JPH02307235A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPH02307235A
JPH02307235A JP1129317A JP12931789A JPH02307235A JP H02307235 A JPH02307235 A JP H02307235A JP 1129317 A JP1129317 A JP 1129317A JP 12931789 A JP12931789 A JP 12931789A JP H02307235 A JPH02307235 A JP H02307235A
Authority
JP
Japan
Prior art keywords
wire bonding
wire
electrode
bonding method
confirming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1129317A
Other languages
Japanese (ja)
Inventor
Seizo Omae
大前　誠蔵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1129317A priority Critical patent/JPH02307235A/en
Publication of JPH02307235A publication Critical patent/JPH02307235A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To enhance a wire bonding strength, to prevent a short-circuit between two electrodes, and to enhance reliability in the wire bonding by previously removing a conductive part on a wire bonding face to form a fine pattern for confirming the wire bonding position. CONSTITUTION:In a wire bonding method for connecting a wire 3 to a surface to be wire bonded, a conductive part is previously removed on the surface to be wire bonded to form a fine pattern 11 for confirming a wire bonding position. For example, a circular conductive part is previously removed at an inner lead and the surface to be wire bonded of an electrode 2 to form the pattern 11 for confirming the wire bonding position. Further, two patterns 12, 13 made of the same material as that of the electrode 2 are formed in X-, Y-directions of the patterns, and the wire bonding position of the wire 3 is confirmed after wire bonding.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 ・本発明は、半導体製造プロセスで使用するワイヤボン
ディング方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] - The present invention relates to a wire bonding method used in a semiconductor manufacturing process.

〔従来の技術〕[Conventional technology]

従来、この種のワイヤボンディング方法としては種々色
々なものが知られており、この中には例えば次に示すよ
うなものがある。これを第４図および第５図を用いて説
明すると、予めリードフレーム（図示せず）上に接合さ
れた半導体チップ１の電極（ワイヤボンディング面）２
に例えばＡ１等の金属細線からなるワイヤ３の一端部（
ボール部）を接続すると共に、他端部をリードフレーム
（図示せず）のインナーリード（図示せず）に接続する
のもである。なお、図中符号４は前記ワイヤ３のボール
部である。Conventionally, various wire bonding methods of this type have been known, including the following methods, for example. To explain this using FIGS. 4 and 5, the electrode (wire bonding surface) 2 of the semiconductor chip 1 is bonded in advance to a lead frame (not shown).
For example, one end of the wire 3 made of a thin metal wire such as A1 (
The other end is connected to the inner lead (not shown) of the lead frame (not shown). Note that the reference numeral 4 in the figure is a ball portion of the wire 3.

ところで、この種のワイヤボンディング方法における電
極の位置検出は、ＩＴＶカメ元画像処理回路および画像
処理ソフトウェア等によるパターン認識によって自動的
に行われる。そして、予めオペレータによって指示され
た電極２のワイヤボンディング点とインナーリード（図
示せず）上のワイヤボンディング点に順次ワイヤ３が接
続される。By the way, electrode position detection in this type of wire bonding method is automatically performed by pattern recognition using an ITV camera source image processing circuit and image processing software. Then, the wire 3 is sequentially connected to the wire bonding point of the electrode 2 and the wire bonding point on the inner lead (not shown), which have been instructed in advance by the operator.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

ところで、従来のワイヤボンディング方法においては、
オペレータによってワイヤボンディング　　一点を指示
するものであるため、ワイヤボンディング時に最適なワ
イヤボンディング点からずれてワイヤ３が接続されてし
まうことがあった。この結果、ワイヤボンディング面に
対するワイヤ３の接合面積が狭くなり、その接続強度が
低下し、最悪の場合には半導体チップ（図示せず）上の
電極２間が短絡してしまい、ワイヤボンディング上の信
頼性が低下するという問題があった。By the way, in the conventional wire bonding method,
Since the operator specifies a single wire bonding point, the wire 3 may be connected at a position deviated from the optimum wire bonding point during wire bonding. As a result, the bonding area of the wire 3 to the wire bonding surface becomes narrower, the connection strength decreases, and in the worst case, a short circuit occurs between the electrodes 2 on the semiconductor chip (not shown), and There was a problem that reliability decreased.

本発明はこのような事情に鑑みてなされたもので、ワイ
ヤボンディング強度を高めることができると共に、２電
極間の短絡発生を防止することができ、もってワイヤボ
ンディング上の信頼性を高めることができるワイヤボン
ディング方法を提供するものである。The present invention has been made in view of the above circumstances, and it is possible to increase the wire bonding strength and prevent the occurrence of short circuit between two electrodes, thereby increasing the reliability of wire bonding. A wire bonding method is provided.

〔課題を解決するための手段〕[Means to solve the problem]

本発明に係るワイヤボンディング方法は、ワイヤボンデ
ィング面にワイヤを接続する方法であって、予めワイヤ
ボンディング面に導電部を除去することによりワイヤボ
ンディング位置確認用の微小パターンを形成するもので
ある。The wire bonding method according to the present invention is a method of connecting a wire to a wire bonding surface, and is a method in which a conductive portion is removed from the wire bonding surface in advance to form a minute pattern for confirming the wire bonding position.

〔作　用〕 本発明においては、ワイヤボンディング時にパターン周
囲の最適ワイヤボンディング面にワイヤを確実に接続す
ることができる。[Function] In the present invention, the wire can be reliably connected to the optimum wire bonding surface around the pattern during wire bonding.

〔実施例〕〔Example〕

以下、本発明の構成等を図に示す実施例によって詳細に
説明する。EMBODIMENT OF THE INVENTION Hereinafter, the structure etc. of this invention will be explained in detail by the Example shown in the figure.

第１図は本発明に係るワイヤボンディング方法を説明す
るための平面図で、同図以下において第４図および第５
図と同一の部材について同一の符号を付す。FIG. 1 is a plan view for explaining the wire bonding method according to the present invention.
The same members as in the figure are given the same reference numerals.

本発明は、ワイヤボンディング面にワイヤ３を接続する
ワイヤボンディング方法であって、予めインナーリード
（図示せず）および電極２のワイヤボンディング面に円
形状の導電部を除去することによりワイヤボンディング
位置確認用の微小パターン１１を形成する。The present invention is a wire bonding method for connecting a wire 3 to a wire bonding surface, and the wire bonding position is confirmed by removing a circular conductive part from the wire bonding surface of an inner lead (not shown) and an electrode 2 in advance. A micropattern 11 is formed.

したがって、本実施例においては、ワイヤボンディング
時に微小パターン１１の周囲の最適ワイヤボンディング
面にワイヤ３を確実に接続することができるから、ワイ
ヤボンディング面に対するワイヤ３の接続面積を広くす
ることができ、その接続強度を高めることができると共
に、２つの電極２間の短絡発生を防止することができる
。Therefore, in this embodiment, since the wire 3 can be reliably connected to the optimal wire bonding surface around the micropattern 11 during wire bonding, the connection area of the wire 3 to the wire bonding surface can be increased. The strength of the connection can be increased, and short circuits between the two electrodes 2 can be prevented.

なお、本実施例においては、最適なワイヤボンディング
位置にワイヤ３を接続するための微小パターン１１を形
成したが、この細筆２図および第３図に示すように電極
２の材料と同一の材料からなる２つのパターン１２．１
３を各々パターン１１のＸ。In this example, the micropattern 11 for connecting the wire 3 to the optimal wire bonding position was formed, but as shown in FIGS. 2 and 3, it was made of the same material as the electrode 2. Two patterns 12.1
3 each with an X in pattern 11.

Ｙ方向（Ｘ方向とＹ方向は互いに直角な方向）に形成し
てワイヤボンディング後にワイヤ３のワイヤボンディン
グ位置を確認することができる。すなわち、パターン１
２．１３を通過するＸ軸とＹ軸の交点にワイヤボンディ
ング位置があることを確認することができるのである。The wire bonding position of the wire 3 can be confirmed after wire bonding by forming the wire in the Y direction (the X direction and the Y direction are directions perpendicular to each other). That is, pattern 1
It can be confirmed that the wire bonding position is located at the intersection of the X-axis and Y-axis passing through 2.13.

また、本実施例においては、電極２の個数が二個である
場合を示したが、本発明は例えば三個。Further, in this embodiment, the case where the number of electrodes 2 is two is shown, but in the present invention, the number of electrodes 2 is three, for example.

四個、・・・とじてもよく、その個数は適宜変更するこ
とができる。Four pieces... may be closed, and the number can be changed as appropriate.

さらに、本発明における電極２の形状は、前述した実施
例に限定されるものでないことは勿論である。Furthermore, it goes without saying that the shape of the electrode 2 in the present invention is not limited to the embodiment described above.

因に、本発明におけるワイヤボンディング方法における
電極の位置検出は、従来と同様にして実施される。すな
わち、ＩＴシカメラ１画像処理回路および画像処理ソフ
トウェア等によるパターン認識によって自動的に行われ
るのである。Incidentally, the electrode position detection in the wire bonding method of the present invention is performed in the same manner as in the conventional method. That is, it is automatically performed by pattern recognition using the image processing circuit of the IT camera 1 and image processing software.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明によれば、ワイヤボンディン
グ面にワイヤを接続する方法であって、予めワイヤボン
ディング面に導電部を除去することによりワイヤボンデ
ィング位置確認用の微小パターンを形成するので、ワイ
ヤボンディング時にパターン周囲の最適ワイヤボンディ
ング面にワイヤを確実に接続することができる。したが
って、ワイヤボンディング面に対するワイヤ３の接続面
積を広くすることができるから、その接続強度を高める
ことができると共に、２つの電極２間の短絡発生を防止
することができ、ワイヤボンディング上の信頼性を高め
ることができる。As explained above, according to the present invention, there is a method for connecting a wire to a wire bonding surface, in which a conductive part is removed from the wire bonding surface in advance to form a minute pattern for confirming the wire bonding position. Wires can be reliably connected to the optimal wire bonding surface around the pattern during bonding. Therefore, since the connection area of the wire 3 to the wire bonding surface can be increased, the connection strength can be increased, and the occurrence of short circuit between the two electrodes 2 can be prevented, which improves the reliability of wire bonding. can be increased.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明に係るワイヤボンディング方法を説明す
るための平面図、第２図および第３図は同じく本発明に
おけるワイヤボンディング方法の使用例を示す平面図、
第４図および第５図は従来のワイヤボンディング方法を
説明するための平面図である。 ２・・・・電極、３・・・・ワイヤ、１１・・・・微小
パターン。 代　理　人　大岩増雄 第１　因 ２、窒イＬ ３；ワイヤ １１−￥ＣＸ＋小ハ０７−ン 第２　囚FIG. 1 is a plan view for explaining the wire bonding method according to the present invention, FIGS. 2 and 3 are plan views showing an example of use of the wire bonding method according to the present invention,
FIGS. 4 and 5 are plan views for explaining the conventional wire bonding method. 2...Electrode, 3...Wire, 11...Minute pattern. Agent Masuo Oiwa 1st Case 2, Nitai L 3; Wire 11-\CX + Small Han 07-n 2nd Prisoner

Claims (1)

【特許請求の範囲】[Claims] ワイヤボンディング面にワイヤを接続するワイヤボンデ
ィング方法であって、予め前記ワイヤボンディング面に
導電部を除去することによりワイヤボンディング位置確
認用の微小パターンを形成することを特徴とするワイヤ
ボンディング方法。1. A wire bonding method for connecting a wire to a wire bonding surface, the wire bonding method comprising forming a minute pattern for confirming the wire bonding position by removing a conductive portion from the wire bonding surface in advance.
JP1129317A 1989-05-23 1989-05-23 Wire bonding method Pending JPH02307235A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1129317A JPH02307235A (en) 1989-05-23 1989-05-23 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1129317A JPH02307235A (en) 1989-05-23 1989-05-23 Wire bonding method

Publications (1)

Publication Number Publication Date
JPH02307235A true JPH02307235A (en) 1990-12-20

Family

ID=15006589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1129317A Pending JPH02307235A (en) 1989-05-23 1989-05-23 Wire bonding method

Country Status (1)

Country Link
JP (1) JPH02307235A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0436237U (en) * 1990-07-23 1992-03-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0436237U (en) * 1990-07-23 1992-03-26

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