JPH02302060A - Semiconductor device - Google Patents

Abstract

PURPOSE:To increase a mechanical strength of a cap by a method wherein protruding parts which widen an interval between outer circumferences of a light-transmitting window and long sides of the cap are formed at the two long sides of the cap. CONSTITUTION:A semiconductor chip such as an EPROM is mounted on a base 4 where outer leads 5 have been formed; a cap 1 provided with a light- transmitting window 2 is sealed airtightly with a sealing glass 3. Rounded protruding parts 6 are formed at long sides of the cap 1; an interval l1 between the light-transmitting window 2 and the long sides of the cap 1 is made large. Thereby, a mechanical strength of the cap 1 is increased. In addition, an interval l2 may be increased by forming an angular protruding part 7.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and more particularly to a semiconductor device having a light-transmitting window.

[Conventional technology]

FIG. 3 is a perspective view of an example of a conventional semiconductor device having a light-transmitting window.

A semiconductor chip such as an EPROM is mounted on a base 4 provided with external leads 5, and a cap 1 having a light transmission window 2 is hermetically sealed with a sealing glass 3.

As the scale of integrated circuits increases and semiconductor chips also become larger, the light transmission window 2 also becomes larger.

[Problem to be solved by the invention]

As mentioned above, when the light transmission window 2 becomes larger, the light transmission window 2 becomes larger.
The distance β3 between the outer periphery of the cap 1 and the long side of the cap 1 becomes smaller,
This has the disadvantage that the mechanical strength of the cap is weakened.

[Means to solve the problem]

The present invention provides a semiconductor device equipped with a rectangular cap having a light-transmitting window, in which a convex portion is provided on two long sides of the cap to widen the distance between the outer periphery of the light-transmitting window and the long side of the cap. It is characterized by having been established.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a first embodiment of the invention.

In this embodiment, a rounded convex portion 6 is formed on the long side of the cap 1.
, and the distance ρ1 between the light-transmitting window 2 and the long side of the cap 1 is increased. This provides the effect of increasing the mechanical strength of the cap 1.

FIG. 2 is a perspective view of a second embodiment of the invention.

In this embodiment, rectangular convex portions 7 are provided with an interval of 1
2 is increased.

〔Effect of the invention〕

As explained above, the present invention provides a rounded convex part or a square convex part in a part of the cap to increase the distance between the outer periphery of the light transmission window and the long side of the cap, thereby increasing the mechanical strength of the cap. It has the effect of increasing

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a first embodiment of the present invention, FIG. 2 is a perspective view of a second embodiment of the present invention, and FIG. 3 is a conventional semiconductor device having a light-transmitting window. It is a perspective view of an example.

DESCRIPTION OF SYMBOLS 1... Cap, 2... Light transmission window, 3... Sealing glass, 4... Base, 5... External lead, 6.7.
...Protrusion.

Claims (1)

[Claims] In a semiconductor device equipped with a rectangular cap having a light-transmitting window, a convex portion is provided on two long sides of the cap to widen the distance between the outer periphery of the light-transmitting window and the long side of the cap. Characteristic semiconductor devices.