH042045U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4971341A (en) * 1972-11-15 1974-07-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4971341A (en) * 1972-11-15 1974-07-10

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