JPH02299288A - Mounting of solder ball - Google Patents
Mounting of solder ballInfo
- Publication number
- JPH02299288A JPH02299288A JP1119905A JP11990589A JPH02299288A JP H02299288 A JPH02299288 A JP H02299288A JP 1119905 A JP1119905 A JP 1119905A JP 11990589 A JP11990589 A JP 11990589A JP H02299288 A JPH02299288 A JP H02299288A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder ball
- pin
- flux
- ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
- H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
- H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概要〕
ハンダバンプ等の形成に際し、所定部にハンダボールを
搭載するための方法に関し、
特に、小さくて多数のハンダボールをその所定部に搭載
させる作業性の向上を目的とし、ハンダボールの被搭載
部にハンダフラックスを塗布し、
ハンダボール付着用のピンおよび該ハンダボールの少な
（とも一方に静電気を帯びせしめ、該静電気の引力によ
って該ピンの先端に該ハンダボールを付着せしめ、
該ピンの先端に吸着された該ハンダボールを該被搭載部
のハンダフラックスに押し付け、しかるのち、該被搭載
部と該ピンとを離間させることを特徴とし構成する。[Detailed Description of the Invention] [Summary] This invention relates to a method for mounting solder balls on a predetermined portion when forming solder bumps, etc., and particularly aims to improve workability in mounting a large number of small solder balls on the predetermined portion. Then, apply solder flux to the part where the solder ball is mounted, and apply static electricity to both the pin for attaching the solder ball and the solder ball (one side), and the attraction of the static electricity causes the solder ball to be attached to the tip of the pin. The solder ball attached to the tip of the pin is pressed against the solder flux of the mounted part, and then the mounted part and the pin are separated.
本発明はハンダボールを所定部に搭載せしめるための方
法、特に回路基板の上面にハンダバンプを形成させるた
め該基板の複数の各所定部にハンダボールを搭載する新
規方法に関する。The present invention relates to a method for mounting solder balls on predetermined portions, and more particularly to a novel method for mounting solder balls on a plurality of predetermined portions of a circuit board in order to form solder bumps on the upper surface of the circuit board.
回路基板の表面に回路素子を搭載するため等のハンダバ
ンプの形成には、広くハンダボールが利用される。ハン
ダフラックスの塗布された回路基板の所定部にハンダボ
ールを搭載するには、該所定部に対応するハンダボール
吸着部を設けたキャリアを利用する方法および、該所定
部と対向するハンダボール嵌合用の透孔をあけたマスク
を利用する方法が公知であり、広く利用されている。Solder balls are widely used to form solder bumps for mounting circuit elements on the surface of a circuit board. In order to mount a solder ball on a predetermined part of a circuit board coated with solder flux, there is a method of using a carrier provided with a solder ball suction part corresponding to the predetermined part, and a method for fitting a solder ball opposite to the predetermined part. A method using a mask with through holes is well known and widely used.
第２図はハンダボールキャリアを利用した従来のハンダ
バンプ形成方法を説明するための図、第３図はマスクを
利用した従来のハンダバンプ形成方法を説明するための
図である。FIG. 2 is a diagram for explaining a conventional method of forming solder bumps using a solder ball carrier, and FIG. 3 is a diagram for explaining a conventional method of forming solder bumps using a mask.
第２図において、上面にハンダバンプを形成させる回路
基板１の所定部には導体層（ハンダボールの被搭載部）
２を形成し、それらの上にフラックス３を塗布する。回
路基板ｌの設置位置と多数のハンダボール４を収容した
容器（図示せず）との間を移動するキャリヤ５は、各導
体層２に対向しハンダボール４より小径の吸気孔６が空
洞７に連通ずる。In FIG. 2, a conductor layer (a portion on which solder balls are mounted) is provided at a predetermined portion of the circuit board 1 on which solder bumps are to be formed on the upper surface.
2 and apply flux 3 on them. A carrier 5, which moves between the installation position of the circuit board l and a container (not shown) containing a large number of solder balls 4, is arranged so that an intake hole 6 having a smaller diameter than the solder balls 4 faces each conductor layer 2 and has a cavity 7. It will be communicated to.
図示しない真空装置に接続し、該装置の駆動によって空
洞７内の空気が吸引されたとき吸気孔６の各先端にはハ
ンダボール４を吸着し、このように吸着されたハンダボ
ール４は、キャリヤ５の移動および該真空装置の動作に
よって回路基板１の導体層２に搭載され、ハンダフラッ
クス３の粘着力によって保持されるようになる。It is connected to a vacuum device (not shown), and when the air in the cavity 7 is sucked by the drive of the device, the solder balls 4 are attracted to each tip of the intake hole 6, and the solder balls 4 thus attracted are transferred to the carrier. 5 and the operation of the vacuum device, it is mounted on the conductor layer 2 of the circuit board 1 and is held by the adhesive force of the solder flux 3.
そこで、回路基板１を加熱し搭載されたハンダボール４
を溶融させると、回路基板１の導体層２の上にハンダバ
ンプが形成されるようになる。Therefore, the solder balls 4 mounted on the circuit board 1 are heated.
When melted, solder bumps are formed on the conductor layer 2 of the circuit board 1.
第３図において、上面にハンダバンプを形成させる回路
基板ｌの所定部には導体層２を形成し、それらの上にフ
ラックス３を塗布したのち、その上にマスク８を重ねる
。マスク８には、導体層２と対向し１個のハンダボール
４が嵌合可能な透孔９が設けられており、マスク８の上
に多数のハンダボール４を載せると、各透孔９にはハン
ダボール４が嵌合するようになる。In FIG. 3, a conductor layer 2 is formed on a predetermined portion of a circuit board 1 on which solder bumps are to be formed, a flux 3 is applied thereon, and a mask 8 is placed thereon. The mask 8 is provided with a through hole 9 that faces the conductor layer 2 and into which one solder ball 4 can fit. The solder balls 4 will fit together.
そこで、マスク８上の不要ハンダボール４を除去したの
ち、マスク８と共に回路基板１を加熱すると、透孔９に
嵌合するハンダボール４が溶融し、回路基板ｌの導体層
２の上にハンダバンプが形成されるようになる。Therefore, after removing unnecessary solder balls 4 on the mask 8, when the circuit board 1 is heated together with the mask 8, the solder balls 4 that fit into the through holes 9 are melted, and solder bumps are formed on the conductor layer 2 of the circuit board l. begins to form.
以上説明したように、ハンダボールキャリヤ５を使用し
た従来のハンダバンブ形成方法は、ハンダボール４より
小径の吸気孔６の開口端に、ハンダボール４を吸気力で
保持せしめて搬送し、吸気力を解除してハンダボール４
をハンダフラックス３に搭載させるが、軟質のハンダボ
ール４が吸気孔６の開口端に食いつき、吸気力を解除す
るも離れないことがあるという問題点があった。As explained above, in the conventional solder bump forming method using the solder ball carrier 5, the solder ball 4 is held and transported by suction force to the open end of the suction hole 6, which has a smaller diameter than the solder ball 4. Release and solder ball 4
is mounted on the solder flux 3, but there is a problem in that the soft solder ball 4 bites into the open end of the intake hole 6 and may not be released even if the intake force is released.
また、マスク８を利用する従来のハンダバンプ形成方法
は、単に置くだけで搭載されたハンダボール４が移動し
ないようにするため、ハンダボール４の加熱溶融に際し
マスク８も一緒に加熱する必要があり、ハンダフラック
ス３が付着するマスク８は頻繁に洗浄しなければならな
いという問題点があった。Further, in the conventional solder bump forming method using the mask 8, in order to prevent the mounted solder balls 4 from moving by simply placing them, the mask 8 must be heated together when the solder balls 4 are heated and melted. There was a problem in that the mask 8 to which the solder flux 3 adhered had to be cleaned frequently.
上記問題点の除去を目的とした本発明は第１図の実施例
によれば、ハンダボール４の被搭載部２にハンダフラッ
クス３を塗布し、
ハンダボール付着用のピン１２およびハンダボール４の
少なくとも一方に静電気を帯びせしめ、該静電気の引力
によってピン１２の先端にハンダボール４を付着せしめ
、
ピン１２の先端に吸着されたハンダボール４を被搭載部
２のハンダフラックス３に押し付け、しかるのち、被搭
載部２とピン１２とを離間させることを特徴とする。According to the embodiment shown in FIG. 1, the present invention aims to eliminate the above-mentioned problems. Solder flux 3 is applied to the mounting portion 2 of the solder ball 4, and the pin 12 for attaching the solder ball and the solder ball 4 are At least one side is charged with static electricity, the solder ball 4 is attached to the tip of the pin 12 by the attractive force of the static electricity, the solder ball 4 attracted to the tip of the pin 12 is pressed against the solder flux 3 of the mounting part 2, and then , the mounted portion 2 and the pin 12 are separated from each other.
一般に、ハンダバンプ形成用のハンダボールは直径が０
．１５〜０．４ ｍｍ程度１重さ１〜２ Ｘ １０−”
ｍｇ程度であり、かかるハンダボールおよびハンダボー
ル付着用のピンは軽微な摩擦によって静電気を帯びるよ
うになり、かかる静電気の引力はハンダボールをピンに
付着させるのに十分であると共に、通常の粘性を有する
ハンダフラックスとハンダボールとの粘着力より弱くな
る。Generally, solder balls for forming solder bumps have a diameter of 0.
．． Approximately 15-0.4 mm 1 weight 1-2 x 10-”
The solder ball and the pin for attaching the solder ball become charged with static electricity due to slight friction, and the attractive force of the static electricity is sufficient to attach the solder ball to the pin, and at the same time, the solder ball and the pin for attaching the solder ball become charged with static electricity. The adhesive force between the solder flux and the solder ball is weaker than the adhesive force between the solder flux and the solder ball.
上記手段は、前記静電引力してハンダフラックスにハン
ダボールを搭載すると共に、前記粘着力を利用しハンダ
フラックスにハンダボールを保持せしめたものである。The above means uses the electrostatic attraction to mount the solder ball on the solder flux, and uses the adhesive force to hold the solder ball on the solder flux.
以下に、図面を用いて本発明によるハンダボールの搭載
方法を説明する。The solder ball mounting method according to the present invention will be described below with reference to the drawings.
第１図は本発明方法の一実施例に係わる主要工程の説明
図である。FIG. 1 is an explanatory diagram of the main steps related to one embodiment of the method of the present invention.
第１図（イ）において、回路基板１の上面の所定１＼ソ
タ１
部に惨毎タバンプ形成用の導体層（ハンダボールの被搭
載部）２を形成した。のち、それらの上に通常の一着性
を有するハンダフラックス３を塗布する。In FIG. 1(a), a conductor layer 2 for forming solder bumps (a portion on which solder balls are mounted) is formed on a predetermined portion of the upper surface of a circuit board 1. Afterwards, a solder flux 3 having normal adhesion properties is applied thereon.
次いで、第１図（ロ）に示す如く多数のハンダボール４
を収容した絶縁性の容器１１を揺動させハンダボール４
に静電気を帯びさせるまたは、第１図（ハ）に示す如く
導体層２に対向する金属のピン１２を絶縁基板１３に植
設しピン１２の先端を牛皮１４等で擦りピン１２に静電
気を帯びさせる。Next, as shown in FIG. 1(b), a large number of solder balls 4 are
The insulating container 11 containing the solder balls 4 is
Alternatively, as shown in FIG. 1(C), a metal pin 12 facing the conductor layer 2 is implanted in an insulating substrate 13, and the tip of the pin 12 is rubbed with a cowhide 14 or the like to charge the pin 12 with static electricity. let
しかるのち、第１図（＝）に示すように、ピン１２を容
器１１内に挿入させると各ピン１２の先端にはハンダボ
ール４が、静電引力によって付着するようになる。Thereafter, as shown in FIG. 1 (=), when the pins 12 are inserted into the container 11, the solder balls 4 are attached to the tips of each pin 12 by electrostatic attraction.
そこで、例えばピン１２を移動させ第１図（ネ）に示す
ように、ハンダボール４をハンダフラックス３に押し付
けたのち、第１図（へ）に示すようにピン１２を引き上
げると、ハンダボール４はハンダフラックス３の粘着力
によって保持されるようになる。Therefore, for example, by moving the pin 12 and pressing the solder ball 4 against the solder flux 3 as shown in FIG. 1(N), and then pulling up the pin 12 as shown in FIG. is held by the adhesive force of the solder flux 3.
以上説明したように本発明によれば、簡単な操作によっ
てハンダボール付着用ビンの先端にノ＼ンダボールを付
着させることおよび、ノ１ンダフラ・ンクスを塗布した
所定部に保持させることが可能であり、キャリアを利用
する従来技術において生じたハンダボールの離れ難さお
よび、マスクを利用した従来技術において頻繁にマスク
を洗浄しなければならない等の問題点を解決し、ハンダ
ボールの搭載を容易卒らしめた効果がある。As explained above, according to the present invention, it is possible to attach a solder ball to the tip of a solder ball attachment bottle and to hold it in a predetermined part coated with a solder ball bottle by a simple operation. This solves problems such as the difficulty in separating solder balls that occurred in conventional technology that uses a carrier, and the need to frequently clean the mask in conventional technology that uses masks, and makes it easy to remove solder balls. It has a tightening effect.
第１図は本発明方法の一実施例の主要工程説明図、
第２図はハンダボールキャリアを利用した従来のハンダ
バンブ形成方法の説明図、
第３図はマスクを利用した従来のノλンダｉ＜ンプ形成
方法の説明図、
である。
図中において、
２は被搭載部（導体層）、
３はハンダフラックス、
４はハンダボール、
１２はハンダボール付着用のピン、
を示す。
本発明方法の一実施例の主要工程説明図第１図（：ｆの
１）
第 ｆ 図（千の２）
へンダボ→し〜リアを利用しＴこ従来のハンタハンブｆ
ネ成力°Ｓ去力５屯１月記
第 ２ 図Fig. 1 is an explanatory diagram of the main steps of an embodiment of the method of the present invention, Fig. 2 is an explanatory diagram of a conventional solder bump forming method using a solder ball carrier, and Fig. 3 is an explanatory diagram of a conventional solder bump forming method using a mask. <Explanatory diagram of the pump forming method. In the figure, 2 is a mounted part (conductor layer), 3 is a solder flux, 4 is a solder ball, and 12 is a pin for attaching a solder ball. Main process explanatory diagram of an embodiment of the method of the present invention Fig. 1 (:f 1) Fig.
Figure 2 of the 5th ton of January
Claims (1)
ス（３）を塗布し、 ハンダボール付着用のピン（１２）および該ハンダボー
ル（４）の少なくとも一方に静電気を帯びせしめ、 該静電気の引力によって該ピン（１２）の先端に該ハン
ダボール（４）を付着せしめ、 該ピン（１２）の先端に吸着された該ハンダボール（４
）を該被搭載部（２）のハンダフラックス（３）に押し
付け、 しかるのち、該被搭載部（２）と該ピン（１２）とを離
間させることを特徴とするハンダボールの搭載方法。[Claims] Solder flux (3) is applied to the mounting portion (2) of the solder ball (4), and static electricity is applied to at least one of the solder ball attachment pin (12) and the solder ball (4). The solder ball (4) is attached to the tip of the pin (12) by the attractive force of the static electricity, and the solder ball (4) adsorbed to the tip of the pin (12) is attached to the tip of the pin (12).
) on the solder flux (3) of the mounting portion (2), and then separating the mounting portion (2) and the pin (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1119905A JPH02299288A (en) | 1989-05-12 | 1989-05-12 | Mounting of solder ball |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1119905A JPH02299288A (en) | 1989-05-12 | 1989-05-12 | Mounting of solder ball |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02299288A true JPH02299288A (en) | 1990-12-11 |
Family
ID=14773110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1119905A Pending JPH02299288A (en) | 1989-05-12 | 1989-05-12 | Mounting of solder ball |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02299288A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH042139A (en) * | 1990-04-18 | 1992-01-07 | Ibiden Co Ltd | Solder supply plate |
| WO1998009332A1 (en) * | 1996-08-27 | 1998-03-05 | Nippon Steel Corporation | Semiconductor device provided with low melting point metal bumps and process for producing same |
| KR19980085415A (en) * | 1997-05-29 | 1998-12-05 | 윤종용 | Flux applicator with pin pressing plate with elastic force |
| CN112916976A (en) * | 2021-01-21 | 2021-06-08 | 杭州海康微影传感科技有限公司 | Transfer method and transfer system for preformed solder |
-
1989
- 1989-05-12 JP JP1119905A patent/JPH02299288A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH042139A (en) * | 1990-04-18 | 1992-01-07 | Ibiden Co Ltd | Solder supply plate |
| WO1998009332A1 (en) * | 1996-08-27 | 1998-03-05 | Nippon Steel Corporation | Semiconductor device provided with low melting point metal bumps and process for producing same |
| US7045388B2 (en) | 1996-08-27 | 2006-05-16 | Nippon Steel Corporation | Semiconductor device provided with low melting point metal bumps |
| US7045389B1 (en) | 1996-08-27 | 2006-05-16 | Nippon Steel Corporation | Method for fabricating a semiconductor devices provided with low melting point metal bumps |
| EP1918991A3 (en) * | 1996-08-27 | 2011-02-16 | Nippon Steel Corporation | Semiconductor device provided with low melting point metal bumps and process for producing same |
| KR19980085415A (en) * | 1997-05-29 | 1998-12-05 | 윤종용 | Flux applicator with pin pressing plate with elastic force |
| CN112916976A (en) * | 2021-01-21 | 2021-06-08 | 杭州海康微影传感科技有限公司 | Transfer method and transfer system for preformed solder |
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